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    • 2. 发明公开
    • 기체 연마 방법, 반도체장치 및 그 제조 방법
    • 基板抛光方法,半导体器件及其制造方法
    • KR1020080076712A
    • 2008-08-20
    • KR1020080001652
    • 2008-01-07
    • 소니 주식회사
    • 나카무라히로코코즈키타카아키에노모토타카유키야마모토유이치
    • H01L21/304
    • H01L21/31053C09G1/02H01L27/10894
    • A substrate polishing method, a semiconductor device, and a method for manufacturing the same are provided to improve the reliability by forming an upper pattern with excellent precision on an interlayer oxide layer. A substrate polishing method includes planarizing a polished layer by performing a chemical and mechanical processing from a polished oxide layer on a substrate using at least two kinds of slurries. At least two kinds of slurries are composed of oxide cerium polishing particles having different BET(Brunaure Emmett Teller). The chemical and mechanical processing includes polishing a polished oxide layer of a part on which a lower pattern is densely formed using a slurry composed of an oxide cerium polishing particle having a first BET, and polishing a polished oxide layer of a part on which the lower pattern is densely not formed using a slurry composed of an oxide cerium polishing particle having a second BET less than the first BET.
    • 提供基板研磨方法,半导体装置及其制造方法,以通过在层间氧化物层上形成具有优异精度的上部图案来提高可靠性。 基板抛光方法包括使用至少两种浆料从基板上的抛光氧化物层进行化学和机械加工来平坦化抛光层。 至少两种浆料由具有不同BET(Brunaure Emmett Teller)的氧化铈抛光颗粒组成。 化学和机械加工包括使用由具有第一BET的氧化铈抛光颗粒组成的浆料来研磨其上密集形成下部图案的部分的抛光氧化物层,并且抛光其下部的部分的抛光氧化物层 使用由比第一BET小的第二BET的氧化铈抛光颗粒构成的浆料密集地形成图案。
    • 4. 发明公开
    • 마이크로머신의 제조방법
    • 制造微电脑的方法,包括安装在基板的停止层表面的电极
    • KR1020040111013A
    • 2004-12-31
    • KR1020040042251
    • 2004-06-09
    • 소니 주식회사
    • 야마모토유이치
    • B81B3/00B81B7/00
    • B81C1/00611B81B2201/0271B81C2201/0125H03H3/0072
    • PURPOSE: A method for manufacturing a micro machine is provided to improve output precision of the micro machine by fabricating a capacitor with a high precision and superior electrical characteristics. CONSTITUTION: A method for manufacturing a micro machine includes the steps of forming a first electrode on a surface of a stopper layer(14) of a substrate(10) and forming an insulation layer on the substrate(10). The thickness of the insulation layer is larger than the thickness of the first electrode including the stopper layer(14) so that the first electrode is covered with the insulation layer. Then, the insulation layer is polished such that the stopper layer is exposed. After forming an opening in the stopper layer(14), the opening is filled with a sacrificial layer. A second electrode is formed on the insulation layer by passing through the sacrificial layer.
    • 目的:提供一种制造微机的方法,通过制造具有高精度和优异电气特性的电容器来提高微机的输出精度。 构成:微机的制造方法包括在基板(10)的阻挡层(14)的表面上形成第一电极,在基板(10)上形成绝缘层的工序。 绝缘层的厚度大于包括阻挡层(14)的第一电极的厚度,使得第一电极被绝缘层覆盖。 然后,对绝缘层进行抛光,使得阻挡层露出。 在阻挡层(14)中形成开口后,开口填充有牺牲层。 通过穿过牺牲层在绝缘层上形成第二电极。