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1. 发明公开

KR1020130076328A 발광소자 패키지 및 그 제조 방법 审中-实审
标题翻译：发光器件封装及其制造方法
公开(公告)号：KR1020130076328A
公开(公告)日：2013-07-08
申请号：KR1020110144876
申请日：2011-12-28
申请人： 삼성전자주식회사
发明人： 이재희 , 김영신
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/181 , H01L33/387 , H01L33/50 , H01L33/58 , H05K1/113 , H01L2924/00014 , H01L2924/00012
摘要： PURPOSE: A light emitting device package and a method for manufacturing the same are provided to secure various colors by using a light source formed by the PN junction of a compound semiconductor. CONSTITUTION: A terminal part (20) includes a first, a second, and a third electrode pad. The first electrode pad is arranged on one region of a substrate. The second and the third electrode pad are arranged on the edge region of the substrate. At least one light emitting device (30) is mounted on the first electrode pad. A connection member (40) electrically connects the second and/or the third electrode pad to the light emitting device.
摘要翻译：目的：提供一种发光器件封装及其制造方法，用于通过使用由化合物半导体的PN结形成的光源来确保各种颜色。构成：端子部分（20）包括第一，第二和第三电极焊盘。第一电极焊盘设置在基板的一个区域上。第二和第三电极焊盘设置在衬底的边缘区域上。至少一个发光器件（30）安装在第一电极焊盘上。连接构件（40）将第二电极焊盘和/或第三电极焊盘电连接到发光器件。

2. 发明公开

KR1020120052447A 색 조절이 가능한 발광소자 패키지 및 상기 발광소자 패키지의 동작 방법 无效
标题翻译：彩色发光二极管封装和发光二极管封装的方法
公开(公告)号：KR1020120052447A
公开(公告)日：2012-05-24
申请号：KR1020100113393
申请日：2010-11-15
申请人： 삼성전자주식회사
发明人： 김영신 , 김해철 , 이재희 , 조영진
IPC分类号： H05B37/02 , H01L33/48
CPC分类号： H05B33/0857 , H01L33/48 , H05B33/0824 , Y02B20/347
摘要： PURPOSE: A light emitting device package and an operation method thereof are provided to output various light source colors by respectively controlling a plurality of light emitting devices through a light source color controller. CONSTITUTION: A light emitting part(200) is formed by accumulating a plurality of light emitting device sets on a printed circuit board. A first light-emitting device set(210) comprises a first red light emitting element(211), a second red light emitting element(212), a blue light emitting element(213), and a green light emitting element(214). The first red light emitting element is catty corned from the second red light emitting element. A light source color controller controls current amount which is provided to the first red light emitting element and the second red light emitting element and controls quantity of light of the first red light emitting element and the second red light emitting element.
摘要翻译：目的：提供发光器件封装及其操作方法，以通过光源颜色控制器分别控制多个发光器件来输出各种光源颜色。构成：通过在印刷电路板上堆积多个发光器件组而形成发光部分（200）。第一发光装置（210）包括第一红色发光元件（211），第二红色发光元件（212），蓝色发光元件（213）和绿色发光元件（214）。第一红色发光元件是从第二红色发光元件引起的。光源颜色控制器控制提供给第一红色发光元件和第二红色发光元件的电流量并控制第一红色发光元件和第二红色发光元件的光量。

