专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

KR1020040044337A 반도체 밀봉용 에폭시 수지 조성물 및 이를 사용하는반도체 디바이스 失效
标题翻译：用于密封半导体和半导体器件的环氧树脂组合物，使用组合物来防止在连接用于改善信心的电极或导线之间的窄带距离的情况下的短路
公开(公告)号：KR1020040044337A
公开(公告)日：2004-05-28
申请号：KR1020030079792
申请日：2003-11-12
申请人： 닛토덴코 가부시키가이샤
发明人： 아키즈키신야 , 이케무라가즈히로 , 이토히사타카 , 우치다다카히로 , 에토다쿠야 , 니시오카츠토무 , 시마다가츠미
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , C08G59/621 , C08K3/04 , C08K3/36 , C08K9/02 , H01L2224/13 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/0401
摘要： PURPOSE: An epoxy resin composition for sealing a semiconductor and a semiconductor device using the composition are provided, to prevent the shortage of a semiconductor even in case of a narrow pitch of the distance between connecting electrodes or conductor wires, thereby improving the confidence of a semiconductor device. CONSTITUTION: The epoxy resin composition comprises an epoxy resin; a phenol resin; and an inorganic filler for preventing the shortage of a semiconductor in the sealing step of a semiconductor by the composition. Preferably the inorganic filler contains 2.5 ppm or less of a carbon-coated inorganic filler particle having a particle size larger than the distance between connecting electrodes or conductor wires in the semiconductor device which contains a semiconductor chip mounted to an insulating substrate or a lead frame and electrically connected to the insulating substrate or the lead frame by a connecting electrode or a conductor wire, and is sealed by using the composition. Preferably the inorganic filler contains 50 wt% or more of a spherical molten silica particle, wherein the heat for melting the silica particle is obtained from the combustion heat of a heat source material not forming a carbon deposit on the surface of the spherical molten silica particle and an oxygen gas.
摘要翻译：目的：提供一种用于密封半导体的环氧树脂组合物和使用该组合物的半导体器件，即使在连接电极或导体线之间的距离窄的间距的情况下也可防止半导体的短缺，从而提高半导体的置信度半导体器件。构成：环氧树脂组合物包含环氧树脂; 酚醛树脂; 以及通过该组合物防止半导体密封工序中的半导体缺乏的无机填料。优选地，无机填料含有2.5ppm或更少的碳涂覆的无机填料颗粒，其粒径大于半导体器件中的连接电极或导体线之间的距离，该半导体器件包含安装到绝缘衬底或引线框的半导体芯片，通过连接电极或导线电连接到绝缘基板或引线框架，并通过使用该组合物进行密封。优选无机填料含有50重量％以上的球状熔融二氧化硅颗粒，其中用于熔化二氧化硅颗粒的热量由球形熔融二氧化硅颗粒表面上不形成碳沉积物的热源材料的燃烧热获得和氧气。

2. 发明公开

KR1020120117660A 반사 수지 시트, 발광 다이오드 장치 및 그 제조 방법 无效
标题翻译：反光树脂片，发光二极管装置及其制造方法
公开(公告)号：KR1020120117660A
公开(公告)日：2012-10-24
申请号：KR1020120037769
申请日：2012-04-12
申请人： 닛토덴코 가부시키가이샤
发明人： 오오야부야스나리 , 니시오카츠토무 , 이토히사타카 , 나이토도시키
IPC分类号： H01L33/60 , H01L33/50
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L2224/16225 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012 , H01L2224/81
摘要： PURPOSE: A reflection resin sheet, a light emitting diode device, and a manufacturing method thereof are provided to improve light extraction efficiency by reflecting light from a light emitting diode device by a reflection resin layer. CONSTITUTION: A reflection resin sheet includes a release base material and a reflection resin layer(4). The reflection resin layer is formed on one side of the release base material in a transverse direction and corresponds to a light emitting diode device(3).
摘要翻译：目的：提供反射树脂片，发光二极管器件及其制造方法，以通过反射树脂层反射来自发光二极管器件的光来提高光提取效率。构成：反射树脂片包括剥离基材和反射树脂层（4）。反射树脂层在横向上形成在剥离基材的一侧上，并且对应于发光二极管器件（3）。

3. 发明公开

KR1020120130131A 수지 혼련물 및 시트 无效
标题翻译：树脂材料和板材
公开(公告)号：KR1020120130131A
公开(公告)日：2012-11-29
申请号：KR1020120052951
申请日：2012-05-18
申请人： 닛토덴코 가부시키가이샤
发明人： 도리나리츠요시 , 오노히로후미 , 야마네미노루 , 도요다에이지 , 시미즈유사쿠 , 니시오카츠토무
IPC分类号： C08J9/00 , C08J5/18 , B01F7/08 , B29B7/48
CPC分类号： B29C47/6056 , B29C47/662
摘要： PURPOSE: A resin kneaded material is provided to reduce number of pores and size of pores in voids and to be suitably used in various industrial fields. CONSTITUTION: In a resin kneaded material, a number of pores of 20 micron or more per 4.00 mm^2 is 30 or less, and water content is 0-800 ppm. A sheet is formed of the resin kneaded of the resin kneaded material. The resin kneaded material is obtained by kneading of a kneader. The kneader comprises a barrel(2), and a kneading shaft(3) inserted into the barrel. The barrel comprises an induction part in an induction part(4) for introducing a kneading object into the barrel, and a discharge part(5) in the other side for discharging a kneaded material to outside the barrel.
摘要翻译：目的：提供一种树脂捏合材料，以减少孔隙的孔数和孔隙的大小，并适用于各种工业领域。构成：在树脂捏合材料中，每4.00mm 2的数量为20微米以上的孔隙为30以下，含水量为0〜800ppm。由树脂捏和材料捏合的树脂形成片材。通过捏合机捏合树脂捏和材料。捏合机包括筒体（2）和插入筒体中的捏合轴（3）。所述筒体包括在用于将揉捏物体引入所述筒体的诱导部分（4）中的感应部分和用于将捏合材料排出到所述筒体外侧的另一侧的排出部分（5）。

