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1. 发明公开

KR1020000038924A 반도체 패키지 제조방법 无效
标题翻译：半导体封装的制造方法
公开(公告)号：KR1020000038924A
公开(公告)日：2000-07-05
申请号：KR1019980054095
申请日：1998-12-10
申请人： 앰코 테크놀로지 코리아 주식회사
发明人： 이수현 , 이병연
IPC分类号： H01L23/18
摘要： PURPOSE: A manufacturing method of a semiconductor package is provided to effectively and safely detach a semiconductor chip from a wafer adhesive tape. CONSTITUTION: A plurality of a semiconductor chips are formed in a wafer, and are then separated into individual chips(11) through a wafer sawing process. The separated individual chips for packaging are adhered to a wafer adhesive tape(13). An equipment(16) such as a lamp for applying ultraviolet rays is employed for a chip detaching process. When the equipment(16) applies the ultraviolet rays to the wafer adhesive tape(13), adhesive strength between the tape(13) and the chips(11) is considerably weakened. Next, a vacuum tool(14) picks up the individual chip(11), so that the individual chip(11) is fully detached from the adhesive tape(13). An eject tool for pushing up the bottom of the chip(11) may be also used together with the vacuum tool(14).
摘要翻译：目的：提供半导体封装的制造方法，以有效且安全地将半导体芯片与晶片胶带分离。构成：在晶片中形成多个半导体芯片，然后通过晶片锯切工艺将其分离成独立的芯片（11）。分离的用于包装的单个芯片粘附到晶片胶带（13）上。诸如用于施加紫外线的灯的设备（16）被用于芯片脱离过程。当设备（16）将紫外线施加到晶片胶带（13）时，胶带（13）和芯片（11）之间的粘合强度明显变弱。接下来，真空工具（14）拾取单个芯片（11），使得单个芯片（11）从胶带（13）完全分离。用于向上推动芯片（11）的底部的弹出工具也可以与真空工具（14）一起使用。

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