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1. 发明公开

KR1020140086221A 레이저 다이싱용 반도체 접착 필름 및 이를 포함한 다이싱 다이본드 필름 无效
标题翻译：半导体胶片用于包括其的定位和定位胶带
公开(公告)号：KR1020140086221A
公开(公告)日：2014-07-08
申请号：KR1020120156445
申请日：2012-12-28
申请人： 제일모직주식회사
发明人： 박백성 , 김인환 , 김철수 , 송규석 , 임수미 , 최재원
IPC分类号： C09J7/02 , C09J163/00 , H01L21/60
CPC分类号： H01L2224/83191 , C09J7/35 , C09J7/22 , C09J7/29 , C09J163/00 , C09J2201/16 , C09J2203/326 , H01L21/6836 , H01L24/26 , H01L2021/60015
摘要： The present invention relates to an adhesive film for a laser dicing having an elongation percentage below 10% before the hardening of the adhesive film at 0°C. The elongation percentage of the adhesive film at 0°C decreases by 65% at 25°C, and the fracture temperature of the adhesive film ranges from -20 to 0°C. The elongation percentage of the adhesive film is 15-50% when hardened at 100°C for 60 minutes. Moreover, the adhesive film includes a first epoxy resin and a second epoxy resin.
摘要翻译：本发明涉及一种激光切割用粘合膜，其在0℃下硬化粘合膜之前的伸长率低于10％。粘合剂膜在0℃下的伸长率在25℃下降低65％，粘合膜的断裂温度在-20℃至0℃。当在100℃下硬化60分钟时，粘合膜的伸长率为15-50％。此外，粘合膜包括第一环氧树脂和第二环氧树脂。

2. 发明授权

KR101375297B1 반도체용 접착 조성물 및 이를 포함하는 접착 필름 有权
标题翻译：用于半导体的粘合组合物和包含其的粘合剂膜
公开(公告)号：KR101375297B1
公开(公告)日：2014-03-17
申请号：KR1020110140386
申请日：2011-12-22
申请人： 제일모직주식회사
发明人： 이준우 , 김성민 , 김인환 , 박백성 , 임수미 , 최재원
IPC分类号： C09J7/02 , C09J11/06 , C09J163/00 , H01L21/02
CPC分类号： C09J163/00 , C08K5/0025 , C08K5/3445 , C08L63/00 , C09J7/00 , C09J7/10 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/85 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29387 , H01L2224/32145 , H01L2224/83191 , H01L2224/83885 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2224/48 , H01L2924/05442 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： 본 발명은 125℃에서 10분의 제1 단계, 150℃에서 5분의 제2 단계, 175℃에서 1분의 제3 단계, 및 175℃에서 1시간의 제4 단계의 경화 공정 중, 상기 제1 단계에서의 DSC 경화율이 전체 경화율 100% 대비 40% 이하이며, 제4 단계의 DSC 경화율은 상기 제3 단계의 경화율 대비 30% ~ 60%의 상승률을 갖으며, 제2 단계 및 제3 단계는 전 단계의 DSC 경화율 대비 5% 이상의 상승률을 갖는 것을 특징으로 하는, 반도체 접착 필름에 관한 것이다.
摘要翻译：本发明的特征在于，在125分钟的第一步10分钟，第二步150分钟5分钟，第三步175分钟1分钟，第四步175步的固化步骤1小时，第一步骤中的DSC固化速率为总固化速度100％的40％或更少，第四步骤中的DSC固化速率为第三步骤中固化速度的30％至60％第三步相对于前一步的DSC固化速率增加5％或更多。

