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    • 1. 发明公开
    • 베이크 장치
    • 包装设备
    • KR1020090070566A
    • 2009-07-01
    • KR1020070138613
    • 2007-12-27
    • 세메스 주식회사
    • 강운규함형원김성언
    • H01L21/324H01L21/02
    • H01L21/67098H01L21/324H01L21/67017
    • A bake apparatus is provided to prevent the change of heating and cooling temperatures of a cooling plate and a heating plate by including a heat blocking plate between the cooling plate and the heating plate. A housing(10) provides a space for performing a bake process inside. A cooling plate(20) and a heating plate(30) are installed inside a housing. A heat exhaust member(130) exhausts the heat air current to the outside of the housing. A support block(110) is installed to surround the side surface of the cooling plate and the heating plate. A transfer unit(40) is installed in one side of the support block and transfers the substrate between the heating plate and the cooling plate. The heat exhaust member is arranged between the transfer unit and the support block.
    • 提供一种烘烤装置,通过在冷却板和加热板之间设置隔热板来防止冷却板和加热板的加热和冷却温度的变化。 外壳(10)为内部进行烘烤处理提供了空间。 冷却板(20)和加热板(30)安装在壳体内。 排热构件(130)将热空气流排出到壳体的外部。 安装支撑块(110)以围绕冷却板和加热板的侧表面。 传送单元(40)安装在支撑块的一侧,并将基板传送到加热板和冷却板之间。 散热构件布置在转移单元和支撑块之间。
    • 2. 发明授权
    • 베이크 장치
    • 베이크장치
    • KR100933036B1
    • 2009-12-21
    • KR1020070138613
    • 2007-12-27
    • 세메스 주식회사
    • 강운규함형원김성언
    • H01L21/324H01L21/02
    • 본 발명은 반도체 베이크 공정을 수행하는 장치에 관한 것이다. 본 발명에 따른 베이크 장치는 내부에 베이크 공정이 수행되는 공간을 가지는 하우징, 하우징 내부에 설치되는 냉각플레이트 및 가열플레이트, 그리고 냉각플레이트 및 가열플레이트 사이에 배치되는 열차단판 및 냉각플레이트 및 가열플레이트로부터 발생되는 열을 효과적으로 배기시키는 열배기부재를 포함한다. 열배기부재는 냉각플레이트 및 가열플레이트로부터 발생되는 열을 수용받는 배기덕트 및 배기덕트 내 열기류를 장치 외부로 배출시키는 배출라인을 가진다. 본 발명은 냉각플레이트 및 가열플레이트로부터 발생되는 열을 효과적으로 처리하여 베이크 공정 효율을 향상시킨다.
      반도체, 베이크, 배기, 열, 냉각, 가열, 차단
    • 提供一种烘烤装置,通过在冷却板和加热板之间包括热阻挡板来防止冷却板和加热板的加热和冷却温度的变化。 壳体(10)为内部进行烘烤处理提供空间。 冷却板(20)和加热板(30)安装在壳体内。 排热构件(130)将热空气流排出到壳体的外部。 支撑块(110)安装成围绕冷却板和加热板的侧表面。 传送单元(40)安装在支撑块的一侧,并将基板传送到加热板和冷却板之间。 排热构件布置在传送单元和支撑块之间。
    • 3. 发明公开
    • 베이크 유닛 및 이를 이용한 기판처리방법
    • 烘烤单元和使用此处理基板的方法
    • KR1020080024301A
    • 2008-03-18
    • KR1020060088487
    • 2006-09-13
    • 세메스 주식회사
    • 강희영김태수임성환함형원
    • H01L21/324H01L21/477
    • H01L21/67098H01L21/324H01L21/67742H01L21/6835
    • A bake unit and a method for processing a substrate using the same are provided to prevent a wafer on a heating plate from being heated for a long time in generation of an error, and the damage of a pattern on the wafer by employing a buffer stage for the wafer. A wafer loaded through an entrance is located on a buffer stage(520) adjacent to the entrance. The wafer on the buffer stage is transferred to a cooling plate(300). A new wafer is located on the buffer stage. The wafer on the cooling plate is transferred to a heating plate(400). The wafer on the buffer stage is transferred to the cooling stage. Positions of the wafer on the heating plate and the wafer on the cooling plate are changed. The wafer on the cooling plate is transferred to the buffer stage. The wafer on the buffer stage is unloaded through the entrance. A new wafer is located on the buffer stage. The wafer on the buffer stage is transferred to the cooling plate. When an error is generated in a bake unit(140), the process is stopped and the wafer on the heating plate is transferred to the buffer stage.
