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    • 4. 发明公开
    • 웨이퍼 본딩을 사용한 수직 공진형 표면 방출 레이저 구조 및 제작 방법
    • 使用波形粘结工艺的垂直孔表面发射激光及其制造方法
    • KR1020130062969A
    • 2013-06-13
    • KR1020130059190
    • 2013-05-24
    • 한국전자통신연구원
    • 박현대김경옥
    • H01S5/183
    • H01S5/0218H01S5/021H01S5/0215H01S5/0422H01S5/18308
    • PURPOSE: A vertical cavity surface emitting laser and a manufacturing method of the same are provided to facilitate integration with an electronic element, thereby increasing efficiency by reducing thermal and electric resistances of the electronic element. CONSTITUTION: A vertical cavity surface emitting laser is formed on a silicon substrate. A laser structure forms an optical resonant structure and a light generating layer from a thin film transferred from a different substrate using wafer bonding. An upper electrode layer is formed in an upper end of a laser thin film, and a lower electrode layer is formed on the silicone substrate. [Reference numerals] (AA) Laser light signal; (BB) Top mirror (top reflector); (CC) Current flow; (DD) Active region (optical generating layer); (EE) Oxide or air for current aperture (current aperture); (FF) Bottom mirror (bottom reflector); (GG) III-V layers
    • 目的:提供垂直腔表面发射激光器及其制造方法以便于与电子元件集成,从而通过降低电子元件的热电阻和电阻来提高效率。 构成:在硅衬底上形成垂直腔表面发射激光器。 激光结构从使用晶片接合的不同基板转移的薄膜形成光学谐振结构和发光层。 在激光薄膜的上端形成上电极层,在硅基板上形成下电极层。 (附图标记)(AA)激光信号; (BB)上镜(顶部反光镜); (CC)电流; (DD)有源区(光产生层); (EE)氧化物或空气用于电流孔径(电流孔径); (FF)底镜(底部反射镜); (GG)III-V层
    • 8. 发明公开
    • 수직공진 표면방출 레이저 및 그의 제조방법
    • VCSEL及其制造方法
    • KR1020130112841A
    • 2013-10-14
    • KR1020130112714
    • 2013-09-23
    • 한국전자통신연구원
    • 박현대김경옥
    • H01S5/183
    • H01S5/0218H01S5/021H01S5/0215H01S5/0422H01S5/18308
    • PURPOSE: A vertical resonance surface emitting laser and a manufacturing method thereof are provided to stably and effectively providing thermal or electric resistance between a silicon circuit board and a semiconductor light source active layer. CONSTITUTION: A vertical resonance surface emitting laser comprises a silicon circuit board (10), a lower reflective layer (22), a light generating layer (24), and an upper reflective layer (26). The silicon circuit board comprises a bulk silicon layer (12) and a first foreign substance layer (14). The first foreign substance is formed on the bulk silicon layer. The lower reflective layer is formed on the silicon circuit board. A photoproduction layer is formed on the lower reflective layer. The reflective layer is arranged on the photoproduction layer. The lower reflective layer, the photoproduction layer, or an upper reflective layer constructs a light source active layer (20). The semiconductor light source active layer is integrated by bonding a wafer to the first foreign substance layer.
    • 目的:提供一种垂直共振表面发射激光器及其制造方法,以稳定且有效地在硅电路板和半导体光源有源层之间提供热或电阻。 构成:垂直共振面发射激光器包括硅电路板(10),下反射层(22),发光层(24)和上反射层(26)。 硅电路板包括体硅层(12)和第一杂质层(14)。 第一异物形成在体硅层上。 下反射层形成在硅电路板上。 在下反射层上形成光生产层。 反射层设置在光生产层上。 下反射层,光生产层或上反射层构成光源有源层(20)。 半导体光源有源层通过将晶片接合到第一异物层而被集成。