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    • 3. 发明公开
    • 웨이퍼 가열장치와 반도체 제조장치
    • 卧式加热设备和半导体制造设备
    • KR1020070028464A
    • 2007-03-12
    • KR1020067027674
    • 2005-06-28
    • 쿄세라 코포레이션
    • 이와타케이지나가사키코이치나카무라츠네히코
    • H01L21/02H01L21/324
    • H01L21/67109H05B3/143
    • Wafer heating equipment which can perform rapid cooling is provided by improving a cooling speed of a heater part composed of a board-shaped body having a resistive heater. The wafer heating equipment is provided with a board-shaped body having two opposing main planes, one of which is permitted to be a placing plane whereupon a wafer is to be placed and the other main plane is provided with the strip-shaped resistive heater; a power supplying terminal connected to the resistive heater for supplying power to the resistive heater; a case arranged on the other plane of the board-shaped body to cover the power supplying terminal; and a nozzle having a leading edge opposing the other plane of the board-shaped body for cooling the board-shaped body. A projection position of the leading edge of the nozzle on the other plane of the board-shaped body is between the strips of the resistive heater. ® KIPO & WIPO 2007
    • 通过提高由具有电阻加热器的板状体构成的加热器部的冷却速度来提供能够进行快速冷却的晶片加热装置。 晶片加热设备设置有具有两个相对的主平面的板状体,其中一个主平面被允许为放置晶片的放置平面,另一个主平面设置有带状电阻加热器; 连接到所述电阻加热器的供电端子,用于向所述电阻加热器供电; 设置在所述板状体的另一平面上以覆盖所述供电端子的壳体; 以及具有与所述板状体的另一平面相对的前缘的喷嘴,用于冷却所述板状体。 喷嘴的前缘在板状体的另一平面上的突出位置位于电阻加热器的条之间。 ®KIPO&WIPO 2007
    • 10. 发明公开
    • 정전척
    • 静电切割以减轻饱和时间的间隔
    • KR1020040070008A
    • 2004-08-06
    • KR1020040005028
    • 2004-01-27
    • 쿄세라 코포레이션
    • 나카무라츠네히코
    • H01L21/68
    • H01L21/67109H01L21/6831Y10T279/23
    • PURPOSE: An electrostatic chuck is provided to shorten an interval of saturation time by reducing a temperature difference in the surface of a wafer mounted on an electrostatic chuck. CONSTITUTION: An installation surface(3) of a wafer(W) is formed in a main surface of a disc-type ceramic body(2) with an electrostatic absorption electrode. A concentric ring-type gas groove(9) and a gas introducing hole(4) connected to the ring-type gas groove are formed in the periphery of the installation surface. A circular gas groove(8) and a gas introducing hole(5) connected to the circular gas groove are formed in the installation surface. The ring-type gas groove and the circular gas groove are independent of each other, and a plurality of block parts(11,12) are formed in the ring-type gas groove and the circular gas groove.
    • 目的:提供静电卡盘,通过减小安装在静电卡盘上的晶片表面的温度差来缩短饱和时间间隔。 构成:在具有静电吸收电极的盘状陶瓷体(2)的主表面上形成晶片(W)的安装面(3)。 在安装面的周围形成有与环状气体槽连接的同心环状气体槽(9)和气体导入孔(4)。 在安装面上形成圆形气体槽(8)和连接到圆形气体槽的气体导入孔(5)。 环状气体槽和圆形气体槽彼此独立,并且在环状气体槽和圆形气体槽中形成有多个块体(11,12)。