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    • 5. 发明公开
    • 전력저감형 전기역학적 토양 정화 방법
    • 使用开关电源的能量效应电动自动补救系统
    • KR1020110093349A
    • 2011-08-18
    • KR1020100013337
    • 2010-02-12
    • 금오공과대학교 산학협력단주식회사 에코필
    • 백기태류병곤김도형김경조박근용박선영고성환정홍배
    • B09C1/06A62D3/11
    • B09C1/085A62D3/11
    • PURPOSE: A power reducing type electrokinetic soil purifying method is provided to maintain soil purifying performance and reduce power consumption by periodically repeating the supplying state of power. CONSTITUTION: A power supplying unit(10) fixes a positive electrode part(20) and a negative electrode part(30) at opposite positions. Contaminated soil is arranged between the positive electrode part and the negative electrode part. The positive electrode part supplies an electrolytic solution. A power supplying process continuously repeats power-on time and power-off time. The power-on time and the power-off time respectively maintains for 1 to 2 seconds. In the power supplying process, the current density of power is between 0.1mA/cm^2 to 10mA/cm^2 or the voltage slope of the power is between 0.1 and 10V/cm.
    • 目的:通过定期重复电源供应状态,提供减压式电动土壤净化方法,保持土壤净化性能,降低功耗。 构成:电源单元(10)将正极部(20)和负极部(30)固定在相对的位置。 污染土壤布置在正极部分和负极部分之间。 正极部供给电解液。 供电过程连续重复上电时间和断电时间。 上电时间和断电时间分别保持1〜2秒。 在供电过程中,电流的电流密度为0.1mA / cm 2〜10mA / cm 2,电源的电压斜率为0.1〜10V / cm。
    • 6. 发明授权
    • 플라즈마 발생장치를 이용한 막증발법 수처리 시설의 온수공급장치
    • 膜蒸馏水处理采用等离子体放电装置提供温水
    • KR101605954B1
    • 2016-03-23
    • KR1020140053873
    • 2014-05-07
    • 금오공과대학교 산학협력단
    • 이승환손건태김도형
    • C02F1/46C02F1/30H05H1/24
    • 본발명은플라즈마발생장치를이용한수처리시설의온수공급장치에관한것으로, 오염수가저장되는저수조, 미생물의분해작용에의해오염수의부산물을제거하는폭기조, 오염수의슬러지를따로분리하는반응조를순차적으로거친오염수의유기물이나오염물질을제거하는플라즈마발생장치를이용하여오염수를처리하는수처리시설의온수공급장치에있어서, 상기플라즈마발생장치는, 투명아크릴재질로제작되어플라즈마가방전될수 있도록내부에소정의공간을형성하는본체; 상기본체의상부에는저수조, 폭기조, 반응조중 어느한 곳에서배출되는오염수를공급받을수 있는공급관; 상기본의하부에는처리된오염수를배출하는배출관; 상기본체의하부에는처리가미흡하게이루어진오염수를다시본체내부로인입시킬수 있도록공급관과연계되는연결관; 균일한분포로분사구가각각형성되어펄스발생기로부터펄스를인가받아코로나스트리머가형성되어본체내부에전체적으로플라즈마막을생성하는다수의전극으로이루어지고, 상기온수공급장치는배출관에서배출된처리수를공급받아처리수가 70 ~ 80 온도로유지되도록가열하여 MD처리장치로배출하는히팅수단이포함됨을특징으로하는플라즈마발생장치를이용한수처리시설의온수공급장치를제공한다. 따라서배출관에서배출하는처리수를 70 ~ 80로가열하여 MD처리장치로유입하는히팅수단으로인해파울링에대한영향이최소화되면서도막 투과유량(Flux)이최대로나타나게하여 MD처리장치의효율성을향상시키는효과를발휘한다.
