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1. 发明授权

KR101809025B1 분지관 제조방법 有权
公开(公告)号：KR101809025B1
公开(公告)日：2018-01-18
申请号：KR1020160173500
申请日：2016-12-19
申请人： 이재하
发明人： 이재하
IPC分类号： F16L41/02 , F16L41/08 , F25B41/00 , B23K1/00 , B23K101/06
CPC分类号： F16L41/023 , B23K1/0008 , B23K2101/06 , F16L41/084 , F25B41/003
摘要： 본발명은분지관제조방법을제공하는것을목적으로하는것으로, 본발명의구성은연결관부(12A)에서두 방향으로분기되는분배관부(12B)를구비하고상기연결관부(12A)에는연결홀(12H)이형성된메인관체(12)를준비하는단계; 상기메인관체(12)의상기연결관부(12A)에형성된상기연결홀(12H)에관형상의커넥터(14)(2)의일단부를메인연결접합부(16M)에의해용접하는단계;를포함하며, 상기메인연결접합부(16M)를형성하기위한메인용제(16)의용융온도가상기메인관체(12)의상기분배관부(12B) 또는상기커넥터(14)의타단부를용접하기위한용제의용융온도보다더 높도록구성되며, 상기메인용제(16)는링형상의납링으로구성되어, 상기커넥터(14)의일단부측외주면에메인용제(16)를삽입한다음, 상기커넥터(14) 접합단계에서상기메인용제(16)인납링을용융시켜서상기커넥터(14)와메인관체(12)를상기메인연결접합부(16M)에의해서로연결하도록구성된것을특징으로한다.

2. 发明授权

KR101802240B1 어큐뮬레이터 제조방법 有权
公开(公告)号：KR101802240B1
公开(公告)日：2017-11-28
申请号：KR1020160173503
申请日：2016-12-19
申请人： 이재하
发明人： 이재하
IPC分类号： F25B43/00 , B23K1/008 , B23P15/00 , B23P19/04
摘要： 본발명은어큐뮬레이터제조방법을제공하는것을목적으로하는것으로, 본발명의구성은흡입관(12)의외주면에용접링(WR)을결합하는흡입관용접링결합단계; 상기용접링(WR)이바디(11)에구비된흡입포트(11A)의단부와마주하는위치에배치되도록상기흡입포트(11A)에상기흡입관(12)을삽입하는흡입관인서트단계; 토출관(13)의외주면에용접링(WR)을결합하는토출관용접링결합단계; 상기용접링(WR)이상기바디(11)에구비된토출포트(11B)의단부와마주하는위치에배치되도록상기토출포트(11B)에상기토출관(13)을삽입하는토출관(13) 인서트단계; 상기바디(11)에상기흡입관(12)과상기토출관(13)이결합된어큐뮬레이터어셈블리를가열로에투입하여상기흡입관(12)의상기용접링(WR)과상기토출관(13)의상기용접링(WR)의용융및 경화에의해상기바디(11)에상기흡입관(12)과상기토출관(13)이고정된어큐뮬레이터를제조하는단계;를포함하는것을특징으로한다.

