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    • 1. 发明公开
    • 복합 기판의 전기도금법
    • 在复合基板上选择性沉积锡或锡合金膜时使用的电解质和在复合基板上沉积锡或钛合金的方法
    • KR1020050018616A
    • 2005-02-23
    • KR1020040061271
    • 2004-08-04
    • 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
    • 토벤마이클피.브라운네일디.치라피시앵겔로
    • C25D3/30
    • H05K3/244C25D3/32C25D3/60H05K1/0306
    • PURPOSE: To provide a composition and a method for selectively electroplating tin or tin alloy on a composite substrate comprising a metal part and a ceramic part without reduction of adhesive force between the metal part and the ceramic part, wherein the composition contains constituents that do not damage adhesive force on a boundary surface of metal and ceramic. CONSTITUTION: A method for electroplating a composite substrate comprises a step of contacting the composite substrate with a composition comprising one or more tin or tin alloy sources selected from stannous organic sulfonate, stannous sulfate, stannous gluconate, stannous citrate, stannous lactate and stannous halide, one or more aromatic diols, at least one surfactant that is an alcohol ethoxylate, and one or more compounds, salts thereof or ester thereof having an amount of 15 to 55 gm/L represented as the following general formula: HOOCBCOOH where B is chemical bond or (-CH2-)n, and n is an integer of 1 to 4; and selectively depositing tin or tin alloy on a metal part on the composite substrate by generating an electric current in the composition.
    • 目的:提供一种组合物和方法,用于在包含金属部分和陶瓷部件的复合基材上选择性地电镀锡或锡合金,而不会降低金属部件和陶瓷部件之间的粘合力,其中组合物含有不含 损伤金属和陶瓷边界表面的粘合力。 组合物:复合基材的电镀方法包括使复合基材与包含一种或多种选自亚锡有机磺酸盐,硫酸锡,葡萄糖酸亚锡,柠檬酸亚锡,乳酸亚锡和卤化亚锡的一种或多种锡或锡合金源接触的步骤, 一种或多种芳族二醇,至少一种醇乙氧基化物的表面活性剂,以及一种或多种15至55gm / L的化合物,其盐或酯,其表示如下通式:HOOCBCOOH,其中B是化学键 或(-CH 2 - )n,n为1〜4的整数。 并通过在组合物中产生电流,将锡或锡合金选择性地沉积在复合衬底上的金属部分上。