    • 9. 发明公开
    • 플라즈마 발생장치를 이용한 막증발법 수처리 시설의 온수공급장치
    • 使用等离子体放电装置提供温水的膜蒸馏水处理
    • KR1020150127309A
    • 2015-11-17
    • KR1020140053873
    • 2014-05-07
    • 금오공과대학교 산학협력단
    • 이승환손건태김도형
    • C02F1/46C02F1/30H05H1/24
    • C02F1/4608C02F9/00C02F2209/02H05H1/24
    • 본발명은플라즈마발생장치를이용한수처리시설의온수공급장치에관한것으로, 오염수가저장되는저수조, 미생물의분해작용에의해오염수의부산물을제거하는폭기조, 오염수의슬러지를따로분리하는반응조를순차적으로거친오염수의유기물이나오염물질을제거하는플라즈마발생장치를이용하여오염수를처리하는수처리시설의온수공급장치에있어서, 상기플라즈마발생장치는, 투명아크릴재질로제작되어플라즈마가방전될수 있도록내부에소정의공간을형성하는본체; 상기본체의상부에는저수조, 폭기조, 반응조중 어느한 곳에서배출되는오염수를공급받을수 있는공급관; 상기본의하부에는처리된오염수를배출하는배출관; 상기본체의하부에는처리가미흡하게이루어진오염수를다시본체내부로인입시킬수 있도록공급관과연계되는연결관; 균일한분포로분사구가각각형성되어펄스발생기로부터펄스를인가받아코로나스트리머가형성되어본체내부에전체적으로플라즈마막을생성하는다수의전극으로이루어지고, 상기온수공급장치는배출관에서배출된처리수를공급받아처리수가 70 ~ 80 온도로유지되도록가열하여 MD처리장치로배출하는히팅수단이포함됨을특징으로하는플라즈마발생장치를이용한수처리시설의온수공급장치를제공한다. 따라서배출관에서배출하는처리수를 70 ~ 80로가열하여 MD처리장치로유입하는히팅수단으로인해파울링에대한영향이최소화되면서도막 투과유량(Flux)이최대로나타나게하여 MD처리장치의효율성을향상시키는효과를발휘한다.
    • 本发明涉及一种使用等离子体产生装置的膜蒸馏水处理设备中的热水供应装置,更具体地,涉及一种在水处理设备中的热水供应装置。 水处理设备通过使用等离子体发生设备进行水处理过程,该等离子体发生装置从污染水中排除污染物或有机物质,污染物依次经过储存有污染水的水箱,曝气池从污染水中除去副产物,以及 将污泥与污染水分离的反应罐。
    • 10. 发明公开
    • 5원계 저융점 무연 솔더 조성물
    • 无铅焊接复合材料SN-AG-Cu-In-Bi合金具有低熔点
    • KR1020130014913A
    • 2013-02-12
    • KR1020110076651
    • 2011-08-01
    • 금오공과대학교 산학협력단
    • 최병호강인구김혁종김효재김도형김진식
    • B23K35/26C22C13/02
    • PURPOSE: Quinary low melting point lead free solder is provided to minimize physical damage in case of bonding an electronic substrate by being environment-friendly and having excellent physical property simultaneous with a low melting point. CONSTITUTION: Quinary low melting point lead free solder includes tin(Sn), silver(Ag), copper(Cu), indium(In) and bismuth(Bi). The lead free solder composition comprises 85-99 weight% tin, 0.8-1.2 weight% silver, 0.1-1.0 weight% copper, 0.1-1.0 weight% indium and 5-10 weight% bismuth by weight based on the total weight of the composition. The lead free solder composition further includes at least more than one selected element of nickel(Ni), zinc(Zn), antimony(Sb), gallium(Ga) and phosphorous(P) by weight based on the total weight of the composition. The lead free solder composition possibly selectively further includes more than one metal selected from nickel, antimony and gallium to intensify the mechanical property although the mechanical property is excellent. The lead free solder manufactured with the lead free solder composition possibly is a form of alloy. Using an example usage of the lead free solder composition such as wave soldering, electrodeposition or soldering paste, integrated circuit chips are electrically connected to a circuitized substrate.
    • 目的:提供四价低熔点无铅焊料,以便在环境友好且与低熔点同时具有优异物理性能的情况下,最小化物理损坏。 构成:四价低熔点无铅焊料包括锡(Sn),银(Ag),铜(Cu),铟(In)和铋(Bi)。 无铅焊料组合物包含85-99重量%锡,0.8-1.2重量%银,0.1-1.0重量%铜,0.1-1.0重量%铟和5-10重量%铋,基于组合物的总重量 。 无铅焊料组合物还包括至少一种以组合物总重量计的镍(Ni),锌(Zn),锑(Sb),镓(Ga)和磷(P)的选定元素。 无铅焊料组合物可以选择性地进一步包括选自镍,锑和镓的多种金属,以增强机械性能,尽管机械性能优异。 用无铅焊料组合物制造的无铅焊料可能是合金的一种形式。 使用无铅焊料组合物例如波峰焊,电沉积或焊膏的示例使用,集成电路芯片电连接到电路化基板。