3. 发明公开

KR1020120040972A 양방향 발광소자 패키지 无效
标题翻译：发光装置包装发光指示灯对准方向
公开(公告)号：KR1020120040972A
公开(公告)日：2012-04-30
申请号：KR1020100102511
申请日：2010-10-20
申请人： 삼성전자주식회사
发明人： 조영진 , 이재희 , 김영신 , 이근정
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L27/15 , H01L33/36 , H01L33/52
摘要： PURPOSE: A bidirectional light emitting device package is provided to enhance a luminescence output per unit volume by arranging a lead frame so that a pair of light emitting device chips is opposite. CONSTITUTION: First and second lead frames(121,122) are arranged to be neighbored to one plane. A electrode of a first light emitting device chip(110) is connected to the first and the second lead frame. Third and fourth lead frames are placedc at a predetermined interval to be corresponded to the first and the second lead frame. The electrode of a second light emitting device chip(160) is connected to the first and fourth lead frame. The second light emitting device chip is arranged to be opposite to the first light emitting device chip.
摘要翻译：目的：提供双向发光器件封装，以通过布置引线框以使一对发光器件芯片相反来增强每单位体积的发光输出。构成：第一和第二引线框架（121,122）布置成与一个平面相邻。第一发光器件芯片（110）的电极连接到第一引线框架和第二引线框架。第三和第四引线框以预定间隔放置，以对应于第一引线框和第二引线框。第二发光器件芯片（160）的电极连接到第一引线框架和第四引线框架。第二发光器件芯片布置成与第一发光器件芯片相对。

4. 发明公开

KR1020070025817A 반도체 소자 제조용 장비 无效
标题翻译：制造半导体器件的装置
公开(公告)号：KR1020070025817A
公开(公告)日：2007-03-08
申请号：KR1020050082363
申请日：2005-09-05
申请人： 삼성전자주식회사
发明人： 김영신
IPC分类号： H01L21/02 , H01L21/324
摘要： Semiconductor device manufacturing equipment is provided to prevent the degradation of a filter due to heat of a boat by installing a filter cover at one side of the filter. Semiconductor device manufacturing equipment includes a loadlock chamber and a filter unit. The loadlock chamber(120) is used for loading a boat. The filter unit(140) is installed at one sidewall of the loadlock chamber. The filter unit is composed of a filter and a filter cover. The filter(142) is used for filtering contaminant materials from purge gas. The filter cover(144) is installed at one side of the filter in order to prevent the filter from being exposed to the heat.
摘要翻译：半导体器件制造设备用于通过在过滤器的一侧安装过滤器盖来防止由于船的热而引起的过滤器的劣化。半导体器件制造设备包括负载锁定室和过滤器单元。负载锁定室（120）用于装载船。过滤器单元（140）安装在负载锁定室的一个侧壁处。过滤器单元由过滤器和过滤器盖组成。过滤器（142）用于从净化气体中过滤污染物质。过滤器盖（144）安装在过滤器的一侧，以防止过滤器暴露于热量。

5. 发明公开

KR1020130100528A 발광소자 패키지 및 그 제조 방법 无效
标题翻译：发光器件封装及其制造方法
公开(公告)号：KR1020130100528A
公开(公告)日：2013-09-11
申请号：KR1020120021793
申请日：2012-03-02
申请人： 삼성전자주식회사
发明人： 박희석 , 김영신
IPC分类号： H01L33/60 , H01L33/58 , H01L33/48
CPC分类号： H01L2224/48137 , H01L2224/49107 , H01L2224/73265 , H01L33/58 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2933/0033
摘要： PURPOSE: A light emitting device package and a manufacturing method thereof are provided to test the operation state of a light emitting device by filling a reflection material confinement wall with reflection materials. CONSTITUTION: A package substrate (210) includes a first through electrode (221) and a second through electrode (222) which are separately arranged. At least one light emitting device (230) is electrically connected to the first through electrode and the second through electrode. Reflection materials are filled in a reflection material confinement wall (250). A lens part (270) covers at least one light emitting device. A fluorescent layer (240) is formed on at least one light emitting device.
摘要翻译：目的：提供发光器件封装及其制造方法，以通过用反射材料填充反射材料限制壁来测试发光器件的操作状态。构成：封装基板（210）包括单独设置的第一贯通电极（221）和第二贯通电极（222）。至少一个发光器件（230）电连接到第一贯通电极和第二贯通电极。反射材料填充在反射材料限制壁（250）中。透镜部件（270）覆盖至少一个发光装置。荧光层（240）形成在至少一个发光器件上。