3. 发明公开

KR1020140044998A 프로브 어레이 헤드 및 그를 갖는 프로브 카드 无效
标题翻译：探索阵列头和包含它的探针卡
公开(公告)号：KR1020140044998A
公开(公告)日：2014-04-16
申请号：KR1020120110472
申请日：2012-10-05
申请人： 화인인스트루먼트 (주) , 이재하
发明人： 이재하
IPC分类号： H01L21/66 , G01R1/073
摘要： The present invention relates to a probe array head and a probe card having the probe array head capable of maintaining the excellence of the probe pin arrangement of the probe card for a wafer check and easily performing the probe pin arrangement. The probe card comprises a support board, a plurality of probe array heads, a main circuit board, and an interface pin. The support board comprises a plurality of penetration holes which corresponds to wafer chips of a wafer. The plurality of probe array heads is installed into the penetration holes and comprises a plurality of probe pins which corresponds to the pads of the semiconductor chip of the wafer. The main circuit board in which the support board is installed is electrically connected to the probe array heads. The interface pin is arranged between the probe array head and the main circuit board and electrically connects the probe pin of the probe array head and the main circuit board. Each probe array head comprises the support board, a flexible probe board, and the probe pins. The probe board is positioned on the support board. The probe pins are positioned on the probe board.
摘要翻译：本发明涉及一种具有探针阵列头的探针阵列头和探针卡，其能够保持用于晶片检查的探针卡的探针引脚布置的优异性并且容易地执行探针引脚布置。探针卡包括支撑板，多个探针阵列头，主电路板和接口引脚。支撑板包括对应于晶片的晶片芯片的多个穿透孔。多个探针阵列头安装在穿透孔中并且包括对应于晶片的半导体芯片的焊盘的多个探针。安装有支撑板的主电路板电连接到探针阵列头。接口针布置在探头阵列头和主电路板之间，并将探头阵列头的探针与主电路板电连接。每个探针阵列头包括支撑板，柔性探针板和探针。探针板位于支撑板上。探头针位于探针板上。

4. 发明公开

KR1020110119498A 프로브 카드용 프로브 핀 및 그의 제조 방법 有权
标题翻译：用于探针卡的探针及其制造方法
公开(公告)号：KR1020110119498A
公开(公告)日：2011-11-02
申请号：KR1020100081020
申请日：2010-08-20
申请人： 화인인스트루먼트 (주) , 한국기계연구원 , 이재하
发明人： 이재하 , 정용수 , 이주열
IPC分类号： H01L21/66 , G01R1/073
CPC分类号： G01R1/06733 , G01R1/07307 , G01R3/00 , G01R31/2601
摘要： PURPOSE: A probe pin for a probe card and a manufacturing method thereof are provided to easily control the pin pressure of a probe pin by connecting upper and lower beam parts with a pin pressure control bar. CONSTITUTION: A connection unit(10) is inserted into a via hole of a probe board and is connected to the probe board. One end of a beam part(20) is connected to the upper side of the connection unit and is horizontally extended. The beam part includes a pin pressure control bar(23) which connects one side of the bottom to the other side of the ceiling. A contact unit(30) is connected to the other side of the beam part and is upwardly sprayed. The contact unit has a contact tip(33) in contact with the pad of the semiconductor chip formed on the wafer.
摘要翻译：目的：提供用于探针卡的探针及其制造方法，以通过用针压力控制杆连接上梁和下梁部分来容易地控制探针的销压力。构成：将连接单元（10）插入到探针板的通孔中，并连接到探针板。梁部分（20）的一端连接到连接单元的上侧并且水平延伸。梁部分包括将底部的一侧连接到天花板的另一侧的销压力控制杆（23）。接触单元（30）连接到梁部分的另一侧并向上喷射。接触单元具有与形成在晶片上的半导体芯片的焊盘接触的接触尖端（33）。

5. 发明公开

KR1020110062666A 시계바늘에야광 无效
标题翻译：时钟通知
公开(公告)号：KR1020110062666A
公开(公告)日：2011-06-10
申请号：KR1020090119453
申请日：2009-12-04
申请人： 이재하
发明人： 이재하
IPC分类号： G04B19/32
CPC分类号： G04B19/32
摘要： PURPOSE: A luminous clock needle is provided to enable a user to check the time at night by attaching luminous material to a clock needle and number pad. CONSTITUTION: A luminous clock needle comprises a clock needle, a number pad, and a fluorescent material. The fluorescent material is attached to the clock needle. The fluorescent material is attached to the number pad. The luminous clock needle enables a user to check the time at night by attaching luminous material to a clock needle and number pad.
摘要翻译：目的：提供发光的时钟针，使用户能够通过将发光材料连接到时钟针和数字键来检查夜间的时间。构成：发光钟针包括时钟针，数字键盘和荧光材料。荧光材料连接到钟针。荧光材料连接到数字键盘。发光钟针使用户能够通过将发光材料附加到时钟针和数字键来检查夜间的时间。

