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2. 发明公开

KR1020070113103A 반도체 장치의 제조 방법 및 제조 장치 有权
标题翻译：制造半导体器件的方法和装置
公开(公告)号：KR1020070113103A
公开(公告)日：2007-11-28
申请号：KR1020070034329
申请日：2007-04-06
申请人： 라피스 세미컨덕터 가부시키가이샤
发明人： 무라키신지
IPC分类号： H01L23/12
CPC分类号： B29C33/10 , B29C39/42 , H01L21/566 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for fabricating a semiconductor device is provided to effectively avoid deformation of a columnar electrode in a sealing process by supporting the upper part of a semiconductor substrate by a mold in making a cavity vacuum while the semiconductor substrate is separated form a sealing resin material so that resin doesn't come in contact with the columnar electrode. A first mold(100) has a substrate mounting surface(120a) for supporting a semiconductor substrate. A sealing apparatus(300) includes the first mold and a second mold confronting the first mold. The center point of a confronting surface of the second mold to the substrate mounting surface of the first mold becomes a second center point(C2) confronting a first center point(C1) of the substrate mounting surface. A protrusion(230) of a convex type is formed in the second mold wherein the top point or top surface of the protrusion is positioned in the second center point. A resin disposition region(230a) is formed in a region including the top point of the protrusion point or in the top surface of the protrusion.
摘要翻译：提供一种制造半导体器件的装置，以便在半导体衬底由密封树脂材料分离形成空腔真空的同时通过模具支撑半导体衬底的上部，从而在密封过程中有效地避免柱状电极的变形，该树脂不与柱状电极接触。第一模具（100）具有用于支撑半导体衬底的衬底安装表面（120a）。密封装置（300）包括第一模具和面对第一模具的第二模具。第二模具的相对表面到第一模具的基板安装表面的中心点成为面对基板安装表面的第一中心点（C1）的第二中心点（C2）。在第二模具中形成凸起的突起（230），其中突起的顶点或顶表面位于第二中心点。树脂配置区域（230a）形成在包括突起的顶点或突出部的上表面的区域中。

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