3. 发明公开

KR1020130072800A 반도체용 접착 조성물 및 이를 포함하는 접착 필름 有权
标题翻译：用于半导体的粘合组合物，包括其的粘合膜
公开(公告)号：KR1020130072800A
公开(公告)日：2013-07-02
申请号：KR1020110140386
申请日：2011-12-22
申请人： 제일모직주식회사
发明人： 이준우 , 김성민 , 김인환 , 박백성 , 임수미 , 최재원
IPC分类号： C09J7/02 , C09J11/06 , C09J163/00 , H01L21/02
CPC分类号： C09J163/00 , C08K5/0025 , C08K5/3445 , C08L63/00 , C09J7/00 , C09J7/10 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/85 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29387 , H01L2224/32145 , H01L2224/83191 , H01L2224/83885 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2224/48 , H01L2924/05442 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , C09J7/35 , C09J7/22 , C09J11/06 , H01L21/02002 , H01L21/6836
摘要： PURPOSE: An adhesive composition for a semiconductor with excellent adhesion and reflow resistance is provided to restrain void expansion and generation due to sudden heating. CONSTITUTION: During a manufacturing process of a semiconductor adhesive film consisting of 10 minutes first step at 125 °C, a 5 minutes second step at 150 °C, a 1 minute third step at 175 °C, and a 1 hours fourth step at 175 °C, a DSC curing ratio at the first step is 40% or less based on 100% final curing ratio, a DSC curing ratio at the fourth step is 30-60% of a DSC curing ratio at the third step, and DSC curing ratios at the second step and the third step are increased by 5% or more from DSC ratio of the previous step.
摘要翻译：目的：提供具有优异的粘合性和耐回流性的半导体用粘合剂组合物，以抑制由于突然加热引起的空隙膨胀和产生。构成：在半导体粘合剂薄膜的制造过程中，在125℃下进行10分钟的第一步骤，在150℃下进行5分钟的第二步骤，在175℃下进行1分钟的第三步骤，在175℃下进行1小时的第四步骤 ℃时，基于100％最终固化比，第一步骤的DSC固化比为40％以下，第四步的DSC固化率为第三步骤的DSC固化率的30-60％，DSC固化第二步骤和第三步骤的比例比前一步骤的DSC比增加5％或更多。

4. 发明公开

KR1020090060684A ＵＶ선 경화형 반도체 조립용 접착필름 조성물 및 이를이용한 접착필름 有权
标题翻译：用于半导体组件的PRE-UV可固化型粘合膜组合物和使用其的粘合膜
公开(公告)号：KR1020090060684A
公开(公告)日：2009-06-15
申请号：KR1020070127598
申请日：2007-12-10
申请人： 제일모직주식회사
发明人： 편아람 , 정기성 , 정창범 , 김완중 , 홍용우 , 정철 , 임수미 , 김상진
IPC分类号： C09J163/00 , C09J133/08 , C09J7/02
CPC分类号： C09J7/00 , C09J133/08 , C09J163/00 , C09J2203/326
摘要： A bonding film composition for a semiconductor assembly is provided to lower tack value, to increase tensile strength by pre-curing UV curable acrylate after drying the adhesive film, and to improve pick-up success rate and processability. A bonding film composition for a semiconductor assembly comprises an elastomer resin containing a hydroxyl group or a carboxyl group, and an epoxy group; a film-forming resin having a glass transition temperature (Tg) of 0~200 °C; an epoxy resin, a phenolic epoxy resin hardening agent; a UV curable polyfunctional acrylate; a photopolymerization initiator; a silane coupling agent; and filler.
摘要翻译：提供一种用于半导体组件的接合膜组合物以降低粘性值，通过在干燥粘合剂膜之后预固化UV可固化丙烯酸酯来提高拉伸强度，并提高拾取成功率和加工性。用于半导体组合物的接合膜组合物包括含有羟基或羧基的弹性体树脂和环氧基; 玻璃化转变温度（Tg）为0〜200℃的成膜树脂; 环氧树脂，酚醛环氧树脂硬化剂; UV可固化多官能丙烯酸酯; 光聚合引发剂; 硅烷偶联剂; 和填料。

