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    • 2. 发明公开
    • 전도성 시트 물질 내의 이동도 및 시트 전하 밀도를측정하기 위한 장치 및 처리 시스템
    • 用于测量导电材料中的移动性和片材充电密度的装置和处理系统
    • KR1020070061540A
    • 2007-06-13
    • KR1020077005517
    • 2005-08-10
    • 리하이톤 일렉트로닉스, 인크.
    • 브루,어스틴알브론코,마이클더블유멀피,스티븐씨응웬,단에버하트,니콜라이리씨니,제롬씨주이덜블리엣,윌리암
    • H01L21/66G01R27/04
    • G01R27/2652G01N22/00G01R31/2648
    • An apparatus (10) for contactless measurement of sheet charge density and mobility includes a microwave source (16), a circular waveguide (50) for transmitting microwave power to a sample (59), such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector (18) for detecting the forward microwave power, a second detector (23) for detecting the microwave power reflected from the sample, and a third detector (95) for detecting the Hall effect power. An automatic positioning subsystem (700) is also provided for allowing automatic positioning of a wafer (59) within the test apparatus (10). The positioning system (700) includes a first end effector (706) and a rotator-lifter (704). The first end effector (706) can grasp a sheet element (59) and move it to a desired position within the test apparatus (10), while the rotator lifter (704) provides incremental adjustment of a theta angle of the sheet element (59) to allow automated mapping of an entire sheet element without the need for manual adjustment of the position of the sheet element. A second end effector (716) can be mounted opposite the first end effector (706) and can be used to automatically position the sheet element (59) within a sheet resistance testing module (718) located at an opposite end of the apparatus (10).
    • 用于片电荷密度和迁移率的非接触式测量的装置(10)包括微波源(16),用于将微波功率传送到样品(59)的圆形波导(50),例如用于平板显示器的半导体晶片或面板 ,在测量位置,检测前向微波功率的第一检测器(18),用于检测从样品反射的微波功率的第二检测器(23)和用于检测霍尔效应功率的第三检测器(95)。 还提供了自动定位子系统(700),用于允许晶片(59)在测试装置(10)内的自动定位。 定位系统(700)包括第一端部执行器(706)和旋转器升降器(704)。 第一端部执行器(706)可以抓住片状元件(59)并将其移动到测试装置(10)内的期望位置,同时转子提升器(704)提供片状元件(59)的θ角的增量调节 ),以允许整个片材元件的自动映射,而不需要手动调整片材元件的位置。 第二端部执行器(716)可以与第一端部执行器(706)相对地安装,并且可以用于将片状元件(59)自动定位在位于设备(10)的相对端的薄层电阻测试模块(718)内 )。