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1. 发明公开

KR1020110090757A 회로 접속용 도전 접착제 조성물, 회로 접속재료, 회로 접속구조체 및 회로 접속구조체의 제조방법 无效
标题翻译：用于连接电路的导电性粘合剂组合物，包括导电粘合剂组合物的电路连接材料，连接的电路结构和使用电路连接材料的连接电路结构的方法
公开(公告)号：KR1020110090757A
公开(公告)日：2011-08-10
申请号：KR1020100135664
申请日：2010-12-27
申请人： 주식회사 이그잭스
发明人： 황진상 , 김주열 , 구대영 , 하자영
IPC分类号： C09J9/02 , C09J11/02 , H01B1/22 , H01R11/00
CPC分类号： C09J9/02 , C09J11/06 , H01B1/22 , H01R11/01
摘要： PURPOSE: A conductive adhesive composition for circuit connection is provided to uniformly form a conductive channel since the metal acting as a conductive role is selectively focused between circuit electrodes. CONSTITUTION: A conductive adhesive composition for circuit connection comprises (a) an organometallic compound, (b) a thermoplastic resin, and (c) a curable component consisting of a curable resin and a curing agent. The organometallic compound generates metal atoms as a conductive component by decomposing the organometallic compound at 80-300°C.
摘要翻译：目的：提供用于电路连接的导电粘合剂组合物以均匀地形成导电通道，因为用作导电作用的金属被选择性地聚焦在电路电极之间。构成：用于电路连接的导电粘合剂组合物包括（a）有机金属化合物，（b）热塑性树脂，和（c）由可固化树脂和固化剂组成的可固化组分。有机金属化合物通过在80-300℃下分解有机金属化合物而产生金属原子作为导电组分。

2. 发明授权

KR101260440B1 회로 접속용 도전 접착제 조성물, 회로 접속재료, 회로 접속구조체 및 회로 접속구조체의 제조방법 失效
标题翻译：用于连接电路电极的导电粘合剂组合物，包括导电粘合剂组合物的电路连接材料，使用电路连接材料的连接电路结构的连接电路结构和方法
公开(公告)号：KR101260440B1
公开(公告)日：2013-05-02
申请号：KR1020100135663
申请日：2010-12-27
申请人： 주식회사 이그잭스
发明人： 황진상 , 김주열 , 구대영 , 하자영
IPC分类号： C09J9/02 , C09J11/02 , H01B1/22 , H01R11/00
摘要： 본발명은회로접속용도전접착제조성물에관한것으로, (a) 유기금속화합물, (b) 열가소성수지및 (c) 경화성수지와경화제로이루어지는경화성성분을포함하는회로접속용도전접착제를제공한다. 본발명의회로접속용도전접착제는절연도전입자대신에유기금속화합물을사용하여비용이저렴할뿐만아니라맞닿은회로전극사이에는선택적으로석출되어전도성통로가균일하게형성된반면다른전극간에는절연특성이뛰어나극미세피치의전극간회로접속용도전접착제로사용되기에적합하다.

3. 发明公开

KR1020110016538A 다면체 올리고머 실세스퀴녹산 화합물을 함유하는 이방 도전성 접착제 无效
标题翻译：包含聚酰亚胺硅酸盐（POSS）的ANISOTROPIC导电胶
公开(公告)号：KR1020110016538A
公开(公告)日：2011-02-18
申请号：KR1020090074078
申请日：2009-08-12
申请人： 주식회사 이그잭스
发明人： 황진상 , 김주열 , 구대영 , 권오형
IPC分类号： C09J183/02 , C09J9/02
CPC分类号： C09J183/04 , C08K2201/001 , C08L33/00 , C08L63/00 , C09J9/02 , C09J11/00 , C09J11/08
摘要： PURPOSE: An anisotropic conductive adhesive is provided to secure low thermal expansion coefficient and high modulus without the degradation of other properties, and to ensure stable electric conductivity after a connection process and high reliability. CONSTITUTION: An anisotropic conductive adhesive comprises (a) polyhedral oligomer silsesquinoxane compounds, (b) thermoplastic resins, (c) crosslinkable components consisting of crosslinkable resins and cross-linking agent and/or initiators, and (d) conductive particles. The adhesive is formed in a monolayered or multilayered film. The polyhedral oligomer silsesquinoxane compounds has 6~12 of Si number within a structure.
摘要翻译：目的：提供各向异性导电粘合剂以确保低热膨胀系数和高模量，而不会降低其他性能，并确保连接过程和高可靠性之后的稳定导电性。构成：各向异性导电粘合剂包括（a）多面体低聚物硅嗪醌化合物，（b）热塑性树脂，（c）由交联性树脂和交联剂和/或引发剂组成的可交联组分，和（d）导电颗粒。粘合剂形成在单层或多层膜中。多面体低聚物硅嘧啶醌化合物在结构内具有6〜12个Si数。

