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    • 1. 发明公开
    • 반도체 제조용 식각장비의 반응가스 공급시스템
    • 用于制造半导体的蚀刻设备的反应气体供应系统
    • KR1020040012052A
    • 2004-02-11
    • KR1020020045409
    • 2002-07-31
    • 삼성전자주식회사
    • 김남헌박수관
    • H01L21/3065
    • PURPOSE: A reaction gas supply system of etch equipment for fabricating a semiconductor is provided to supply process gas of a uniform pressure to a process chamber and minimize a process defect by mixing various reaction gases in a gas mixing unit to form process gas wherein the pressure of the reaction gases is firstly controlled through a plurality of individual supply lines and by including a gas stabilizing line in a united supply line such that the gas stabilizing line readjusts the pressure of the process gas through a final pressure adjusting unit. CONSTITUTION: Gas from a bombe in which various reaction gases are classified and filled is supplied to the plurality of individual supply lines(2). A plurality of valves(23), pressure control units(21) and mass flow controllers(22) are installed in the individual supply lines. An integrated supply line(4) generates the process gas generated by mixing the various reaction gases supplied from the individual supply lines. A final valve(41) is installed in the integrated supply line. The gas stabilizing line(3) in which the gas mixing unit(31) and a final pressure control unit(32) are installed is further included in the integrated supply line.
    • 目的:提供用于制造半导体的蚀刻设备的反应气体供应系统,以将均匀压力的处理气体提供给处理室,并且通过将气体混合单元中的各种反应气体混合以形成工艺气体来最小化工艺缺陷,其中压力 反应气体首先通过多个单独的供应管线控制,并且通过在联合供应管线中包括气体稳定管线,使得气体稳定管线通过最终压力调节单元重新调节工艺气体的压力。 构成:将来自分类和填充各种反应气体的炸弹的气体供给到多个单独的供给管线(2)。 多个阀(23),压力控制单元(21)和质量流量控制器(22)安装在各个供应管线中。 集成供应管线(4)产生通过混合从各个供应管线供应的各种反应气体产生的处理气体。 最终的阀(41)安装在集成供应管线中。 其中安装气体混合单元(31)和最终压力控制单元(32)的气体稳定管线(3)还包括在集成供应管线中。
    • 3. 发明公开
    • 포어라인 압력이 안정화된 반도체 제조용 멀티 챔버 장비
    • 用于制造具有稳定的压力的半导体的多室设备
    • KR1020030097022A
    • 2003-12-31
    • KR1020020034148
    • 2002-06-18
    • 삼성전자주식회사
    • 김남헌박수관
    • H01L21/02
    • PURPOSE: Multi-chamber equipment for fabricating a semiconductor with a stabilized foreline pressure is provided to prevent a vacuum pump from breaking down so that contaminated process byproducts don't flow backward, by uniformly maintaining a stabilized foreline pressure. CONSTITUTION: A plurality of chambers(20a,20b,20c) for fabricating the semiconductor are prepared. A gas supply unit supplies gas to the respective chambers. A turbomolecular pump(30a,30b,30c) is installed in each chamber to pump the gas and process byproducts inside the chamber. The gas and process byproducts pumped by the turbomolecular pump are exhausted through the foreline(35a,35b,35c) in which a pressure gauge is installed. A nitrogen supply line(53a,53b,53c,56a,56b,56c) supplies ballast nitrogen to the turbomolecular pump and the foreline to prevent a backflow of the process gas and process byproducts inside the chamber. A regulator is so installed in each nitrogen supply line to uniformly maintain the stabilized pressure of the foreline in each chamber.
    • 目的:提供用于制造具有稳定的前级管线压力的半导体的多腔室设备,以防止真空泵分解,使污染的过程副产物不会向后流动,通过均匀地保持稳定的前级管路压力。 构成:制备用于制造半导体的多个室(20a,20b,20c)。 气体供给单元向各个室供给气体。 涡轮分子泵(30a,30b,30c)安装在每个室中以泵送气体并处理室内的副产物。 通过涡轮分子泵泵送的气体和过程副产物通过其中安装压力计的前级管线(35a,35b,35c)排出。 氮气供应管线(53a,53b,53c,56a,56b,56c)向涡轮分子泵和前级管线供应压载氮,以防止工艺气体的回流和室内的加工副产物。 在每个氮气供应管线中安装调节器,以均匀地保持每个室中前级管线的稳定压力。
    • 4. 发明公开
    • 반도체 장치의 제조에서 건식 식각 장치
    • 用于制造半导体器件的干蚀刻机
    • KR1020020043954A
    • 2002-06-12
    • KR1020000073428
    • 2000-12-05
    • 삼성전자주식회사
    • 박수관최정민
    • H01L21/3065
    • PURPOSE: A dry etcher for fabricating a semiconductor device is provided to minimize a process defect that the lower surface of a contact is not located in a precise position because of an abnormal vertical profile of the contact, by forming the contact having an excellent vertical profile while improving uniformity in dry-etching a wafer. CONSTITUTION: An etch process is performed in a chamber. An anode is installed in the upper portion of the chamber. Power for generating plasma to perform the etch process is supplied to the anode. A cathode(34) is installed in the lower portion of the chamber, facing the anode. Power for generating plasma to perform the etch process is supplied to the cathode. A wafer chuck(36) on which a wafer is placed is installed on the cathode. The diameter of the wafer chuck is smaller than that of the wafer. A shadow ring(38) is so formed that the lower surface of the edge of the wafer placed on the wafer chuck is supported at the side surface of the wafer chuck. A protrusion is formed near the side surface of the wafer.