    • 提供了一种烘烤单元和使用其的处理基板的方法,以防止加热板上的晶片长时间加热产生误差,并且通过采用缓冲台来损害晶片上的图案 用于晶圆。 通过入口装载的晶片位于与入口相邻的缓冲台(520)上。 缓冲台上的晶片被转移到冷却板(300)。 一个新的晶圆位于缓冲台上。 冷却板上的晶片被转移到加热板(400)。 缓冲台上的晶片转移到冷却阶段。 晶片在冷却板上的加热板和晶片上的位置被改变。 冷却板上的晶片转移到缓冲液段。 缓冲台上的晶片通过入口卸载。 一个新的晶圆位于缓冲台上。 缓冲台上的晶片被转移到冷却板。 当在烘烤单元(140)中产生错误时,停止处理,并将加热板上的晶片转移到缓冲层。
    • 5. 发明公开
    • 베이크 장치
    • 包装设备
    • KR1020090070568A
    • 2009-07-01
    • KR1020070138616
    • 2007-12-27
    • 세메스 주식회사
    • 강운규함형원김성언
    • H01L21/324H01L21/477
    • H01L21/67098H01L21/324H01L21/67742
    • A bake apparatus is provided to improve efficiency of a bake process by preventing the temperature of the substrate from being changed due to the heat from the cooling and heating plates by using a heat blocking member in a buffer unit. A housing provides a space for performing the process. A cooling plate(20) supports a substrate inside the housing and cools the substrate. A heating plate(30) supports and heats the substrate inside the housing. A buffer unit(100) is opposite to the cooling plate in the upper part of the cooling plate. A substrate inputted to the housing is on the standby before settling the substrate on the plate and drawing the processed substrate from the housing. The buffer unit includes the support plate where the substrate is loaded and the heat blocking member blocking the heat to the buffer unit.
    • 提供一种烘烤装置,通过在缓冲单元中使用隔热构件,通过防止由于来自冷却和加热板的热量而导致的基板温度的变化,从而提高烘烤过程的效率。 外壳为执行过程提供了空间。 冷却板(20)支撑壳体内的基板并冷却基板。 加热板(30)支撑并加热壳体内的基板。 缓冲单元(100)与冷却板上部的冷却板相对。 输入到壳体的基板在将基板沉积在板上并从壳体拉出处理的基板之前处于待机状态。 缓冲单元包括支撑板,其中衬底被加载,并且阻热构件将热量阻挡到缓冲单元。
    • 6. 发明授权
    • 베이크 장치
    • 베이크장치
    • KR100933034B1
    • 2009-12-21
    • KR1020070138616
    • 2007-12-27
    • 세메스 주식회사
    • 강운규함형원김성언
    • H01L21/324H01L21/477
    • A bake apparatus is provided to improve efficiency of a bake process by preventing the temperature of the substrate from being changed due to the heat from the cooling and heating plates by using a heat blocking member in a buffer unit. A housing provides a space for performing the process. A cooling plate(20) supports a substrate inside the housing and cools the substrate. A heating plate(30) supports and heats the substrate inside the housing. A buffer unit(100) is opposite to the cooling plate in the upper part of the cooling plate. A substrate inputted to the housing is on the standby before settling the substrate on the plate and drawing the processed substrate from the housing. The buffer unit includes the support plate where the substrate is loaded and the heat blocking member blocking the heat to the buffer unit.
