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1. 发明授权

KR101307163B1 인쇄회로기판의 내층회로 보호공법 有权
标题翻译：印刷电路板制造方法
公开(公告)号：KR101307163B1
公开(公告)日：2013-09-11
申请号：KR1020120136933
申请日：2012-11-29
申请人： 주식회사 에스아이 플렉스
发明人： 이대원 , 서정식 , 이성기 , 조승훈
IPC分类号： H05K3/46 , H05K3/28
摘要： PURPOSE: A protection method for an inner circuit of a printed circuit board is provided to enable shielding with one ink application and prevent liquid from permeating into a circuit in a liquid process in which cohesive power is increased and coated afterward by processing thermal compression bonding after the printing of peelable ink. CONSTITUTION: A protection method for an inner circuit of a printed circuit board comprises a step (S10) of forming a circuit on an inner layer forming the circuit on the upper part of a copper substrate of a raw material state; a step (S20) of laminating a coverlay on the upper part of the inner layer; a step (S30) of laminating an outer layer on the upper surface by using a hot press; a step (S40) of printing a peelable ink in order to prevent the circuit of the inner layer exposed to the outside; a step (S50) of performing copper plating between the laminated inner layer and the outer layer to comprise electrical connection; a step (S60) of forming an outer layer circuit forming the circuit on the laminated outer layer; and a step (S70) of removing the peelable ink printed on the upper part of the inner layer circuit. [Reference numerals] (AA) Start; (BB) End; (S10) Step of forming a circuit on an inner layer; (S20) Step of preparing a coverlay; (S30) Step of laminating an outer layer; (S40) Step of printing a peelable ink; (S50) Step of performing copper plating; (S60) Step of forming an outer layer circuit; (S70) Step of removing the peelable ink
摘要翻译：目的：提供一种用于印刷电路板的内部电路的保护方法，以便能够利用一个墨水施加屏蔽，并且防止液体在液体过程中渗透到电路中，其中通过在印刷可剥离油墨。构成：印刷电路板的内部电路的保护方法包括在原料状态的铜基板的上部形成电路的内层上形成电路的工序（S10）将覆盖层层叠在内层的上部的工序（S20）通过使用热压机在上表面层叠外层的工序（S30）打印可剥离墨水的步骤（S40），以防止内层暴露于外部的电路; 在层压内层和外层之间进行镀铜以包括电连接的步骤（S50）在层压外层上形成形成电路的外层电路的步骤（S60）以及去除印刷在内层电路的上部的可剥离油墨的步骤（S70）。（附图标记）（AA）开始; （BB）结束; （S10）在内层形成电路的工序; （S20）制作覆盖物的步骤; （S30）层叠外层的工序; （S40）可剥离油墨的印刷工序; （S50）进行镀铜工序; （S60）形成外层电路的步骤; （S70）去除可剥离油墨的步骤

2. 发明授权

KR101877957B1 연성 인쇄 회로 기판 제조 방법 有权
公开(公告)号：KR101877957B1
公开(公告)日：2018-07-12
申请号：KR1020170145849
申请日：2017-11-03
申请人： 주식회사 에스아이 플렉스
发明人： 정의남 , 권순범 , 장재영 , 김상균 , 이성기
IPC分类号： H05K3/46 , H05K3/28
CPC分类号： H05K3/4664 , H05K3/281 , H05K3/4691
摘要： 연성인쇄회로기판제조방법이개시되며, 상기연성인쇄회로기판제조방법은, (a) 연성회로부형성예정부분과경성회로부형성예정부분을포함하는내층을준비하는단계; (b) 상기경성회로부형성예정부분상에외층을적층하는단계; (c) 상기외층과단차를가지는상기연성회로부형성예정부분상에잉크부를형성하는단계; (d) 상기잉크부및 상기외층각각상에 DFSR층을형성하는단계; 및 (e) 상기연성회로부형성예정부분의상기잉크부및 상기 DFSR층을제거하는단계를포함한다.