5. 发明公开

KR1020080037387A 반도체 조립용 접착 필름 조성물, 이에 의한 접착 필름 및이를 포함하는 다이싱 다이본드 필름 有权
标题翻译：用于半导体组件的粘合膜组合物，其粘合膜和包含其的定影膜结合膜
公开(公告)号：KR1020080037387A
公开(公告)日：2008-04-30
申请号：KR1020060104450
申请日：2006-10-26
申请人： 제일모직주식회사
发明人： 홍용우 , 임수미 , 김완중 , 정기성 , 정창범
IPC分类号： C09J183/04 , C09J183/00 , C09J163/00 , C09J7/00
CPC分类号： B32B7/12 , B32B27/38 , C08G59/621 , C08G59/68 , C09J163/00 , Y10T428/25 , Y10T428/28 , Y10T428/2848 , Y10T428/31511
摘要： An adhesive film composition for assembling a semiconductor, an adhesive film formed by using the composition, and a dicing die bond film containing the adhesive film are provided to improve reliance and the storage stability for a long time. An adhesive film composition for assembling a semiconductor comprises 5-60 wt% of an elastomer resin having a total hydroxyl group, a carboxyl group or an epoxy group; 5-60 wt% of a film forming resin having a glass transition temperature of 0-200 deg.C; 5-40 wt% of an epoxy resin; 5-40 wt% of a phenolic resin represented by the formula 1; 0.01-10 wt% of a curing accelerator; 0.01-10 wt% of a silane coupling agent; and 3-60 wt% of a filler, wherein R1 and R2 are independently a C1-C4 alkyl group or H; a and b are 0-4; and n is an integer of 0-7.
摘要翻译：提供用于组装半导体的粘合膜组合物，使用该组合物形成的粘合膜以及含有粘合膜的切割模接合膜，以提高长时间的依赖性和储存稳定性。用于组装半导体的粘合膜组合物包含5-60重量％的具有总羟基，羧基或环氧基的弹性体树脂; 5-60重量％的玻璃化转变温度为0-200℃的成膜树脂; 5-40重量％的环氧树脂; 5-40重量％的由式1表示的酚醛树脂; 0.01〜10重量％的固化促进剂; 0.01-10重量％的硅烷偶联剂; 和3-60重量％的填料，其中R1和R2独立地为C1-C4烷基或H; a和b为0-4; n为0〜7的整数。

6. 发明公开

KR1020130075189A 다이싱 다이본딩 필름 有权
标题翻译：定制电影胶片
公开(公告)号：KR1020130075189A
公开(公告)日：2013-07-05
申请号：KR1020110143455
申请日：2011-12-27
申请人： 제일모직주식회사
发明人： 박백성 , 최재원 , 김성민 , 김인환 , 이준우 , 임수미
IPC分类号： C09J7/02 , H01L21/58
CPC分类号： H01L23/544 , C09J7/20 , C09J2201/28 , C09J2201/36 , C09J2203/326 , H01L21/6836 , H01L21/70 , H01L24/27 , H01L2221/68327 , H01L2224/83191 , C09J7/22 , C09J7/30 , C09J2205/10
摘要： PURPOSE: A dicing die bonding film is provided to prevent the degradation of adhesion and separation between a film and a ring frame by removing water and/or air being put in during a semiconductor-manufacturing process through a groove formed on the adhesive part between the film and the ring frame. CONSTITUTION: A dicing die bonding film includes a substrate film; an adhesive film laminated on the substrate film; a viscous layer (110,120); an adhesive layer (130) laminated on the viscous layer; and a release film laminated on the adhesive film. A groove (300) is formed on the adhesive part between the viscous layer and a ring frame. A manufacturing method of the dicing die bonding film includes a step of forming the groove on the dicing die bonding film by inserting a blade, which penetrates through the substrate film and a part of the viscous layer, on which the adhesive layer is not laminated, up to a height not penetrating the release film.
摘要翻译：目的：提供一种切割芯片接合薄膜，以通过除去在半导体制造过程中通过形成在粘合剂部分之间的凹槽中的水和/或空气而防止薄膜和环形框架之间的粘附和分离电影和戒指框架。构成：切割芯片接合膜包括基板膜; 层压在基材膜上的粘合膜; 粘性层（110,120）; 层压在粘性层上的粘合剂层（130）; 以及层压在粘合膜上的剥离膜。在粘性层和环形框架之间的粘合部分上形成有凹槽（300）。切割芯片接合薄膜的制造方法包括以下步骤：通过插入贯穿基片薄膜的粘合层和不粘合层的粘合层的一部分，形成切割晶片接合薄膜上的凹槽，达到不渗透释放膜的高度。

