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1. 发明授权

KR101451028B1 ＬＥＤ 리드 프레임 제조방법 有权
标题翻译： LED引线框架制造方法
公开(公告)号：KR101451028B1
公开(公告)日：2014-10-15
申请号：KR1020130099416
申请日：2013-08-22
申请人： (주)옵토니카
发明人： 조대형 , 김정수 , 정대희 , 김화연 , 류진환
IPC分类号： H01L33/62 , H01L33/48 , H01L23/495
CPC分类号： H01L33/44 , H01L23/495 , H01L33/0095 , H01L33/62 , H01L2933/0025 , H01L2933/0066
摘要： The present invention relates to a method for manufacturing an LED lead frame. The method for manufacturing the LED lead frame comprises; an electric cleaning step of cleaning the surface of the LED lead frame made of the shape which satisfies a design value; an acid etching step of etching the LED lead frame which is electric-cleaned in the previous step with acid; a strike processing step of coating a Ag coating layer corresponding to a primary coating layer on the surface of the LED lead frame in which the surface is etched with a strike process; a pulse plating processing step of coating the Ag coating layer corresponding to a secondary coating layer on the LED lead frame in which the primary coating layer is formed through the Ag strike processing step with a pulse plating method; and an anti tarnishing processing step which prevents the discoloration of the LED lead frame in which the secondary coating layer is formed through the pulse plating processing step.
摘要翻译：本发明涉及一种LED引线框的制造方法。 LED引线框架的制造方法包括：清洁由满足设计值的形状制成的LED引线框的表面的电清洗步骤; 酸蚀刻步骤，用酸蚀刻在前一步骤中电清洗的LED引线框架; 打击处理步骤，其中通过冲击过程将表面被蚀刻的LED引线框架的表面上的与主要涂层相对应的Ag涂层涂覆; 脉冲电镀处理步骤，通过脉冲电镀法通过Ag冲击加工步骤，在形成有初级涂层的LED引线框架上涂覆与第二涂层相对应的Ag涂层; 以及通过脉冲电镀处理步骤防止其中形成有二次涂层的LED引线框架的变色的防褪色处理步骤。

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