    • 目的:提供用于制造半导体器件的干蚀刻机,以通过形成具有优异垂直剖面的接触来最小化接触的下表面由于接触的异常垂直轮廓而不位于精确位置的过程缺陷 同时提高干蚀刻晶片的均匀性。 构成:在腔室中进行蚀刻处理。 阳极安装在腔室的上部。 用于产生等离子体以进行蚀刻处理的功率被提供给阳极。 阴极(34)安装在室的下部,面向阳极。 用于产生等离子体以进行蚀刻处理的功率被提供给阴极。 其上放置晶片的晶片卡盘(36)安装在阴极上。 晶片卡盘的直径小于晶片的直径。 阴影环(38)被形成为使得放置在晶片卡盘上的晶片的边缘的下表面被支撑在晶片卡盘的侧表面。 在晶片的侧表面附近形成突起。
    • 5. 发明公开
    • 식각장치의 냉각시스템
    • 蚀刻设备的冷却系统
    • KR1019990075057A
    • 1999-10-05
    • KR1019980009040
    • 1998-03-17
    • 삼성전자주식회사
    • 김남헌박수관
    • H01L21/306
    • 냉각시스템의 작동이 멈출 때 식각공정도 동시에 멈출 수 있도록 하는 식각장치의 냉각시스템을 개시한다. 이 시스템은 압축기, 응축기 및 항온조 내를 냉매가 흐르되, 상기 항온조 내의 열교환기를 통하여 상기 냉매가 항온조 내의 냉각액과 열교환을 하며, 상기 냉각액은 펌프에 의해 식각공정이 진행되는 챔버 내의 반도체 기판을 지지하는 전극 내를 흐르면서 상기 전극의 온도상승을 방지하는 식각장치의 냉각시스템에 있어서, 상기 압축기의 전원입력단에 직렬로 연결된 고압차단 스위치와, 상기 압축기와 병렬로 상기 전원입력단에 그 입력단이 병렬로 연결된 식각공정 제어 스위치를 구비하되, 상기 식각공정 제어 스위치의 출력단에 상기 냉각액을 이동시키기 위한 상기 펌프가 연결되어 상기 고압차단 스위치가 열리면 상기 식각공정 제어 스위치의 입력전원이 차단됨으로써 상기 펌프의 작동이 멈추도록 한다.
    • 7. 发明公开
    • 밀봉효과를 높인 건식식각장치
    • 用于干蚀刻的装置具有增加的密封效果
    • KR1020000031675A
    • 2000-06-05
    • KR1019980047826
    • 1998-11-09
    • 삼성전자주식회사
    • 박창순박수관
    • H01L21/3065
    • PURPOSE: A device for dry etching is provided to improve sealing effect by increasing contacting surface, to easily assemble, and to prevent a deviation while assembling. CONSTITUTION: A device for dry etching contains an electrode base(40) of upper part, a chamber wall(42), and an electrode(44) of upper part located under the electrode base of upper part for being supported by the chamber wall. Herein, the contacting part of the upper electrode and the chamber wall is completely attached without a gap. Therefore, the flat surfaces of the upper electrode and the chamber wall are attached for improving sealing effect. Herein, the most part of a screw cover(48) for fixing is in an inner wall(46) while projecting a certain part to upward for being inserted to the upper electrode while assembling the upper electrode and the chamber wall. Also, the upper electrode contains a groove for corresponding to the inner wall.
    • 目的:提供用于干蚀刻的装置,通过增加接触表面,容易组装和防止组装时的偏差来提高密封效果。 构成:用于干蚀刻的装置包括上部的电极基座(40),室壁(42)和位于上部电极基座下方的上部电极(44),用于由腔室壁支撑。 这里,上部电极和室壁的接触部分完全没有间隙地附着。 因此,安装上部电极和室壁的平坦表面以提高密封效果。 这里,用于固定的螺钉盖(48)的大部分在内壁(46)中,同时在组装上电极和室壁的同时向上突出一定部分以插入上电极。 此外,上电极包含用于对应于内壁的凹槽。
    • 8. 发明公开
    • 포커스 링의 이상 마모를 제거한 플라즈마 챔버
    • 来自异物磨损​​的等离子体离子被移除
    • KR1020000065492A
    • 2000-11-15
    • KR1019990011829
    • 1999-04-06
    • 삼성전자주식회사
    • 박창순박수관
    • H01L21/68
    • PURPOSE: A plasma chamber from which abnormal abrasion on focus ring was removed is provided to enhance the life time of a focus ring and to restrain the deposition of by-products to ESC(electro static chuck) in the etching process. CONSTITUTION: A plasma chamber from which abnormal abrasion of focus ring was removed comprises a circular ESC(100) on which a wafer(112) is laid, a cathode electrode(102) which composes a circular out line of ESC(100), a first lower ring(106) which composes a lower part of a focus ring(104), and a side wall of cathode electrode(102), and a second ring and a third ring(108,110) which mechanically support the first ring(106) and have the characteristics of a dense structure between the focus ring(104) and the first ring(106). Wherein the second and the third ring are distorted to remove the gap between the focus rings, so the deposition of the by-products to ESC is restrained.
    • 目的:提供去除聚焦环异常磨损的等离子体室,以提高聚焦环的使用寿命,并抑制蚀刻过程中ESC(静电吸盘)副产物的沉积。 构成:去除聚焦环的异常磨损的等离子体室包括圆形ESC(100),其上放置晶片(112),构成ESC(100)的圆形出线的阴极(102), 构成聚焦环(104)的下部的第一下环(106)和阴极电极(102)的侧壁,以及机械地支撑第一环(106)的第二环和第三环(108,110) 并且具有在聚焦环(104)和第一环(106)之间的致密结构的特征。 其中第二和第三环变形以去除聚焦环之间的间隙,因此抑制副产物向ESC的沉积。