6. 发明公开

KR1020130043838A 조명 장치 无效
标题翻译：照明设备
公开(公告)号：KR1020130043838A
公开(公告)日：2013-05-02
申请号：KR1020110107975
申请日：2011-10-21
申请人： 삼성전자주식회사
发明人： 김영신 , 이희영 , 이재희
IPC分类号： F21V29/00 , F21S2/00 , F21Y101/02
CPC分类号： F21V29/503 , F21K9/60 , F21V29/51 , F21V29/70 , F21Y2101/00
摘要： PURPOSE: A lighting device is provided to improve heat dissipation without a heat radiation plate by using a metal body of an object as a heat sink. CONSTITUTION: A flexible substrate(110) is arranged on the contact surface of a metal body(140). A light emitting device(120) is mounted on the flexible substrate. A heat radiation adhesive(130) is arranged between the flexible substrate and the metal body to transfer the heat generated from the light emitting device to the metal body. The heat radiation adhesive is coated on the contact surface of the flexible substrate or the metal body. The metal body of an object functions as a heat sink for discharging the heat from the heat radiation adhesive to the outside.
摘要翻译：目的：提供一种照明装置，通过使用物体的金属体作为散热器，不用散热板来改善散热。构成：柔性基板（110）布置在金属体（140）的接触表面上。发光器件（120）安装在柔性基板上。在柔性基板和金属体之间布置有散热粘合剂（130），以将从发光装置产生的热量传递到金属体。热辐射粘合剂涂覆在柔性基底或金属体的接触表面上。物体的金属体用作用于将热量从热辐射粘合剂排出到外部的散热器。

7. 发明公开

KR1020120068287A 움직이는 발광소자 장치 및 상기 발광소자 장치의 제조 방법 无效
标题翻译：可移动发光装置芯片及其制造方法
公开(公告)号：KR1020120068287A
公开(公告)日：2012-06-27
申请号：KR1020100129851
申请日：2010-12-17
申请人： 삼성전자주식회사
发明人： 김영신 , 조영진 , 이재희 , 김해철
IPC分类号： F21V14/00 , H05K9/00 , F21V29/00 , F21Y101/02
CPC分类号： F21K9/65 , F21Y2115/10 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE: A movable light emitting device and a manufacturing method thereof are provided to acquire specific effects through movements of a light source such as a mood lamp, a stage lamp, and a projector by moving a fixed light emitting device. CONSTITUTION: A light emitting device chip(120) is mounted on a substrate(110) in a wire bonding mode or a flip chip mode. A resin molding unit(130) protects the light emitting device chip. The substrate includes materials such as ceramics, a printed circuit board, FR4, metal, and etc. A body part(140) is fixed on the substrate. The body part is wound by a coil(150) which is made of a material with high conductivity. A magnet(160) is formed by separating a selected distance with the coil from one side of the body part. The magnet provides magnetic force to the coil.
摘要翻译：目的：提供可移动发光装置及其制造方法，以通过移动固定发光装置来移动诸如情绪灯，舞台灯和投影仪等光源的特定效果。构成：发光器件芯片（120）以引线键合模式或倒装芯片模式安装在基板（110）上。树脂模制单元（130）保护发光器件芯片。基板包括诸如陶瓷，印刷电路板，FR4，金属等的材料。主体部分（140）固定在基板上。主体部分由具有高导电性的材料制成的线圈（150）缠绕。通过从主体部分的一侧与线圈分离选定的距离来形成磁体（160）。磁铁向线圈提供磁力。