3. 发明授权

KR101241069B1 ＰＳＲ이 사용되는 인쇄회로기판의 제조 방법 有权
标题翻译：印刷电路板制造方法
公开(公告)号：KR101241069B1
公开(公告)日：2013-03-11
申请号：KR1020120085598
申请日：2012-08-06
申请人： 주식회사 에스아이 플렉스
发明人： 이성기
IPC分类号： H05K3/46 , H05K3/42 , H05K3/10
摘要： PURPOSE: A printed circuit board manufacturing method using PSR(Photo Solder Resist) is provided to minimize exposure when forming the PSR of a BVH(Blind Via Hole) in an MLB(Multi-Layer Board) product by filling ink in the BVH using an inkjet before printing the PSR with a screen printer. CONSTITUTION: A substrate in which a BVH and a circuit pattern are formed is prepared(S10). The inside of the BVH is filled by using an inkjet(S20). A PSR layer is formed by coating the entire surface of the substrate with ink in a screen printing method(S30). A preliminary drying stage of drying liquid ink coated over the entire surface of the substrate is performed(S40). A PSR exposure and development stage is performed on the dried substrate(S50). A final drying stage of finally hardening the ink of the substrate is performed(S60). [Reference numerals] (AA) Start; (BB) End; (S10) Step of preparing a substrate(E); (S20) Step of filling the inside of a BVH; (S30) Step of forming a PSR layer on the entire surface of the substrate; (S40) Step of preliminary drying; (S50) Step of exposing and developing PSR; (S60) Step of final drying
摘要翻译：目的：提供使用PSR（Photo Solder Resist）的印刷电路板制造方法，以通过在BVH中填充油墨来形成MLB（多层板）产品中BVH（盲孔）的PSR时的曝光，以最小化曝光在使用丝网印刷机打印PSR之前喷墨。构成：准备形成有BVH和电路图案的基板（S10）。通过使用喷墨装置来填充BVH的内部（S20）。通过丝网印刷方法用油墨涂覆基板的整个表面形成PSR层（S30）。进行涂布在基板的整个表面上的干燥液体油墨的预干燥阶段（S40）。在干燥的基板上进行PSR曝光和显影阶段（S50）。进行最终硬化基板油墨的最终干燥阶段（S60）。（附图标记）（AA）开始; （BB）结束; （S10）准备基板（E）的工序; （S20）填充BVH内部的步骤; （S30）在基板的整个表面上形成PSR层的工序; （S40）预干燥步骤; （S50）曝光和显影PSR的步骤; （S60）最终干燥步骤

4. 发明授权

KR101435432B1 인쇄회로기판 적재용 랙 有权
标题翻译：印刷电路板的装载架
公开(公告)号：KR101435432B1
公开(公告)日：2014-08-29
申请号：KR1020130166594
申请日：2013-12-30
申请人： 주식회사 에스아이 플렉스
发明人： 이성기 , 서정식 , 이대원 , 조승훈 , 김원준
IPC分类号： H01L21/673 , B65D85/86 , B65D85/38 , H05K5/06
摘要： The present invention relates to a rack for loading printed circuit boards, comprising: a body; a side support where both ends of the printed circuit boards are inserted and supported; and a bottom support where the lower sides of the printed circuit boards are mounted. The bottom support, which is located at the bottom of a product for mounting of the product, comprises: multiple vertical fixing units which are fixed in an upper frame; a holding part which is located at both sides of the lower part of the vertical fixed units and technically fixes the product; and a horizontal fixing unit which fixes the holding part on the vertical fixing unit. The structure enables for the holding part to be separable from the support, and leads to an easy maintenance by enabling the cleaning of foreign materials caused by PSR ink through regular replacement.
摘要翻译：本发明涉及一种用于装载印刷电路板的机架，包括：主体; 印刷电路板的两端插入和支撑的侧支撑件; 以及安装印刷电路板的下侧的底部支撑件。位于用于安装产品的产品底部的底部支撑件包括：固定在上框架中的多个垂直固定单元; 保持部位于垂直固定单元的下部的两侧，技术上固定产品; 以及水平固定单元，其将保持部固定在垂直定影单元上。该结构使得保持部件能够与支撑件分离，并且通过定期更换能够清洁由PSR油墨引起的异物而导致易于维护。