7. 发明授权

KR100962936B1 반도체 조립용 접착 필름 조성물 및 접착 필름 有权
标题翻译：用于半导体组件的粘合膜组合物及其粘合膜
公开(公告)号：KR100962936B1
公开(公告)日：2010-06-09
申请号：KR1020070134390
申请日：2007-12-20
申请人： 제일모직주식회사
发明人： 홍용우 , 김완중 , 임수미 , 편아람 , 정철 , 김상진 , 정창범
IPC分类号： C09J163/00 , C09J7/02 , C09J7/00
CPC分类号： H01L21/6836 , C08K5/50 , C08K5/5419 , C09D163/00 , C09J7/38 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L24/28 , H01L24/45 , H01L2221/68327 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , Y10T428/2848 , Y10T428/31515 , Y10T428/31522 , C08L2666/28 , H01L2924/3512 , H01L2924/00 , H01L2224/48
摘要： An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.

8. 发明授权

KR100934558B1 실란커플링제와 선반응된 페놀형 경화수지를 포함하는반도체 조립용 접착 필름 조성물 및 이에 의한 접착 필름 有权
标题翻译：一种半导体组装用粘接膜组合物，其含有硅烷偶联剂和与该硅烷偶联剂预反应的酚型固化树脂及粘接膜
公开(公告)号：KR100934558B1
公开(公告)日：2009-12-29
申请号：KR1020070100947
申请日：2007-10-08
申请人： 제일모직주식회사
发明人： 홍용우 , 정기성 , 김완중 , 임수미 , 김상진 , 정창범
IPC分类号： C09J183/04 , C09J163/00 , C09J11/00
CPC分类号： H01L24/29 , C08L21/00 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/06 , C08L2666/22 , C09J7/38 , C09J161/06 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/45124 , H01L2224/45144 , H01L2224/83191 , H01L2224/8385 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1461 , H01L2924/181 , Y10T156/10 , Y10T428/2848 , Y10T428/287 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2224/48
摘要： 본 발명은 수산기, 카르복시기 또는 에폭시기를 함유하는 엘라스토머 수지, 필름형성수지, 실란커플링제 선반응된 페놀형 경화수지, 에폭시 수지, 경화촉진제, 및 충진제를 포함하는 반도체 조립용 접착필름 조성물에 관한 것으로서, 실란 커플링제를 경화제와 선반응시켜 알코올, 수분, 휘발성 반응부산물 등의 휘발성분을 제거함으로써 보이드 및 기포 발생을 최소화하는 고신뢰성 반도체용 접착필름을 제공할 수 있다.
반도체 조립용 접착필름, 고신뢰성, 보이드, 실란커플링제 선반응, 페놀형 경화제, 에폭시수지, 휘발성분, 내리플로우성, 다이쉐어강도,
摘要翻译：本发明涉及一种弹性体树脂，成膜树脂，硅烷试剂线反应酚类硫化树脂耦合，环氧树脂，固化促进剂，以及用于包括具有羟基，羧基或环氧基的填料的半导体组件的粘合膜组合物，通过硅烷偶联剂，固化剂和反应线可以提供醇，水，通过除去挥发性组分，例如作为副产物的空隙和密合性的高可靠性的半导体挥发性反应以减少空气夹带膜。