8. 发明公开

KR1020120051858A 발광장치 无效
标题翻译：发光装置
公开(公告)号：KR1020120051858A
公开(公告)日：2012-05-23
申请号：KR1020100113178
申请日：2010-11-15
申请人： 삼성전자주식회사
发明人： 김영신 , 김해철 , 이재희 , 조영진
IPC分类号： H01L33/64 , H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
摘要： PURPOSE: A light emitting device is provided to include a heat dissipation support unit which releases heat of a light emitting unit while flexibly supporting the light emitting unit, thereby improving heat dissipation properties with small volume. CONSTITUTION: A light emitting body(12) supports a light source(11). A lead frame(13) provides an electrode to the light source. A wire(14) electrically connects the light source and the lead frame. A heat dissipation support unit(20) releases heat from the light emitting unit while supporting the light emitting unit. The heat dissipation support unit comprises a support body(30), a first support pin(40), and a second support pin(50).
摘要翻译：目的：提供一种发光装置，其包括散热支撑单元，其在灵活地支撑发光单元的同时释放发光单元的热量，从而以小的体积改善散热性能。构成：发光体（12）支撑光源（11）。引线框架（13）为光源提供电极。导线（14）电连接光源和引线框架。散热支持单元（20）在支撑发光单元的同时从发光单元释放热量。散热支撑单元包括支撑体（30），第一支撑销（40）和第二支撑销（50）。

9. 发明公开

KR1020110089500A ＬＥＤ패키지 제조방법 无效
标题翻译：制造LED封装的方法
公开(公告)号：KR1020110089500A
公开(公告)日：2011-08-09
申请号：KR1020100008934
申请日：2010-02-01
申请人： 삼성전자주식회사
发明人： 김영신 , 김진하 , 조영진 , 이재희
IPC分类号： H01L33/58
CPC分类号： H01L33/48 , H01L33/005 , H01L33/50 , H01L33/58 , H01L2933/0033 , H01L2933/0041
摘要： PURPOSE: An LED package manufacturing method is provided to improve mass productivity in the LED package manufacturing method. CONSTITUTION: An LED package manufacturing method is comprised of following steps. An LED chip is mounted on a base(S100). A fluorescent substance is formed on the LED chip(S200). An oxide film is deposited on the LED chip(S300). A part of the oxide film corresponding to the position and size of the LED chip is removed by etching(S400). A lens is formed by reflowing the oxide film(S500).
摘要翻译：目的：提供LED封装制造方法，以提高LED封装制造方法的批量生产率。构成：LED封装制造方法由以下步骤组成。 LED芯片安装在基座上（S100）。在LED芯片上形成荧光物质（S200）。氧化膜沉积在LED芯片上（S300）。通过蚀刻去除与LED芯片的位置和尺寸相对应的氧化膜的一部分（S400）。通过回流氧化膜形成透镜（S500）。

10. 发明公开

KR1020110042998A 발광 다이오드 패키지 无效
标题翻译：发光二极管封装
公开(公告)号：KR1020110042998A
公开(公告)日：2011-04-27
申请号：KR1020090099895
申请日：2009-10-20
申请人： 삼성전자주식회사
发明人： 조영진 , 이재희 , 김영신
IPC分类号： H01L33/52 , H01L33/58
摘要： PURPOSE: A light emitting diode package is provided to shorten the lens assembly time by combining a combining part of the lens to a guide groove on the package mold in sliding manner. CONSTITUTION: A lead frame comprises a pair of lead terminals. A package mold(120) accepts a part of the lead frame inside, and has the injection space for molding material. The package mold comprises a guide groove for inserting the lens on both sides of the top of the molding injection space. An LED chip(130) is mounted on a lead frame inside the package mold. A lens(160) comprises a connecting part and a light-transmitting part combined on the connecting part.
摘要翻译：目的：提供一种发光二极管封装以通过将透镜的组合部分以滑动方式组合在封装模具上的引导槽上来缩短透镜组装时间。构成：引线框架包括一对引线端子。包装模具（120）在内部接纳引线框架的一部分，并且具有用于成型材料的注入空间。封装模具包括用于将透镜插入注模空间的顶部的两侧的引导槽。 LED芯片（130）安装在封装模具内的引线框架上。透镜（160）包括连接部分和组合在连接部分上的透光部分。

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