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    • 3. 发明公开
    • 레지스트 조성물 및 레지스트 패턴의 제조 방법
    • 耐蚀组合物及其制造方法
    • KR1020130010855A
    • 2013-01-29
    • KR1020120078194
    • 2012-07-18
    • 스미또모 가가꾸 가부시키가이샤
    • 이찌까와,고지히라오까,다까시오찌아이,미쯔요시
    • G03F7/004G03F7/038G03F7/26G03F7/20
    • G03F7/0045G03F7/0046G03F7/0397G03F7/2041G03F7/004G03F7/0382G03F7/2002G03F7/26
    • PURPOSE: A resist composition is provided to be used for micro-processing a semiconductor by obtaining a sufficiently deep focus margin(DOF) with little defects. CONSTITUTION: A resist composition comprises a resin which has a structure unit indicated in chemical formula 1 and comprises an insoluble or poorly soluble into an alkali water solution but can be soluble into the alkali water solution by acid, and comprises a resin which does not comprises a resin indicated in chemical formula 1, and an acid-generator which is indicated in chemical formula 2. In chemical formula 1, R1 is hydrogen or a methyl group, A1 is a C1-C6 alkanediyl group, A13 is a C1-C18 divalent aliphatic hydrocarbon group which can have one or more halogen atoms. X12 is *-CO-O- or *-O-CO-, where * is a bond to A13, and A14 is a C1-C17 aliphatic hydrocarbon group which can have one or more halogen atoms. In chemical formula 2, each of Q1 and Q2 is independently a fluorine atom or a C1-C6 perfluoroalkyl, and L1 is a C1-C7 divalent saturated hydrocarbon group in which one or more -CH2- can be substituted by -O- or -CO-, and a ring Wb1 is a C2-C36 heterocycle.
    • 目的:提供一种抗蚀剂组合物,用于通过获得足够深的聚焦余量(DOF),几乎没有缺陷来用于微加工半导体。 构成:抗蚀剂组合物包含具有化学式1所示结构单元的树脂,其包含不溶于或难溶于碱水溶液但可通过酸溶于碱水溶液中的树脂,并且包含不包含 化学式1表示的树脂和化学式2表示的酸发生剂。在化学式1中,R1是氢或甲基,A1是C1-C6烷二基,A13是C1-C18二价 可以具有一个或多个卤素原子的脂族烃基。 X12是* -CO-O-或* -O-CO-,其中*是与A13的键,A14是可以具有一个或多个卤素原子的C 1 -C 17脂族烃基。 在化学式2中,Q1和Q2各自独立地为氟原子或C1-C6全氟烷基,L1为C1-C7二价饱和烃基,其中一个或多个-CH 2 - 可以被-O-或 - CO-,环Wb1是C2-C36杂环。