4. 发明公开

KR1020130119165A 실리카 입자가 함유된 기능성 접착제 无效
标题翻译：功能性粘合剂含二氧化硅
公开(公告)号：KR1020130119165A
公开(公告)日：2013-10-31
申请号：KR1020120042111
申请日：2012-04-23
申请人： 주식회사 이그잭스
发明人： 황진상 , 구대영 , 원종우 , 이선영 , 배병호
IPC分类号： C09J11/04 , C09J9/02 , C09J201/00 , C09J133/04
CPC分类号： C09J11/04 , C08K3/36 , C08L33/04 , C08L63/00 , C09J201/00
摘要： PURPOSE: A functional adhesive prevents moisture absorption, improves curing density and adhesive strength, and has high reliability under a high temperature and high humidity environment by adding hydrophobic silica particle has as filler into a thermoplastic resin and a curing agent resin. CONSTITUTION: A functional adhesive comprises a hydrophobic silica particle, a thermoplastic resin, a crosslinkable resin and a curable component formed of crosslinking agent or an initiating agent. The functional adhesive comprises 100.0 parts by weight of the thermoplastic resin, 50-220 parts by weight of a crosslinkable resin component, 0.5-50 parts by weight of the initiator or a crosslinking agent, and 0.5-10 parts by weight of a hydrophobic silica particle. The functional adhesive additionally includes 1-30 parts by volume of a conductive particle with a particle diameter of 2-30 micron based on 100 parts by volume of the functional adhesive.
摘要翻译：目的：功能性粘合剂通过将疏水性二氧化硅颗粒作为填料加入到热塑性树脂和固化剂树脂中，防止吸湿，提高固化密度和粘合强度，并且在高温高湿环境下具有高可靠性。构成：功能性粘合剂包括疏水性二氧化硅颗粒，热塑性树脂，可交联树脂和由交联剂或引发剂形成的可固化组分。功能性粘合剂包括100.0重量份的热塑性树脂，50-220重量份的可交联树脂组分，0.5-50重量份的引发剂或交联剂，以及0.5-10重量份的疏水性二氧化硅粒子。功能粘合剂另外包含基于100体积份功能性粘合剂的1-30体积份的粒径为2-30微米的导电颗粒。

5. 发明公开

KR1020110090758A 회로 접속용 도전 접착제 조성물, 회로 접속재료, 회로 접속구조체 및 회로 접속구조체의 제조방법 无效
标题翻译：用于连接电路的导电性粘合剂组合物，包括导电粘合剂组合物的电路连接材料，连接的电路结构和使用电路连接材料的连接电路结构的方法
公开(公告)号：KR1020110090758A
公开(公告)日：2011-08-10
申请号：KR1020100135666
申请日：2010-12-27
申请人： 주식회사 이그잭스
发明人： 황진상 , 김주열 , 구대영 , 하자영
IPC分类号： C09J9/02 , C09J11/02 , H01B1/00 , H01R11/00
CPC分类号： C09J9/02 , C09J11/06 , H01B1/22 , H01R11/01
摘要： PURPOSE: A conductive adhesive composition for circuit connection is provided to uniformly form a conductive channel between facing circuit electrodes and to reduce costs using organometallic compounds instead of insulation conductive particles. CONSTITUTION: A conductive adhesive composition for circuit connection is to electrically connect the first circuit electrode of a first substrate and the second circuit electrode of a second substrate. The conductive adhesive composition comprises (a) organometallic compounds generating metal atoms as a conductive component by being decomposed at 80-300 °C, (b) thermoplastic resins, and (c) a curable component consisting of a curing resin and a hardener.
摘要翻译：目的：提供用于电路连接的导电粘合剂组合物以在对置电路电极之间均匀地形成导电通道，并且使用有机金属化合物代替绝缘导电颗粒来降低成本。构成：用于电路连接的导电粘合剂组合物是将第一基板的第一电路电极和第二基板的第二电路电极电连接。导电粘合剂组合物包含（a）通过在80-300℃下分解产生金属原子作为导电组分的有机金属化合物，（b）热塑性树脂，和（c）由固化树脂和固化剂组成的可固化组分。

6. 发明公开

KR1020110090756A 회로 접속용 도전 접착제 조성물, 회로 접속재료, 회로 접속구조체 및 회로 접속구조체의 제조방법 失效
标题翻译：用于连接电路的导电性粘合剂组合物，包括导电粘合剂组合物的电路连接材料，连接的电路结构和使用电路连接材料的连接电路结构的方法
公开(公告)号：KR1020110090756A
公开(公告)日：2011-08-10
申请号：KR1020100135663
申请日：2010-12-27
申请人： 주식회사 이그잭스
发明人： 황진상 , 김주열 , 구대영 , 하자영
IPC分类号： C09J9/02 , C09J11/02 , H01B1/22 , H01R11/00
CPC分类号： C09J9/02 , C09J11/06 , C09J201/02 , H01B1/22 , H01R11/01
摘要： PURPOSE: An electrically-conductive adhesive composition for circuit connections is provided to uniformly form a conductive path, to ensure an insulation property between other electrodes, and to enable the use as an electrically-conductive adhesive between ultra fine pitchs. CONSTITUTION: An electrically-conductive adhesive composition for circuit connections comprises (a) organometallic compounds, (b) thermoplastic resins and (c) a hardening component consisting of curable resins and hardeners. The metal atoms as a conductive component is obtained by decomposing the organometallic compound by applying and heating at least one energy selected from the temperature, wavelength and frequency at 70~300 °C, or irradiating the wavelength of 150~700 nm.
摘要翻译：目的：提供用于电路连接的导电粘合剂组合物以均匀地形成导电路径，以确保其它电极之间的绝缘性能，并且能够用作超细间距之间的导电粘合剂。构成：用于电路连接的导电粘合剂组合物包括（a）有机金属化合物，（b）热塑性树脂和（c）由可固化树脂和硬化剂组成的硬化组分。作为导电成分的金属原子是通过在70〜300℃的温度，波长，频率中选出的至少一种能量或者照射150〜700nm的波长来分解有机金属化合物而得到的。

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