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1. 发明公开

KR1020110046805A 웨이퍼 다이싱용 세정제 조성물 有权
标题翻译：用于切割晶片的清洁溶液组合物
公开(公告)号：KR1020110046805A
公开(公告)日：2011-05-06
申请号：KR1020090103470
申请日：2009-10-29
申请人： 동우 화인켐 주식회사 , 주식회사 한 수
发明人： 이경호 , 성시진 , 김상태 , 오영남 , 권기진 , 오권열 , 김광중 , 유진웅 , 천주영 , 조재림
IPC分类号： C11D3/37
CPC分类号： C11D3/00
摘要： PURPOSE: A cleaning solution composition for dicing a wafer is provided to reduce the generation of bubbles and to ensure excellent corrosion resistance to a pad. CONSTITUTION: A cleaning solution composition for dicing a wafer includes: a polymer compound including one kind selected from the group consisting of acrylic acid-based copolymer, maleic acid-based copolymer, and their salts; and a solvent. The average molecular weight of the polymer is 1,000-100,000. The polymer compound comprises a structure unit represented by chemical formula 1 and a structure unit represented by chemical formula 2.
摘要翻译：目的：提供用于切割晶片的清洁溶液组合物以减少气泡的产生并且确保对垫的优异的耐腐蚀性。构成：用于切割晶片的清洁溶液组合物包括：包含选自丙烯酸类共聚物，马来酸基共聚物及其盐中的一种的高分子化合物; 和溶剂。聚合物的平均分子量为1,000-100,000。高分子化合物包含由化学式1表示的结构单元和由化学式2表示的结构单元。

2. 发明授权

KR101645036B1 웨이퍼 다이싱용 세정제 조성물 有权
标题翻译：用于切割晶片的清洁溶液组合物
公开(公告)号：KR101645036B1
公开(公告)日：2016-08-03
申请号：KR1020090103470
申请日：2009-10-29
申请人： 동우 화인켐 주식회사 , 주식회사 한 수
发明人： 이경호 , 성시진 , 김상태 , 오영남 , 권기진 , 오권열 , 김광중 , 유진웅 , 천주영 , 조재림
IPC分类号： C11D3/37
摘要： 본발명은아크릴산계공중합체, 말레익산계공중합체및 이들의염으로이루어진군에서선택되는 1종을포함하는고분자화합물; 및용매를포함하는것을특징으로하는웨이퍼다이싱용세정제조성물에관한것이다.

3. 发明授权

KR101734543B1 포지티브 포토레지스트 조성물 有权
标题翻译：正光刻胶组合物
公开(公告)号：KR101734543B1
公开(公告)日：2017-05-12
申请号：KR1020100070174
申请日：2010-07-20
申请人： 동우 화인켐 주식회사
发明人： 김성훈 , 이경호 , 오영남
IPC分类号： G03F7/039 , G03F7/004
摘要： 본발명은 (a) 알칼리가용성수지; (b) 감광성화합물; 및 (c) 테트라히드로헥실렌글리콜과유기용매를포함하는용매를포함하는것을특징으로하는포지티브포토레지스트조성물에관한것이다.
摘要翻译：（A）碱溶性树脂; （b）光敏化合物; （c）包含四羟基乙二醇和有机溶剂的溶剂。

4. 发明公开

KR1020120021736A 와이어 쏘우용 수성 절삭액 조성물 有权
标题翻译：用于钢丝表面的水性清洗流体组合物
公开(公告)号：KR1020120021736A
公开(公告)日：2012-03-09
申请号：KR1020100078670
申请日：2010-08-16
申请人： 동우 화인켐 주식회사
发明人： 권기진 , 이경호 , 오영남
IPC分类号： C10M169/04 , C10M129/00 , C10M105/18 , B28D5/04
CPC分类号： C10M169/04 , B28D5/04 , C10M105/18 , C10M105/32 , C10M105/34 , C10M105/42 , C10M105/46 , C10M105/50 , C10M105/54 , C10M105/64 , C10M129/00
摘要： PURPOSE: An aqueous cutting fluid composition for a wire saw is provided to offer excellent viscosity stability of the composition by the content of abrasive particles by using organic acid. CONSTITUTION: An aqueous cutting fluid composition for a wire saw comprises the following: a glycolether based compound marked with chemical formula 1: HO-(CH2R1CH2O)m-R2; a glycol based compound marked with chemical formula 2: HO-(CH2R3CH2O)x-(CH2R4CH2O)y-H; and an aliphatic or aromatic family organic acid. In the chemical formulas, R1 is a linear or branched chain including alkylene group either directly coupled pr having 1-6 carbons.
摘要翻译：目的：提供用于线锯的水性切削液组合物，通过使用有机酸，通过研磨颗粒的含量提供组合物优异的粘度稳定性。构成：用于线锯的水性切削液组合物包括：用化学式1表示的乙二醇醚基化合物：HO-（CH 2 R 1 CH 2 O）m -R 2; 标记有化学式2的二醇基化合物：HO-（CH 2 R 3 CH 2 O）x - （CH 2 R 4 CH 2 O）y -H; 和脂族或芳族家族有机酸。在化学式中，R 1是直链或支链，包括直接键合有1-6个碳原子的亚烷基。