5. 发明授权

KR101369150B1 단차 지그를 이용한 인쇄공법 有权
标题翻译：使用步骤打印的方法
公开(公告)号：KR101369150B1
公开(公告)日：2014-03-04
申请号：KR1020130122766
申请日：2013-10-15
申请人： 주식회사 에스아이 플렉스
发明人： 조승훈 , 이대원 , 서정식 , 이성기 , 김원준
IPC分类号： H05K3/00
摘要： The present invention relates to a printing method using a step jig, which comprises: a step jig processing step (S10) for processing a step jig to be disposed on the bottom surfaces of an outer layer and an inner layer formed in one printed circuit board (PCB); a reinforcing plate processing step (S20) for processing a reinforcing plate which is positioned on the bottom surface of the inner layer while being positioned on the top surface of the step jig to remove a step to the outer layer; an attachment step (S30) for attaching the reinforcing plate processed in the reinforcing plate processing step (S20) on the top surface of the step jigs processed in the step jig processing step (S10); and a product mounting step (S40) for mounting a product on the jig before proceeding a printing process by placing the jig and the reinforcing plate prepared in the attachment step (S30) on a printing table, thereby improving quality deterioration caused by a skip failure resulting from unstuck and clogged ink during the printing process. [Reference numerals] (AA) Step jig processing step; (BB) Reinforcing plate processing step; (CC) Attachment step; (DD) Product step
摘要翻译：本发明涉及一种使用步进夹具的打印方法，其包括：步骤夹具加工步骤（S10），用于处理设置在形成在一个印刷电路板中的外层和内层的底面上的步进夹具（PCB）; 加强板加工步骤（S20），用于处理位于所述内层的底表面上的加强板，同时位于所述台阶夹具的顶表面上以去除所述外层的台阶; 在步骤夹具处理步骤（S10）中处理的步进夹具的顶面上安装加强板加工步骤（S20）中加工的加强板的安装步骤（S30）以及产品安装步骤（S40），用于通过将安装步骤（S30）中制备的夹具和加强板放置在印刷台上，在进行印刷处理之前将产品安装在夹具上，从而改善由跳过失败引起的质量劣化这是由于在打印过程中油墨不稳定和堵塞。（标号）（AA）步骤夹具加工工序; （BB）加强板加工步骤; （CC）附件步骤; （DD）产品步骤

6. 发明授权

KR101340872B1 박리형 잉크를 이용한 복합도금 차폐방법 有权
标题翻译：使用油墨分离类型的复合涂层屏蔽方法
公开(公告)号：KR101340872B1
公开(公告)日：2013-12-12
申请号：KR1020130078882
申请日：2013-07-05
申请人： 주식회사 에스아이 플렉스
发明人： 이대원 , 서정식 , 이성기 , 조승훈
IPC分类号： H05K3/28
摘要： The present invention relates to a composite plating shielding method using separable ink, the method comprising the steps of: a circuit forming step (S110) for arranging a copper layer on top of an insulating film and forming a circuit; a PSR printing step (S120) for protecting the circuit by applying photo solder resist (PSR) ink on the upper part of a PCB on which the circuit is formed in the circuit forming step (S110); a first gold plating step (S130) for plating, with electrolytic gold, the upper part of a substrate obtained in the PSR printing step (S120); a dry film coating step (S140) for coating a dry film on the front surface of the substrate by applying heat and pressure to the dry film if the first gold plating step (S130) is completed; a separable ink printing step (S150) for coating separable ink with a silk screen method on the upper side of the dry film obtained in the dry film coating step (S140); a second gold plating step (S160) for forming an anelectric gold-plating layer only on a circuit part on which the dry film and the separable ink are not coated by plating the entire surface of the substrate with electroless gold; and a dry film and separable ink exfoliating step (S170) for exfoliating the dry film and separable ink by coating amine stripper with a nozzle spraying method in order to exfoliate the dry film and separable ink at the same time. The method can prevent the discoloring of the plating due to the permeation of the second gold-plating solution into the first gold-plating region and thus can remove the fault inspection process. [Reference numerals] (S110) Form a circuit;(S120) PSR printing step;(S130) First gold-plating step;(S140) Dry film coating step;(S150) Separable ink printing step;(S160) Second gold-plating step;(S170) Dry film and separable ink exfoliating step
摘要翻译：本发明涉及一种使用可分离油墨的复合电镀屏蔽方法，该方法包括以下步骤：电路形成步骤（S110），用于在绝缘膜的顶部上布置铜层并形成电路; 用于通过在电路形成步骤中在其上形成电路的PCB的上部应用光阻焊剂（PSR）墨来保护电路的PSR印刷步骤（S120）（S110）; 用于电镀金的第一镀金步骤（S130），在PSR印刷步骤（S120）中获得的基材的上部; 如果第一镀金步骤（S130）完成，则通过向干膜施加热和压力来在基板的正面上涂覆干膜的干膜涂布步骤（S140）在干膜涂布步骤（S140）中获得的干膜上侧用丝网方法涂布可分离油墨的可分离油墨印刷步骤（S150）; 第二镀金步骤（S160），仅在通过用化学金镀覆基板的整个表面的情况下不在其上涂覆干膜和可分离油墨的电路部分上形成电镀金层; 以及干膜和可分离油墨剥离步骤（S170），用于通过用喷嘴喷涂方法涂布胺剥离剂来剥离干膜和可分离油墨，以便同时剥离干膜和可分离油墨。该方法可以防止由于第二镀金溶液渗透到第一镀金区域中的电镀变色，从而可以消除故障检查过程。（S110）形成电路;（S120）PSR印刷工序;（S130）第一镀金工序;（S140）干膜涂布工序;（S150）可分离油墨印刷工序;（S160）第二次镀金步骤;（S170）干膜和可分离的油墨去角质步骤

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