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2. 发明公开

KR1020070058986A 유전체의 금속화 有权
标题翻译：电介质金属化
公开(公告)号：KR1020070058986A
公开(公告)日：2007-06-11
申请号：KR1020060122051
申请日：2006-12-05
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 스카라글리노프랭크 , 소머월터 , 브라운네일디. , 왕카이
IPC分类号： C23C18/16 , C23C18/54 , C23C18/04
CPC分类号： C23C18/48 , C23C18/1653 , C23C18/208 , C23C18/30 , C25D5/54 , Y10T428/31678
摘要： Compositions comprising one or more cerium(IV) ion sources, one or more silver(I) ion sources and one or more hydrogen ion sources, and a method comprising providing the composition, contacting a dielectric with the composition to activate the dielectric by conditioning the dielectric, and depositing a metal on the dielectric are provided. A composition comprises one or more cerium(IV) ion sources, one or more silver(I) ion sources and one or more hydrogen ion sources. The one or more cerium(IV) ion sources are selected from ammonium cerium nitrate, cerium tetrasulfate, ammonium cerium sulfate, cerium oxide, cerium sulfate, and cerium sulfate tetrahydrate. The one or more silver(I) ion sources are selected from silver nitrate, silver tetrafluoroborate, silver perchlorate, silver fluoride, silver acetate, silver carbonate, silver oxide, silver sulfate, and silver hydroxide. The one or more hydrogen ion sources are selected from sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, and phosphoric acid. A method comprises: (a) providing a composition comprising one or more cerium(IV) ion sources, one or more silver(I) ion sources and one or more hydrogen ion sources; (b) contacting a dielectric with the composition to activate the dielectric by conditioning the dielectric; and (c) depositing a metal on the dielectric.
摘要翻译：包含一种或多种铈（IV）离子源，一种或多种银离子源和一种或多种氢离子源的组合物，以及包括提供组合物的方法，使电介质与组合物接触以通过调节电介质和在电介质上沉积金属。组合物包含一种或多种铈（IV）离子源，一种或多种离子源（I）和一种或多种氢离子源。一种或多种铈（IV）离子源选自硝酸铈铵，四硫酸铈，硫酸铈铵，氧化铈，硫酸铈和四水合硫酸铈。一种或多种离子源（I）选自硝酸银，四氟硼酸银，高氯酸银，氟化银，乙酸银，碳酸银，氧化银，硫酸银和氢氧化银。一个或多个氢离子源选自硫酸，硝酸，盐酸，氢氟酸和磷酸。一种方法包括：（a）提供包含一种或多种铈（IV）离子源，一种或多种银离子源和一种或多种氢离子源的组合物; （b）使电介质与组合物接触以通过调节电介质来激活电介质; 和（c）在电介质上沉积金属。

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