5. 发明公开

KR1020110127816A 감광성 수지 및 반사방지막 제거용 신너 조성물 无效
标题翻译：用于去除感光树脂和抗反射涂层的薄膜组合物
公开(公告)号：KR1020110127816A
公开(公告)日：2011-11-28
申请号：KR1020100047266
申请日：2010-05-20
申请人： 동우 화인켐 주식회사
发明人： 오영남 , 이경호 , 김승온
IPC分类号： G03F7/42 , C11D7/26 , C11D11/00
CPC分类号： G03F7/422 , C11D7/261 , C11D11/0047
摘要： PURPOSE: A thinner composition for removing a photosensitive resin and a reflection barrier layer is provided to rapidly and effectively remove a photosensitive layer on the edge and the rear side of a substurate. CONSTITUTION: A thinner composition for removing a photosensitive resin and a reflection barrier layer contains 10-70% of propylene glycol alkyl ether acetate, 1-30wt% of propylene glycol alkyl ether, and 10-70wt% of cyclohexanone. The thinner composition additionally contains a surfactant. The photosensitive resin is a photoresist for an i-line, KrF, or ArF.
摘要翻译：目的：提供用于去除感光性树脂和反射阻挡层的较薄组合物，用于快速有效地除去副产物的边缘和后侧上的感光层。构成：用于除去光敏树脂和反射阻挡层的较薄组合物含有10-70％的丙二醇烷基醚乙酸酯，1-30重量％的丙二醇烷基醚和10-70重量％的环己酮。更薄的组合物另外含有表面活性剂。光敏树脂是用于i线，KrF或ArF的光致抗蚀剂。

6. 发明公开

KR1020110039725A 와이어 쏘우용 수용성 절삭액 조성물 无效
标题翻译：用于钢丝表面的水性清洗流体组合物
公开(公告)号：KR1020110039725A
公开(公告)日：2011-04-20
申请号：KR1020090096688
申请日：2009-10-12
申请人： 동우 화인켐 주식회사
发明人： 이경호 , 오영남 , 권기진 , 성시진
IPC分类号： C10M129/04 , C10M133/04 , B23D61/18 , C10N30/04
CPC分类号： C10M129/04 , C10M133/04 , C10N2040/20 , C10N2240/40
摘要： PURPOSE: A water-soluble cutting fluid composition for a wire saw reduce the usage amount of cutting fluid, by preventing the increase of the viscosity when cutting an object. CONSTITUTION: A water-soluble cutting fluid composition for a wire saw contains 1~50wt% of methyl pentanediol, 50~99wt% of glycol class compounds, and 0.01~2wt% of amine compounds. The amine compounds are selected from the group consisting of glycol amine based compound, a morpholine based compound, a piperazine based compound, an alkyl amine based compound, and a poly amine based compound.
摘要翻译：目的：通过防止切割物体时的粘度增加，用于线锯的水溶性切削液组合物可减少切削液的使用量。构成：线锯的水溶性切削液组合物含有1〜50重量％的甲基戊二醇，50〜99重量％的乙二醇类化合物和0.01〜2重量％的胺化合物。胺化合物选自二醇胺基化合物，吗啉基化合物，哌嗪基化合物，烷基胺基化合物和多胺基化合物。

7. 发明公开

KR1020110016138A 감광성 수지 제거용 씬너 조성물 无效
标题翻译：用于去除感光树脂的薄膜组合物
公开(公告)号：KR1020110016138A
公开(公告)日：2011-02-17
申请号：KR1020090073685
申请日：2009-08-11
申请人： 동우 화인켐 주식회사
发明人： 이경호 , 오영남 , 성시진
IPC分类号： G03F7/42 , H01L21/027
CPC分类号： G03F7/422 , G03F7/425 , G03F7/70933
摘要： PURPOSE: A thinner composition for removing photosensitive resin is provided to ensure high work stability without toxicity and unpleasant smell. CONSTITUTION: A thinner composition for removing photosensitive resin contains 25-45 weight% of one or more selected from the group consisting of ethyl-3-ethoxy propionate(EEP) and methyl-3-methoxy propionate(MMP); 25-45 weight% of propylene glycol methyl ether(PGME); and 10-50 weight% of n-propyl acetate. The thinner composition further contains fluorides, non-ionic or ionic surfactants. The thinner composition removes unnecessary photosensitive film by being sprayed to the edge of a substrate on which photosensitive resin composition is coated.
摘要翻译：目的：提供更薄的去除感光树脂的组合物，以确保高的工作稳定性，无毒性和不愉快的气味。构成：用于去除感光性树脂的较薄组合物含有25-45重量％的一种或多种选自乙基-3-乙氧基丙酸酯（EEP）和甲基-3-甲氧基丙酸酯（MMP）的组合物; 25-45重量％的丙二醇甲基醚（PGME）; 和10-50重量％的乙酸正丙酯。更薄的组合物还含有氟化物，非离子或离子表面活性剂。更薄的组合物通过喷涂到其上涂覆有感光性树脂组合物的基材的边缘去除不需要的感光性膜。

