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    • 4. 发明公开
    • 유전율이 매우 낮은 간층 유전체를 위한 나노 다공성중합체 필름
    • 用于具有非常低介电常数的中间层电介质的纳米聚合物膜
    • KR1020000035596A
    • 2000-06-26
    • KR1019990051635
    • 1999-11-19
    • 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드
    • 오닐마크레오나드로베슨로이드맬론버고인쥬니어윌리엄프랭클린랭삼마이클
    • C08J7/04B82B3/00
    • H01L21/02118C08J9/28C08J2201/0502C08J2201/0542H01B3/306H01B3/42H01B3/427H01B3/442H01L21/02203H01L21/02282H01L21/312H01L21/31695
    • PURPOSE: A nanoporous polymer film which overcomes the drawbacks of film thickness, dielectric constant, porosity, stability and adhesion of the prior art, and has low dielectric constant nanoporous thin films with good adhesion for use in dielectric layers for integrated circuits and various microelectronic devices, thereby allows the achievement of the high performance films and polymeric interlayer dielectrics in the reduced line dimensions contemplated by the electronic fabrication industry is provided. CONSTITUTION: A nanoporous polymer film is produced by following method comprising the steps of: providing a polymer in a solution with at least two solvents for the polymer, wherein a lowest boiling solvent and a highest boiling solvent have a difference in their respective boiling points of approximately 50°C or greater; forming a film of the polymer in solution with the at least two solvents on a substrate; removing a predominant amount of the lowest boiling solvent; contacting the film with a fluid which is a non-solvent for the polymer, but which is miscible with the at least two solvents; and forming a nanoporous film having average pore size in the film of less than 10 micrometer and low dielectric constant.
    • 目的:克服现有技术的膜厚度,介电常数,孔隙率,稳定性和粘附性的缺点的纳米多孔聚合物膜,并且具有用于集成电路和各种微电子器件的介电层中具有良好粘合性的低介电常数纳米多孔薄膜 ,从而允许实现由电子制造工业预期的减小的线尺寸的高性能膜和聚合物层间电介质。 构成:通过以下方法制备纳米多孔聚合物膜,其包括以下步骤:在溶液中提供聚合物至少两种用于聚合物的溶剂,其中最低沸点溶剂和最高沸点溶剂的沸点相差 大约50°C以上; 在溶液中用基材上的至少两种溶剂形成聚合物膜; 去除主要量的最低沸点溶剂; 使膜与用于聚合物的非溶剂的流体接触,但与至少两种溶剂可混溶; 并且在薄膜中形成平均孔径小于10微米和低介电常数的纳米孔膜。