    • 提供一种烘烤装置,通过使用缓冲单元中的热阻挡构件来防止基板的温度由于来自冷却板和加热板的热而改变,从而提高烘烤过程的效率。 一个住房为执行这个过程提供了一个空间。 冷却板(20)支撑壳体内部的基板并冷却基板。 加热板(30)支撑并加热壳体内的基板。 缓冲单元(100)与冷却板上部的冷却板相对。 输入到壳体的衬底在将衬底放置在板上并从壳体中拉出处理后的衬底之前处于备用状态。 缓冲单元包括装载基板的支撑板和阻挡热量到缓冲单元的热阻挡构件。
    • 7. 发明公开
    • 실링 어셈블리
    • 密封组件
    • KR1020090067379A
    • 2009-06-25
    • KR1020070135021
    • 2007-12-21
    • 세메스 주식회사
    • 강운구함형원
    • H01L21/02
    • A sealing assembly is provided to install uniformly and correctly a sealing part for maintaining a sealing state of a single space by combining a first part and a second part with each other. A sealing assembly(100) includes a ceiling unit(110), a fixing unit(120), and an exhausting unit(130). The ceiling unit is made of an elastic material. A single space is formed by combining a first and second parts with each other. The ceiling unit is inserted between facing sides of the first and second parts in order to seal the single space. The fixing unit is formed in the facing side of the first part or the facing side of the second part. The fixing unit includes a fixing groove(122) for fixing the sealing unit to the first part or the second part. The exhausting unit is connected to the fixing groove. The exhausting unit exhausts the residual air from the inside of the fixing groove to the outside while the sealing unit is fixed to the fixing unit in order to combine the first and second parts with each other.
    • 提供密封组件以均匀且正确地安装用于通过将第一部分和第二部分彼此组合来保持单个空间的密封状态的密封部分。 密封组件(100)包括天花板单元(110),固定单元(120)和排气单元(130)。 天花板单元由弹性材料制成。 通过将第一和第二部分彼此组合形成单个空间。 天花板单元插入在第一和第二部分的相对侧之间,以便密封单个空间。 固定单元形成在第一部分的相对侧或第二部分的相对侧上。 固定单元包括用于将密封单元固定到第一部分或第二部分的固定槽(122)。 排气单元连接到固定槽。 排气单元将固定槽内部的剩余空气排出到外部,同时将密封单元固定到定影单元,以便将第一和第二部件彼此组合。
    • 10. 发明公开
    • 기판 가열 장치의 가열판 제조 방법
    • 用于制造基板加热装置的加热板的方法
    • KR1020090125567A
    • 2009-12-07
    • KR1020080051735
    • 2008-06-02
    • 세메스 주식회사
    • 강운규김성언함형원
    • H01L21/324H01L21/027
    • H01L21/67103
    • PURPOSE: A method for manufacturing a hot plate of a substrate heating apparatus is provided to improve temperature uniformity of the heating apparatus for a substrate, by performing thermal treatment like hardness improvement and stress release. CONSTITUTION: A hot plate is processed by rough machining(S101). A first annealing is performed to improve hardness of the hot plate after rough machining(S102). A second annealing is performed to remove stress of the hot plate generated during the first annealing process(S103). The machined surface of the hot plate after the second annealing is precisely machined(S104). The surface of the hot plate after precise machining is coated(S105). A substrate is supported on the top of the hot plate by a number of lift pins.
    • 目的:提供一种用于制造基板加热装置的热板的方法,以通过进行诸如硬度改善和应力释放的热处理来改善基板加热装置的温度均匀性。 构成:通过粗加工处理热板(S101)。 进行第一退火以提高粗加工后的热板的硬度(S102)。 执行第二退火以消除在第一退火处理期间产生的热板的应力(S103)。 精加工第二次退火后的加热板加工面(S104)。 精加工后的热板表面被涂覆(S105)。 基板通过多个提升销支撑在热板的顶部上。