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    • 2. 发明公开
    • 세라믹제품 제조방법
    • 制造陶瓷制品的方法
    • KR1020120136855A
    • 2012-12-20
    • KR1020110056038
    • 2011-06-10
    • 삼성전자주식회사
    • 배아현윤혜란이교리피재환양희승
    • B28B1/10B28B3/00C04B14/02
    • C04B35/14B28B1/082B28B3/022C04B33/10C04B35/111C04B35/486C04B35/565C04B35/6262C04B35/62665C04B35/6269C04B2235/604C04B2235/612C04B2235/9661
    • PURPOSE: A manufacturing method of a ceramic product is provided to remove sintering process by using a vacuum compression molding, and to reduce brittleness of a ceramic product by adding a binder. CONSTITUTION: A manufacturing method of a ceramic product comprises: a step(S120) of preparing a ceramic powder mixture by mixing an additive and a binder into a ceramic powder; a step of molding a ceramic product by vacuum vibration pressing the ceramic powder mixture. The ceramic powder comprises a fused ceramic powder. The fused ceramic powder is formed by melting ceramic material, cooling the same, and pulverizing the same. [Reference numerals] (S100) Heat-treating ceramic powder; (S110) Sorting powder; (S120) Preparing ceramic powder mixture; (S130) Vacuum vibration press molding; (S140) Hardening; (S150) Polishing
    • 目的:提供陶瓷制品的制造方法,以通过使用真空压缩成型除去烧结工艺,并通过添加粘合剂来降低陶瓷制品的脆性。 构成:陶瓷制品的制造方法包括:通过将添加剂和粘合剂混合到陶瓷粉末中制备陶瓷粉末混合物的步骤(S120); 通过真空振动压制陶瓷粉末混合物来模制陶瓷产品的步骤。 陶瓷粉末包括熔融陶瓷粉末。 熔融陶瓷粉末通过熔化陶瓷材料形成,将其冷却并将其粉碎。 (附图标记)(S100)热处理陶瓷粉末; (S110)粉末分选; (S120)制备陶瓷粉末混合物; (S130)真空振动压力成型; (S140)硬化; (S150)抛光
    • 3. 发明公开
    • 키보드 제조장치 및 키보드 제조방법
    • 键盘的键盘制造装置和制造方法
    • KR1020130067973A
    • 2013-06-25
    • KR1020110135067
    • 2011-12-15
    • 삼성전자주식회사
    • 윤혜란배아현이교리이근호
    • G06F3/02B41J2/01
    • B41J3/4073B41J3/407B41J11/0015B41J11/002G06F3/02H01H13/88H01H2219/028H01H2229/00G06F3/0202B41J2/01
    • PURPOSE: A keyboard manufacturing device including an inkjet device for keyboards and a manufacturing method thereof are provided to improve the wear resistance of characters, numbers, symbols, and patterns printed on a keycap and to reduce manufacturing time. CONSTITUTION: A loading device(2) loads a keyboard and an unloading device(3) unloads the keyboard. A printing device(4) is prepared between the loading device and the unloading device and prints characters, symbols, numbers, and patterns on the keyboard. The printing device includes a support unit(5) fixing the keyboard and an inkjet device(10) printing the matters on the keyboards. The inkjet device includes inkjet heads containing ink having the same color as a specific color printed on the keyboard and a hardening machine located between the inkjet heads and drying the ink.
    • 目的:提供包括用于键盘的喷墨装置及其制造方法的键盘制造装置,以提高打印在键帽上的字符,数字,符号和图案的耐磨性,并减少制造时间。 构成:装载装置(2)装载键盘和卸载装置(3)卸载键盘。 在加载装置和卸载装置之间准备打印装置(4),并在键盘上打印字符,符号,数字和图案。 打印装置包括固定键盘的支撑单元(5)和在键盘上打印物品的喷墨设备(10)。 喷墨装置包括喷墨头,该喷墨头包含与打印在键盘上的特定颜色相同颜色的油墨,以及位于喷墨头之间并干燥油墨的硬化机。
    • 4. 发明公开
    • 잉크젯용 광 경화성 코팅 조성물 및 코팅방법
    • 喷墨固化涂料组合物,用于喷墨喷涂及其涂布方法
    • KR1020100067220A
    • 2010-06-21
    • KR1020080125689
    • 2008-12-11
    • 삼성전자주식회사
    • 박선미윤혜란이필우이근호김중현
    • C09D175/06B82B3/00B82Y30/00
    • C09D175/06
    • PURPOSE: A radiation-curable coating composition for an ink jet is provided to obtain excellent abrasion resistance and scratch resistance and to be environment-friendly and economically used without using an organic solvent. CONSTITUTION: A radiation-curable coating composition for an ink jet includes a photo-curable urethane acrylate resin in which nanosilica is dispersed. The photo-curable urethane acrylate resin comprises: a urethane acrylate oligomer in which the nanosilica is dispersed 100.0 parts by weight; acrylate monomer in which the nanosilica is dispersed 300 parts by weight; photoinitiator 20 parts by weight; and an additive. A method for coating the ink jet comprises the following steps: filling an ink jet head nozzle with the radiation-curable coating composition; discharging the filled coating composition to a substrate(200); and irradiating light to the substrate.
