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    • 10. 发明公开
    • 반도체 웨이퍼의 뒷면을 세정하는 반도체 세정 장비
    • 用于清洁半导体波导背面的半导体清洁装置
    • KR1020070001640A
    • 2007-01-04
    • KR1020050057237
    • 2005-06-29
    • 삼성전자주식회사
    • 최민호박성욱김진성이상근
    • H01L21/304
    • Semiconductor cleaning equipment for cleaning a back side of a semiconductor wafer is provided to prevent the damage of a front side of the wafer due to a contact by separating a center of the front side of the wafer from an upper side of a chuck. A process chamber(100) has an inner space. A plasma generating unit(140) generates plasma in the process chamber. A gas injection unit injects a cleaning gas into the process chamber. A chuck(110) is arranged in the process chamber. The chuck is loaded so that a back side of a wafer(W) faces upward. The back side of the wafer is cleaned by using the plasma cleaning gas. A center of a front side of the loaded wafer is separated from an upper surface of the chuck. A placing surface(112) where an edge of the front side of the wafer is placed is arranged on the upper surface of the chuck. The upper surface of the chuck located in the placing surface is separated from the center of the front side of the loaded wafer.
    • 提供了用于清洁半导体晶片的背面的半导体清洁设备,以防止由于通过将晶片的前侧的中心与卡盘的上侧分离而导致的接触造成的晶片正面的损坏。 处理室(100)具有内部空间。 等离子体产生单元(140)在处理室中产生等离子体。 气体注入单元将清洁气体注入到处理室中。 卡盘(110)布置在处理室中。 装载卡盘使得晶片(W)的背面朝上。 通过使用等离子体清洁气体清洁晶片的背面。 装载的晶片的前侧的中心与卡盘的上表面分离。 放置表面(112)的位置在晶片的前侧的边缘被放置在卡盘的上表面上。 位于放置表面的卡盘的上表面与加载的晶片的正面的中心分离。