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1. 发明公开

KR1020080073617A 선택적 무전해 도금을 이용한 플렉서블 기판의 미세 금속배선 형성 방법 失效
标题翻译：通过电镀镀层在柔性基板上形成金属接线的方法
公开(公告)号：KR1020080073617A
公开(公告)日：2008-08-11
申请号：KR1020070034544
申请日：2007-04-09
申请人： 성균관대학교산학협력단
发明人： 이내응 , 김주환 , 설영국
IPC分类号： C23C18/16 , C23C18/54
摘要： A method for forming a fine metal wiring on a flexible substrate by selective electroless plating is provided to form the metal wiring, using a plasma surface process or the electroless plating so as to improve bonding ability between an organic substrate and the metal wiring and to form the metal wiring selectively. A method for forming a fine metal wiring(5) on a flexible organic substrate(1) by selective electroless plating comprises the steps of; providing the flexible organic substrate; forming a photosensitive insulator(3) on the substrate; patterning the photosensitive insulator, using an optical mask having a pattern(13); processing a plasma surface on one surface of the substrate(14); transferring an adsorption preventing film of a catalyst on the photosensitive insulator selectively; and forming the metal wiring, using an electroless plating or electroplating process. An inorganic thin film(12) is formed on the substrate.
摘要翻译：提供通过选择性化学镀在柔性基板上形成精细金属布线的方法，以使用等离子体表面处理或无电解电镀形成金属布线，从而提高有机基板与金属布线之间的接合能力，形成选择性地选择金属布线。通过选择性无电镀在柔性有机基板（1）上形成精细金属布线（5）的方法包括以下步骤：提供柔性有机基材; 在基板上形成感光绝缘体（3）; 使用具有图案（13）的光学掩模来图案化感光绝缘体; 在衬底（14）的一个表面上处理等离子体表面; 选择性地在感光绝缘体上转移催化剂的吸附防止膜; 并使用化学镀或电镀工艺形成金属布线。在基板上形成无机薄膜（12）。

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