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    • 1. 发明公开
    • 복합동박 및 복합동박의 제조방법
    • 复合铜箔和制造复合铜箔的方法
    • KR1020140100401A
    • 2014-08-14
    • KR1020130152780
    • 2013-12-10
    • 제이엑스금속주식회사
    • 고토지즈루아오야마다쿠야
    • B32B15/01H05K1/03H05K1/09
    • Disclosed are composite copper foil and a method for manufacturing composite copper foil which has a high adhesion performance with a base material while maintaining the transmittance of the base material. A rolled copper foil, a copper plating layer formed on at least the side surface of the rolled copper foil, and a rough copper plating layer formed on the copper plating layer and having rough particles in which the average particle size is 0.05-0.30 um are included. The ratio of a maximum particle size and a minimum particle size of the rough particle is 65% or less. The rough particles are continued on the copper plating layer over the distance of 20 um or greater on the cut surface in which the rough copper plating layer is cut in a thickness direction.
    • 公开了复合铜箔和复合铜箔的制造方法,其在保持基材的透射率的同时具有与基材的高粘合性能。 在轧制铜箔的至少侧面上形成的轧制铜箔,铜镀层以及形成在镀铜层上并具有平均粒径为0.05〜0.30μm的粗糙粒子的粗铜镀层为 包括在内。 粗粒子的最大粒径和最小粒径的比例为65%以下。 在粗铜层在厚度方向切割的切割面上,在铜镀层上继续粗糙粒子20μm以上的距离。