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    • 3. 发明公开
    • 반도체 집적 회로 장치 및 그 제조 방법
    • 半导体集成电路器件及其制造
    • KR1020010020983A
    • 2001-03-15
    • KR1020000032336
    • 2000-06-13
    • 가부시키가이샤 히타치세이사쿠쇼
    • 마쯔오까히데유끼야마다사또루아사노이사무나가이료세끼구찌도모노리다께무라리이찌로
    • H01L27/108
    • H01L27/10855H01L27/0207H01L27/10814H01L27/10885H01L27/10894H01L27/10897Y10S257/906Y10S257/907Y10S257/908
    • PURPOSE: To improve noise resistance of a semiconductor integrated circuit device and in addition, to reduce the cell area of the device by respectively arranging first conductor layers in regions surrounded by work lines and bit lines, with the center of the conductor layers which are deviated from the center line of an active region formed along a third direction. CONSTITUTION: With respect to the direction of word lines, the distance between the centers of adjacent upper capacitor electrode plugs 22 is made longer than that between the centers of adjacent lower capacitor electrode plugs 16. With respect to the direction of bit lines, in addition, the distance between the centers of the adjacent upper capacitor electrode plugs 22 is made shorter than that between the centers of the adjacent lower capacitor electrode plugs 16. Consequently, short-circuiting with the bit line can be prevented, without using the self-aligning contact forming technique. Since the lower capacitor electrode plugs 16 are opened to be large, in addition, sufficient plug superposition can be secured even if the upper capacitor electrode plugs 22 are offset.
    • 目的:提高半导体集成电路器件的抗噪性,并且通过在由工作线和位线包围的区域中分别布置第一导体层来减小器件的单元面积,导体层的中心偏离 从沿着第三方向形成的有源区的中心线。 构成:对于字线的方向,使相邻的上部电容器电极插头22的中心之间的距离比相邻的下部电容器电极插头16的中心之间的距离长。相对于位线的方向,另外 相邻的上部电容器电极插头22的中心之间的距离比相邻的下部电容器电极插头16的中心之间的距离短。因此,可以防止与位线的短路而不使用自对准 接触成形技术。 由于较低的电容器电极插头16打开得很大,另外,即使上部电容器电极插头22偏移,也可以确保足够的插头重叠。