6. 发明公开

KR1020100057488A 프로브 카드 및 그 제조 방법 有权
标题翻译：探针卡及其制造方法
公开(公告)号：KR1020100057488A
公开(公告)日：2010-05-31
申请号：KR1020090100587
申请日：2009-10-22
申请人： 화인인스트루먼트 (주) , 이재하
发明人： 이재하
IPC分类号： H01L21/66 , G01R1/067
CPC分类号： G01R1/07342 , Y10T156/10 , Y10T156/1052
摘要： PURPOSE: It forms into the material having the coefficient of thermal expansion which the probe card and manufacturing method thereof are similar the probe substrate in which the probe pin is inserted to wafer. The pad position secession of the probe pin due to the heat expansion rate between the probe card and wafer are prevented. CONSTITUTION: The supporting plate(10) is combined on the main circuit substrate(40). It is formed into the material having the coefficient of thermal expansion which the supporting plate is similar to wafer. The probe substrate(20) comprises the circuit pattern in inside. The probe substrate comprises the circuit pattern and electrically connected a plurality of via hole. The circuit pattern of the probe substrate is electrically connected to the main circuit substrate.
摘要翻译：目的：形成具有探针卡和探针的插入晶片的探针基板的制造方法相同的热膨胀系数的材料。由于探针卡和晶片之间的热膨胀率而导致的探针的焊盘位置脱离被阻止。构成：支撑板（10）组合在主电路基板（40）上。它被形成具有支撑板类似于晶片的热膨胀系数的材料。探针基板（20）包括内部的电路图案。探针基板包括电路图案并电连接多个通孔。探针基板的电路图案与主电路基板电连接。

7. 发明公开

KR1020080098188A 글라스 캡 및 이를 이용한 평판패널의 방전가스 주입방법 失效
标题翻译：玻璃盖和使用其的平板喷射等离子体气体的方法
公开(公告)号：KR1020080098188A
公开(公告)日：2008-11-07
申请号：KR1020070043546
申请日：2007-05-04
申请人： 이재하
发明人： 박재홍 , 최인수
IPC分类号： H01J11/50 , H01J31/12 , H01J9/38
摘要： A glass cap and a method for injecting the discharge gas of a flat panel by using the same are provided to inject discharge gas into inside of a flat panel, thereby reducing the time necessary for the injection process of exhaust and discharge gas. A glass cap includes a body(21) made of glass or metal; movable layers(22,23) which are placed at lower and upper parts of the body and made of low melting point glass; and a through hole(24) which passes through the body and the movable layers vertically from the center point of the lower movable layer. The body of the glass cap has a horizontal width of approximately 10mm and a height of 1-2mm.
摘要翻译：提供玻璃盖和通过使用其来喷射平板的放电气体的方法以将放电气体注入到平板内部，从而减少排气和排出气体的喷射处理所需的时间。玻璃盖包括由玻璃或金属制成的主体（21）; 可移动层（22,23），其放置在主体的下部和上部并由低熔点玻璃制成; 以及从下部可移动层的中心点垂直地穿过主体和可动层的通孔（24）。玻璃帽的主体的水平宽度约为10mm，高度为1-2mm。

