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    • 1. 发明公开
    • 유리 적층체의 제조 방법 및 전자 디바이스의 제조 방법
    • 制造玻璃层压板的方法及制造电子设备的方法
    • KR1020140049950A
    • 2014-04-28
    • KR1020130124485
    • 2013-10-18
    • 아사히 가라스 가부시키가이샤
    • 우치다다이스케고가네자와고지히노유이치가쿠타준이치
    • B32B37/02B32B37/26B32B17/10
    • Y02P20/582
    • The present invention relates to a method for producing a glass laminate, wherein the method comprises: a composition layer producing process of producing an unhardened hardening resin composition layer on a support substrate by coating the support substrate with a hardening resin composition that contains organopolysiloxane having an alkenyl group, organopolysiloxane having a hydrogen atom bonded to a silicon atom, a metallic platinum catalyst, a reaction inhibitor, and a solvent having a higher boiling point than the reaction inhibitor; a first removing process of removing the reaction inhibitor from the hardening resin composition layer; a second removing process of obtaining a support substrate equipped with a resin layer by removing the solvent from the hardening resin composition layer after the first removing process; and a laminating process of obtaining a glass laminated having a glass substrate by laminating the glass substrate on the resin layer in order to be delaminated. [Reference numerals] (AA) Start; (BB) Finish; (S102) Composition layer producing process; (S104) First removing process; (S106) Second removing process; (S108) Laminating process; (S110) Member producing process; (S112) Separating process
    • 玻璃层叠体的制造方法技术领域本发明涉及玻璃层叠体的制造方法,其特征在于,所述方法包括:通过用含有有机聚硅氧烷的硬化树脂组合物涂布所述载体基板,在支撑基板上制造未硬化的树脂组合物层的组合物层制造方法, 烯基,具有与硅原子键合的氢原子的有机聚硅氧烷,金属铂催化剂,反应抑制剂和比反应抑制剂沸点高的溶剂; 从硬化树脂组合物层除去反应抑制剂的第一除去方法; 第二去除方法,其通过在第一除去过程之后从固化树脂组合物层中除去溶剂来获得装备有树脂层的支撑基板; 以及通过将玻璃基板层叠在树脂层上以分层而获得具有玻璃基板的玻璃层压的层压工艺。 (附图标记)(AA)开始; (BB)完成; (S102)组合物层制造工序; (S104)首先移除处理; (S106)二次除去处理; (S108)层压工艺; (S110)会员制作流程; (S112)分离处理
    • 2. 发明公开
    • 도전성 적층체
    • 导电层压板
    • KR1020100057032A
    • 2010-05-28
    • KR1020107005344
    • 2008-09-18
    • 아사히 가라스 가부시키가이샤
    • 모리노마사유키다케모토가즈야미야자와히데아키도미다미치히사모리모토다모츠히노유이치
    • H05K9/00B32B15/04G02B1/11H01J11/44
    • H05K9/0088Y10T428/26Y10T428/31678
    • A conductive laminate which has wide transmission and reflective bands and is excellent in conductivity (electromagnetic shielding ability), visible light permeability, antireflection ability against visible light, near infrared ray shielding ability and moisture resistance, and an electromagnetic shield using the laminate for use in a plasma display or the like. The conductive laminate (20) has a substrate (21) and a conductive film (22) formed on the substrate (21). The conductive film (22) is a multilayer structure comprising, from the substrate (21), a total of 2n+1 (where n refers to an integer of 1 to 12) highly refractive layers (23a-23e) and metallic layers (24a-24d) which are alternately laminated in this sequence and having a carbon hydride layer (25) at the farthest position from the substrate (21). A refractive index of the highly refractive layers (23a-23e) ranges from 1.5 to 2.7.The carbon hydride layer (25) contains carbon atoms and hydrogen atoms with a hydrogen atom content of 9-50 atom%. The conductive laminate is thus characterized.