9. 发明公开

KR1020090103434A 반도체 조립용 접착 필름용 조성물, 이에 의한 접착 필름및 이를 포함하는 다이싱 다이 본드 필름 无效
标题翻译：用于半导体组件的粘合膜组合物，使用其的粘合膜和包含该粘合剂的粘合膜
公开(公告)号：KR1020090103434A
公开(公告)日：2009-10-01
申请号：KR1020080029048
申请日：2008-03-28
申请人： 제일모직주식회사
发明人： 정철 , 김완중 , 정기성 , 홍용우 , 정창범 , 편아람 , 임수미 , 김상진
IPC分类号： C09J7/00
CPC分类号： C09J201/06 , C08L63/00 , C09J9/00 , C09J11/04 , C09J11/06 , C09J11/08 , C09J161/06 , C09J201/08 , C09J2203/326
摘要： PURPOSE: An adhesive film composition for a semiconductor assembly is provided to suppress the generation of burr in dicing by controlling storage modulus before hardening and to prevent damage of products caused by chip crack generated by chipping. CONSTITUTION: An adhesive film composition for a semiconductor assembly includes an elastomeric resin, a film-forming resin, an epoxy-based resin, a phenol hardener, a curing catalyst, a silane coupling agent and inorganic filler. The elastomeric resin contains a hydroxyl group or carboxy group, and an epoxy group. The adhesive film is formed by the composition. A Dicing Die Bonding Film is such that a tackifier layer(2) and an adhesive layer(3) on a base film.
摘要翻译：目的：提供一种用于半导体组件的粘合膜组合物，用于通过控制硬化前的储能模量来抑制切割中的毛刺产生，并且防止由于碎裂而产生的切屑产生的产品损坏。构成：用于半导体组件的粘合膜组合物包括弹性体树脂，成膜树脂，环氧基树脂，酚固化剂，固化催化剂，硅烷偶联剂和无机填料。弹性体树脂含有羟基或羧基，和环氧基。粘合膜由该组合物形成。切割片接合膜是使基底膜上的增粘剂层（2）和粘合剂层（3）。

10. 发明公开

KR1020090065669A 반도체 조립용 접착 필름 조성물, 이에 의한 접착 필름 및이를 포함하는 다이싱 다이본드 필름 有权
标题翻译：用于半导体组件的粘合膜组合物，其粘合膜和包含其的定影膜结合膜
公开(公告)号：KR1020090065669A
公开(公告)日：2009-06-23
申请号：KR1020070133086
申请日：2007-12-18
申请人： 제일모직주식회사
发明人： 임수미 , 홍용우 , 김완중 , 정철 , 편아람 , 김상진 , 정창범
IPC分类号： C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC分类号： C09J7/00 , C09J7/38 , C09J163/00 , C09J183/04 , C09J2203/326 , C09J2205/102 , C09J2421/00 , C09J2463/00 , H01L21/6835 , H01L21/6836 , H01L24/28
摘要： An adhesive film composition for the assembly of a semiconductor is provided to increase the releasing of an adhesive film for preventing the fixation between films and to lower peel strength. An adhesive film composition for the assembly of a semiconductor comprises the modified silicone oil represented by the formula 1, an elastomeric resin containing a hydroxyl group or a carboxy group, a thermoplastic resin, an epoxy-based resin, a phenol curing agent, a curing catalyst, a silane coupling agent and a filler.
摘要翻译：提供了用于组装半导体的粘合膜组合物以增加用于防止膜之间的固定的粘合剂膜的释放并降低剥离强度。用于组装半导体的粘合膜组合物包含由式1表示的改性硅油，含有羟基或羧基的弹性体树脂，热塑性树脂，环氧基树脂，酚固化剂，固化催化剂，硅烷偶联剂和填料。

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