8. 发明授权

KR100858027B1 프로브 카드의 프로브 어셈블리 및 그 제조 방법 失效
标题翻译：探针卡组件及其制造方法
公开(公告)号：KR100858027B1
公开(公告)日：2008-09-10
申请号：KR1020070123686
申请日：2007-11-30
申请人： 이재하
发明人： 이재하
IPC分类号： H01L21/66 , G01R1/067
CPC分类号： G01R1/06733 , G01R3/00 , G01R31/2601
摘要： A probe assembly of a probe card and a manufacturing method thereof are provided to prevent physical and electrical interference between adjacent probe pins by forming separate spaces between adjacent exposure holes. A substrate(20) includes a circuit wiring(22) and a pad(24) connected electrically with the circuit wiring. A conductive adhesive(40) is formed on the pad. A probe pin(10) is fixed physically by a conductive adhesive and is electrically connected to the pad. The probe pin includes a connective pillar(12) inserted vertically into the conductive adhesive, a horizontal beam(14) extended horizontally from the connective pillar, and a contact tip(16) extended from horizontal beam. A supporting layer(30) is formed on a surface of the substrate in order to be separated from the horizontal beam of the probe pin. The supporting layer includes an exposure hole(32) which is filled with the conductive adhesive.
摘要翻译：提供探针卡的探针组件及其制造方法，以通过在相邻曝光孔之间形成分开的空间来防止相邻探针之间的物理和电气干扰。基板（20）包括与电路布线电连接的电路布线（22）和焊盘（24）。导电粘合剂（40）形成在垫上。探针（10）通过导电粘合剂物理固定并且电连接到焊盘。探针包括垂直插入导电粘合剂的连接柱（12），从连接柱水平延伸的水平梁（14）和从水平梁延伸的接触尖端（16）。在基板的表面上形成支撑层（30），以便与探针的水平光束分离。支撑层包括填充有导电粘合剂的曝光孔（32）。

9. 发明公开

KR1019970071952A 전계방출형 디스플레이용 초고진공 실장방법 및 장치 失效
标题翻译：用于场发射型显示器的超高真空封装方法和设备
公开(公告)号：KR1019970071952A
公开(公告)日：1997-11-07
申请号：KR1019970026696
申请日：1997-06-24
申请人： 이종덕 , 권용범 , 권상직 , 이재하
发明人： 이종덕 , 권상직 , 이재하 , 권용범
IPC分类号： H01J9/24 , H01J1/30
摘要： 본 발명은 FED용 초고진공 실장방법 및 장치에 관한 것으로서, FED 판넬의 생산성을 크게 향상시키는 동시에 판넬 내부의 오염도를 저감시킬 수 있는 FED용 초고진공 실장방법 및 장치를 제공하기 위한 것인 바, '초기 가열/세정 챔버'와 '초고진공/밀봉 챔버'로 구성된 두 개의 메인 챔버와 다수의 보조 챔버를 포함하는 장치를 사용하여, 모든 구성요소들을 시종초고진공 상태가 유지되는 챔버내에서 인-라인 방식으로 처리함으로써, FED 판넬의 생산성을 크게 향상시키는 효과가 있는 한편, FED 완성품의 미관이 개선되는 장점도 있다.

10. 实用新型

KR2019950019198U 방음용 출입문 无效
标题翻译：隔音门
公开(公告)号：KR2019950019198U
公开(公告)日：1995-07-24
申请号：KR2019930027095
申请日：1993-12-10
申请人： 이재하
发明人： 이재하
IPC分类号： E06B7/16
摘要： 본고안은방음용출입문에관한것으로, 특히공간(15)이적어도 2개이상으로구획되도록하는격판(14)이도어몸체(10)내에고정설치되어, 소음발생원으로부터도어몸체(10)의타측으로전달되는것을보다완전하게차단하여보다실내를쾌적하고조용한환경으로유지할수가있는것이다. 또, 단열의효과를겸할수 있어동절기및 하절기와같이냉, 난방을수행할경우에너지가낭비되는것을차단하여경제적인이익을주게될 뿐만아니라, 강도가우수해지므로수분등에의해뒤틀리거나하는경우를미연에방지하여전체적인수명이연장되는등의현저히진보된효과가있는것이다.

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