8. 发明公开

KR1020110016137A 감광성 수지 제거용 씬너 조성물 无效
标题翻译：用于去除感光树脂的薄膜组合物
公开(公告)号：KR1020110016137A
公开(公告)日：2011-02-17
申请号：KR1020090073684
申请日：2009-08-11
申请人： 동우 화인켐 주식회사
发明人： 이경호 , 오영남 , 김상태
IPC分类号： G03F7/42 , H01L21/027 , C11D10/04 , C11D1/00 , C11D11/00 , C11D1/83 , C11D1/835 , C11D1/94 , C11D3/20
CPC分类号： G03F7/422 , G03F7/425 , G03F7/70933
摘要： PURPOSE: A thinner composition for removing photosensitive resin is provided to effectively and quickly remove unnecessary photosensitive film and to ensure high solubility and EBR property. CONSTITUTION: A thinner composition for removing photosensitive resin contains 5-25 weight% of one or more selected from ethyl-3-ethoxy propionate(EEP) and methyl-3-methoxy propionate(MMP); 5-20 weight% of propylene glycol monomethyl ether(PGME); and 60-90 weight% of n-butyl acetate(nBA). The thinner composition further contains fluorides, nonionic or ionic surfactants. The photosensitive resin is thin film transistor i-line photoresist.
摘要翻译：目的：提供用于去除感光性树脂的较薄组合物，以有效且快速地除去不需要的感光膜，并确保高溶解度和EBR性能。构成：用于去除感光性树脂的较薄组合物含有5-25重量％的选自乙基-3-乙氧基丙酸酯（EEP）和甲基-3-甲氧基丙酸酯（MMP）的一种或多种; 5-20重量％的丙二醇单甲醚（PGME）; 和60-90重量％的乙酸正丁酯（nBA）。较薄的组合物还含有氟化物，非离子或离子表面活性剂。光敏树脂是薄膜晶体管i线光致抗蚀剂。

9. 发明公开

KR1020090045666A 포토레지스트 조성물 无效
标题翻译：光电组合物
公开(公告)号：KR1020090045666A
公开(公告)日：2009-05-08
申请号：KR1020070111604
申请日：2007-11-02
申请人： 동우 화인켐 주식회사
发明人： 오영남 , 김용일 , 박종원
IPC分类号： G03F7/004
CPC分类号： G03F7/022 , G03F7/0045 , G03F7/0048 , G03F7/0226
摘要： 본 발명은 (a)감광성 물질, (b)알칼리 가용성 수지, (c)분자량 1,000 이하의 페놀계 및 아크릴계 모노머 중에서 선택되는 1종 이상의 모노머, (d)화학식 1 내지 4로 표시되는 화합물들로부터 선택되는 1종 이상의 페놀계 화합물, 및 (e)용매를 포함하는 포토레지스트 조성물에 관한 것이다.
페놀계 첨가제, 포토레지스트, 포지티브, 노볼락계 수지

10. 发明公开

KR1020090037167A 화학증폭형 포지티브 레지스트 조성물 无效
标题翻译：化学放大型正电阻组合物
公开(公告)号：KR1020090037167A
公开(公告)日：2009-04-15
申请号：KR1020070102673
申请日：2007-10-11
申请人： 동우 화인켐 주식회사
发明人： 김성훈 , 김용일 , 오영남
IPC分类号： G03F7/039
CPC分类号： G03F7/039 , C07C381/12 , G03F7/0045 , G03F7/0392 , G03F7/0395 , G03F7/0397
摘要： A chemically amplified positive resist composition and a chemically amplified positive resist film using the same are provided to ensure excellent sensitivity, resolution, applicability, and improved profile when forming patterns in a film thickness condition showing standing wave and reverse taper. A chemically amplified positive resist composition comprises: (A) resin which is arranged with a structure unit represented by the chemical formula 1 and a structure unit represented by the chemical formula 2 in a molar ratio of 2~5:5~8 in line, and has a glass transition temperature(Tg) of 150~170°C and the molecular weight of 9,000~11,000; (B) at least one resin selected from the group consisting of the chemical formula 3, 4, and 5; and (C) a photoacid generator represented by the chemical formula 6.
摘要翻译：提供化学放大型正性抗蚀剂组合物和使用其的化学放大型正性抗蚀剂膜，以在形成显示驻波和反向锥度的膜厚条件下形成图案时确保优异的灵敏度，分辨率，适用性和改进的轮廓。化学放大正型抗蚀剂组合物包括：（A）以化学式1表示的结构单元和由化学式2表示的结构单元以2〜5：5〜8的摩尔比排列的树脂，玻璃化转变温度（Tg）为150〜170℃，分子量为9,000〜11000; （B）选自化学式3,4和5的至少一种树脂; 和（C）由化学式6表示的光致酸产生剂。

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