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    • 5. 发明公开
    • Adhesive chuck, apparatus and method for assembling substrates using the same
    • 胶粘剂,装置和使用其组装基材的方法
    • KR20120069647A
    • 2012-06-28
    • KR20120060858
    • 2012-06-07
    • LIG ADP CO LTD
    • SHIM SEOK HEECHO HYUN WOO
    • G02F1/13G02F1/1339
    • G02F1/1303B32B37/0046B32B37/10B32B2037/1063
    • PURPOSE: An adhesive chuck, a substrate bonding device using the same, and a method thereof are provided to bone a substrate by van der Waals force. CONSTITUTION: An adhesive chuck(120) is located in a chamber. The adhesive chuck includes a plurality of adhesive protrusions(124a). The adhesive protrusions are bonded each other by attraction between a substrate and molecules. A driving unit makes the substrate close to another substrate which is located in the chamber to bond the substrates each other. A plurality of separation pins penetrate the adhesive chuck to separate the substrates. A separation member is coupled with ends of the separation pins. The separation member includes a separation bar. The separation bar pressurizes the substrate in a separation direction when the substrates are separated.
    • 目的:通过范德华力将粘合剂卡盘,使用该卡盘的基板接合装置及其方法提供给基板。 构成:粘合剂卡盘(120)位于腔室中。 粘合剂卡盘包括多个粘合突起(124a)。 粘合剂突起通过衬底和分子之间的吸引而彼此结合。 驱动单元使得基板靠近位于室中的另一基板,以将基板彼此粘合。 多个分离针穿透粘合剂卡盘以分离基底。 分离构件与分离销的端部联接。 分离构件包括分隔杆。 当分离基板时,分离杆在分离方向上对基板加压。
    • 7. 发明公开
    • 기판 합착 장치용 라미네이팅 장치 및 방법, 및 이를 구비한 기판 합착 장치 및 방법
    • 用于装配基板的层压装置和方法,以及与其相结合的基板的装置和方法
    • KR1020140000495A
    • 2014-01-03
    • KR1020120067570
    • 2012-06-22
    • 주식회사 나래나노텍
    • 이수용최우혁
    • G02F1/13G02F1/1339
    • G02F1/1303B32B37/10B32B2037/1063B32B2457/202G02F1/1313
    • In the present invention, disclosed are a laminating device and method for apparatus for bonding a substrate, and the apparatus and method for bonding the substrate including the same. The laminating device for bonding the substrate according to the present invention includes: a gantry; a connection member which is mounted on the gantry to be lifted; a laminating member which is rotationally mounted on the connection member and includes a contact member in contact with a top substrate on the lower side thereof; and a support member which slantingly supports one side of the top substrate and downwardly moves one side of the top substrate. The laminating member is controlled to form a vertical contact angle between the top substrate and the contact member and is hardened.
    • 在本发明中,公开了一种用于接合基板的装置的层压装置和方法,以及用于粘合包括该基板的基板的装置和方法。 根据本发明的用于粘合基板的层压装置包括:台架; 连接构件,其安装在要被提升的台架上; 一个层压构件,其旋转地安装在连接构件上,并且包括与其下侧的顶部衬底接触的接触构件; 以及支撑构件,其倾斜地支撑顶部基板的一侧并向下移动顶部基板的一侧。 控制层压构件以在顶部基板和接触构件之间形成垂直接触角并且被硬化。