    • 目的:提供用于喷墨的可辐射固化涂料组合物以获得优异的耐磨性和耐擦伤性,并且在不使用有机溶剂的情况下是环境友好的和经济的。 构成:用于喷墨的可辐射固化涂料组合物包括其中分散有纳米二氧化硅的可光固化的聚氨酯丙烯酸酯树脂。 光固化性聚氨酯丙烯酸酯树脂包括:其中纳米二氧化硅分散在其中的氨基甲酸酯丙烯酸酯低聚物100.0重量份; 丙烯酸酯单体,其中纳米二氧化硅分散在300重量份; 光引发剂20重量份; 和添加剂。 涂布喷墨的方法包括以下步骤:用可辐射固化涂料组合物填充喷墨头喷嘴; 将填充的涂料组合物排出到基材(200)上; 并向基板照射光。
    • 5. 发明公开
    • 우레탄 아크릴레이트 올리고머 및 그 제조방법
    • URETHANE丙烯酸低聚物及其制备方法
    • KR1020100067219A
    • 2010-06-21
    • KR1020080125688
    • 2008-12-11
    • 삼성전자주식회사
    • 박선미윤혜란이근호임기열
    • C08G18/00C08L75/04C08K3/36B82Y30/00
    • PURPOSE: A urethane acrylate oligomer is provided to obtain excellent mechanical properties including abrasion resistance and adhesive force and to be used in a coating composition having superior adhesive force and smoothness. CONSTITUTION: A method for manufacturing a urethane acrylate oligomer in which nanosilica is dispersed comprises the followings steps: dispersing the nanosilica in an acrylate monomer; putting diisocyanat 100.0 parts by weight, acrylate monomer 150~180 parts by weight, and a catalyst into a reactor and reacting the materials at 23 ~ 27°C; putting more the acrylate monomer 120~200 parts by weight into the reactor and reacting the materials at 35 ~ 45 °C until NCO% becomes 12; and reacting the materials until NCO% becomes 0 and adding a polymerization inhibitor.
    • 目的:提供氨基甲酸酯丙烯酸酯低聚物以获得包括耐磨性和粘合力的优异的机械性能,并且用于具有优异的粘合力和平滑度的涂料组合物中。 构成:制造其中分散有纳米二氧化硅的氨基甲酸酯丙烯酸酯低聚物的方法包括以下步骤:将纳米二氧化硅分散在丙烯酸酯单体中; 将二异氰酸酯100.0重量份,丙烯酸酯单体150〜180重量份,催化剂加入反应器中,使材料在23〜27℃下反应; 将更多的丙烯酸酯单体120〜200重量份加入到反应器中,使材料在35〜45℃下反应直到NCO%变为12; 并使材料反应直到NCO%变为0并加入阻聚剂。
    • 7. 发明公开
    • 열가소성탄성체-수지 어레이를 포함하는 전자기기용 외장재
    • 包括弹性体 - 树脂合金的电极机外用材料
    • KR1020090117013A
    • 2009-11-12
    • KR1020080042869
    • 2008-05-08
    • 삼성전자주식회사
    • 배아현이근호윤혜란
    • H04B1/38
    • C08L75/04C08L69/00C08L2666/20C08L2666/18
    • PURPOSE: An exterior material for an electronic device including a thermoplastic Elastomer-resin array is provided to make the electronic device slim and light. CONSTITUTION: An exterior material for an electronic device receives electronic parts inside. The exterior material is formed by a thermoplastic Elastomer-resin array. The thermoplastic Elastomer-resin array contains thermoplastic Elastomer of 1 to 99 weight% and resin of 99 to 1 weight%. The thermoplastic Elastomer is one of TPU(Thermoplastic Urethane Elastomer), thermoplastic ester Elastomer, thermoplastic styrene Elastomer, thermoplastic olrefin Elastomer, thermoplastic polyvinyl chloride Elastomer and thermoplastic amide Elastomer.
    • 目的:提供一种用于包括热塑性弹性体 - 树脂阵列的电子设备的外部材料,以使电子设备变得纤薄和轻盈。 构成:用于电子设备的外部材料在其内部接收电子部件。 外部材料由热塑性弹性体 - 树脂阵列形成。 热塑性弹性体 - 树脂阵列含有1-99重量%的热塑性弹性体和99-1重量%的树脂。 热塑性弹性体是TPU(热塑性聚氨酯弹性体),热塑性弹性体,热塑性苯乙烯弹性体,热塑性烯烃弹性体,热塑性聚氯乙烯弹性体和热塑性酰胺弹性体之一。