    • 具有宽透射率和反射带,导电性(电磁屏蔽能力),可见光透过性,对可见光的抗反射能力,近红外线屏蔽能力和耐湿性优异的导电层压体,以及使用该层叠体的电磁屏蔽 等离子体显示器等。 导电性层叠体(20)具有形成在基板(21)上的基板(21)和导电膜(22)。 导电膜(22)是从基板(21)至少包含2n + 1(n为1〜12的整数)高折射层(23a〜23e)和金属层(24a)的多层结构体 -24d),其以该顺序交替层压,并且在离基板(21)最远的位置具有碳氢化物层(25)。 高折射层(23a-23e)的折射率为1.5-27.碳氢化物层(25)含有碳原子和氢原子数为9〜50原子%的氢原子。 因此,导电层压板被表征。
    • 4. 发明公开
    • 수지층 부착 지지 기판의 제조 방법, 유리 적층체의 제조 방법 및 전자 디바이스의 제조 방법
    • 用树脂层支撑衬底的制造方法,玻璃层压体的制造方法和电子器件的制造方法
    • KR1020150070978A
    • 2015-06-25
    • KR1020140182334
    • 2014-12-17
    • 아사히 가라스 가부시키가이샤
    • 히노유이치오츠보유타카나가노다쿠야시라쿠라가츠미치다카다고스케
    • B32B37/06B32B37/12B32B17/10
    • 본발명은지지기판과지지기판의편면에형성된실리콘수지층을갖고, 상기실리콘수지층상에유리기판을적층하여유리적층체를제조하기위해서사용되는수지층부착지지기판의제조방법으로서, 경화성실리콘과용매를포함하는경화성실리콘조성물을상기지지기판상에도포하여상기지지기판상에경화성실리콘조성물층을형성하고, 상기지지기판및 상기경화성실리콘조성물층을구비하는경화성층부착지지기판을얻는도포공정과, 가열처리장치내에상기경화성층부착지지기판을반입하고, 상기가열처리장치내의지지핀 상에상기경화성층부착지지기판을적재하는반입공정과, 상기경화성층부착지지기판의상기경화성실리콘조성물층상부에가열플레이트를배치하여배기를행하면서상기경화성층부착지지기판에제1 온도이하에서가열처리를행하고, 상기경화성실리콘조성물층에잔존하는상기용매를제거하는제1 가열공정과, 상기제1 가열공정후, 상기가열처리가실시된상기경화성실리콘조성물층과상기가열플레이트를멀어지게하는이동공정과, 상기가열처리장치로부터상기경화성층부착지지기판을반출하는반출공정과, 상기경화성층부착지지기판에상기제1 온도보다높은제2 온도에서가열처리를행하고, 실리콘수지층을얻는제2 가열공정을이 순서로구비하는수지층부착지지기판의제조방법에관한것이다.
    • 本发明涉及一种具有附着树脂层的支撑基板的制造方法,该树脂层包括支撑基板和硅树脂层,并且用于通过在硅树脂层上层压玻璃基板来制造玻璃层叠体。 该方法包括:通过在支撑基板上涂布包括可固化硅和溶剂的可固化硅组合物,在支撑基板上形成可固化硅组合物层的应用过程,然后获得包含支撑基板和 硅组成层; 将可固化层附着支撑基板插入热处理装置中,然后将可固化层附着支撑基板堆叠在热处理装置中的支撑销上的插入过程; 在可固化层安装支撑基板的可固化硅组合物层的上侧布置加热板的第一加热过程,执行通风,在第一温度或更低温度下对可固化层附着支撑基板进行加热处理,以及去除 残留在可固化硅组合物层上的溶剂; 在第一加热处理之后将可固化硅组合物层与加热板分开的移动过程; 从所述加热处理装置提取所述可固化层附着支撑基板的提取工序; 以及在高于第一温度的第二温度下对可固化层附着支撑基板进行热处理的第二加热过程。
    • 5. 发明公开
    • 유리 적층체의 제조 방법 및 전자 디바이스의 제조 방법
    • 玻璃层压体的制造方法及电子装置的制造方法
    • KR1020150070977A
    • 2015-06-25
    • KR1020140182321
    • 2014-12-17
    • 아사히 가라스 가부시키가이샤
    • 히노유이치오츠보유타카나가노다쿠야우츠기히로시미야고에다츠조
    • B32B37/00B32B37/06B32B15/08
    • 본발명은지지기판, 실리콘수지층및 유리기판을이 순서로갖는유리적층체의제조방법으로서, 제1 주면및 제2 주면을갖는지지기판및 상기지지기판의상기제1 주면상에배치된경화성실리콘조성물층을구비하는경화성층부착지지기판을상기지지기판의상기제2 주면측으로부터복수의지지핀으로지지하여상기경화성층부착지지기판에가열처리를실시하고, 실리콘수지층을형성하는가열공정과, 상기가열공정후에상기실리콘수지층상에유리기판을적층하는적층공정과, 상기적층공정후에, 또는상기가열공정후이고상기적층공정전에, 적어도상기지지기판의상기제2 주면에코로나처리, 플라즈마처리, 및 UV오존처리로이루어지는군으로부터선택되는적어도하나의처리를실시하는표면처리공정을구비하는유리적층체의제조방법에관한것이다.
    • 本发明涉及依次制造具有支撑基板,硅树脂层和玻璃基板的玻璃层叠体的方法。 该方法包括:使用多个支撑销支撑具有第一主侧和第二主侧的支撑基板以及包括布置在第一侧上的可固化硅组合物层的可固化层附接支撑基板的讨厌过程 从所述支撑基板的第二主面侧支撑所述支撑基板,加热所述固化层附着支撑基板,形成硅树脂层; 在加热处理之后将玻璃基板层叠在硅树脂层上的层叠工序; 以及在支撑基板的第二主侧上执行选自由电晕处理,等离子体处理和UV臭氧处理组成的组中的至少一种处理的表面处理工艺。