4. 发明授权

KR100676002B1 반도체 밀봉용 에폭시 수지 조성물 및 이를 사용하는반도체 디바이스 失效
标题翻译：用于半导体封装的环氧树脂组合物和使用其的半导体器件
公开(公告)号：KR100676002B1
公开(公告)日：2007-01-29
申请号：KR1020030079792
申请日：2003-11-12
申请人： 닛토덴코 가부시키가이샤
发明人： 아키즈키신야 , 이케무라가즈히로 , 이토히사타카 , 우치다다카히로 , 에토다쿠야 , 니시오카츠토무 , 시마다가츠미
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , C08G59/621 , C08K3/04 , C08K3/36 , C08K9/02 , H01L2224/13 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2224/0401
摘要： 본 발명은 반도체 디바이스내의 접속용 전극 간격 또는 도전체 배선 간격의 좁은 피치에서도 단락을 초래하지 않아 신뢰성이 높은 반도체 디바이스를 수득할 수 있는 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 디바이스에 관한 것이다. 상기 반도체 밀봉용 에폭시 수지 조성물은 (A) 에폭시 수지, (B) 페놀 수지, 및 (C) 반도체 밀봉 단계에서 반도체의 단락을 방지할 수 있는 무기 충전제를 포함한다.

5. 发明公开

KR1020120130132A 혼련기 无效
标题翻译：打码机
公开(公告)号：KR1020120130132A
公开(公告)日：2012-11-29
申请号：KR1020120052960
申请日：2012-05-18
申请人： 닛토덴코 가부시키가이샤
发明人： 도리나리츠요시 , 오노히로후미 , 야마네미노루 , 도요다에이지 , 시미즈유사쿠 , 니시오카츠토무
IPC分类号： B01F7/08 , B29B7/46 , B29B7/84
CPC分类号： B29C47/6056 , B29C47/662
摘要： PURPOSE: A kneader is provided to minimize the failure rate of industrial products using kneaded products by suppressing bubble generating phenomenon. CONSTITUTION: A kneader(1) includes a continuous biaxial kneader and includes a barrel(2) and two kneading shafts(3). The barrel is in the shape of oval, and an introducing hole(4) is installed at one end part of the barrel. A target(A) is introduced into the barrel through the introducing hole. A discharging hole(5) discharges kneaded products(B) to the external side of the barrel. The introducing hole and the discharging hole penetrate through the side walls of the barrel. A melting and kneading part(6) is formed between the introducing hole and the discharging hole.
摘要翻译：目的：提供捏合机，以通过抑制发泡现象来最小化使用捏合产品的工业产品的故障率。构成：捏合机（1）包括连续双轴捏合机，包括筒体（2）和两个捏合轴（3）。筒体呈椭圆形，并在筒体的一端安装有导入孔（4）。目标（A）通过导入孔被引入筒体。排出孔（5）将捏合物（B）排出到桶的外侧。引导孔和排出孔穿过筒的侧壁。在引入孔和排出孔之间形成熔融混炼部（6）。

6. 发明公开

KR1020120117662A 형광 반사 시트, 발광 다이오드 장치 및 그 제조 방법 无效
标题翻译：磷光体反射片，发光二极管器件及其制造方法
公开(公告)号：KR1020120117662A
公开(公告)日：2012-10-24
申请号：KR1020120037785
申请日：2012-04-12
申请人： 닛토덴코 가부시키가이샤
发明人： 오오야부야스나리 , 이토히사타카 , 니시오카츠토무 , 나이토도시키
IPC分类号： H01L33/60 , H01L33/50
CPC分类号： H01L33/56 , H01L24/97 , H01L33/46 , H01L33/505 , H01L2224/16 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/005 , H01L2924/00
摘要： PURPOSE: A phosphor reflection sheet, a light emitting diode device, and a manufacturing method thereof are provided to improve light extraction efficiency by efficiently reflecting light using a reflection resin layer. CONSTITUTION: A phosphor reflection sheet includes a phosphor layer(5) and a reflection resin layer(4). The phosphor layer is formed on one side of a light emitting diode device(3) in a transverse direction. The reflection resin layer is formed on one side of the phosphor layer in the transverse direction. The reflection resin layer faces the side of the light emitting diode device. [Reference numerals] (AA) Back; (BB) Left; (CC) Right; (DD) Front
摘要翻译：目的：提供荧光体反射片，发光二极管器件及其制造方法，以通过使用反射树脂层有效地反射光来提高光提取效率。构成：荧光体反射片包括荧光体层（5）和反射树脂层（4）。荧光体层在横向上形成在发光二极管器件（3）的一侧。反射树脂层在宽度方向上形成在荧光体层的一侧。反射树脂层面向发光二极管装置的一侧。（附图标记）（AA）返回; （BB）左; （CC）权利; （DD）前

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式