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    • 82. 发明授权
    • 판상 재료의 가공면 결정 방법, 가공 방법 및 이들 장치
    • 판상재료의가공면결정방법,가공방법및이들장치
    • KR100876574B1
    • 2008-12-31
    • KR1020077007566
    • 2005-06-27
    • 닛코 킨조쿠 가부시키가이샤
    • 나카시마고이치고마치노부요시
    • G05B19/404
    • G05B19/401B23Q15/14G01B11/30G05B19/404G05B2219/37049G05B2219/37402G05B2219/37596G05B2219/50046G05B2219/50063Y02P80/40
    • Provided is a surface treatment method for performing machining such as cutting work, grinding, and electrical discharging to a plate-like material with two- or three-dimensional deformation to realize a uniform thickness. This method includes the steps of mounting the plate-like material on a surface plate, setting a coordinate axis in a plane direction of the plate-like material to be X, Y and setting a coordinate axis in a height direction of the plate-like material to be Z, virtualizing a surface containing an origin of the measured Z direction, measuring a height Z 1-n from the origin in an arbitrary plane position, and inclining and cutting the plate-like material so that an absolute value of a difference between a maximum value Z max and a minimum value Z min of the obtained height data will be minimum. Although a ceramic sintered plate such as a sputtering target or a metal plate prepared by metal rolling or forging, in most instances, is subject to two- or three-dimensional deformation as a result of thermal stress or machining stress during the manufacturing process, this invention is able to obtain a flat plate-like material having a uniform thickness and minimal machining costs from a plate-like material with two-or three-dimensional deformation.
    • 本发明提供一种对二维或三维变形的板状材料进行切削加工,研磨加工,放电加工等的加工以实现均匀的厚度的表面处理方法。 该方法包括以下步骤:将板状材料安装在平台上,将板状材料的平面方向上的坐标轴设为X,Y,并将该坐标轴设定为板状的高度方向 材料为Z,将包含测量的Z方向的原点的表面虚拟化,在任意平面位置测量从原点开始的高度Z 1-n,并且倾斜并切割板状材料,使得差值的绝对值 在所获得的高度数据的最大值Z max和最小值Z min之间将是最小的。 虽然通过金属轧制或锻造制备的诸如溅射靶或金属板的陶瓷烧结板在大多数情况下由于在制造过程期间的热应力或加工应力而受到二维或三维变形,但是这 本发明能够从具有二维或三维变形的板状材料获得具有均匀厚度和最小加工成本的平板状材料。
    • 83. 发明公开
    • 스퍼터링 타겟
    • 飞溅目标
    • KR1020070121025A
    • 2007-12-26
    • KR1020077024857
    • 2006-03-28
    • 닛코 킨조쿠 가부시키가이샤
    • 미야시타히로히토
    • C23C14/34
    • C23C14/3414
    • A sputtering target comprising Ta or a Ta alloy, characterized in that the {110} plane X-ray diffraction intensity ratio is not more than 0.4, even not more than 0.2. A sputtering target comprising Ta or a Ta alloy, characterized in that the {110} plane X-ray diffraction intensity ratio in the target surface is not more than 0.8 and the {110} plane X-ray diffraction intensity ratio in a depth of 100 V or more is not more than 0.4. These Ta or Ta alloy targets can minimize a variation in film formation rate for each target during the life of sputtering targets, and thus can improve and stabilize the production efficiency of semiconductors in the sputtering process and can contribute to a reduction in production cost.
    • 一种包含Ta或Ta合金的溅射靶,其特征在于{110}平面X射线衍射强度比不大于0.4,甚至不大于0.2。 一种包含Ta或Ta合金的溅射靶,其特征在于,目标表面中的{110}面X射线衍射强度比不大于0.8,深度为{110}平面X射线衍射强度比为100 V以上不超过0.4。 这些Ta或Ta合金靶可以使溅射靶的寿命期间每个靶的成膜速度变化最小化,从而可以提高和稳定溅射工艺中半导体的生产效率,并且可以有助于降低生产成本。
    • 86. 发明公开
    • 스퍼터링 타겟 - 백킹 플레이트 조립체 및 막 형성 장치
    • 喷射目标,飞溅目标背板组件和薄膜沉积系统
    • KR1020070063600A
    • 2007-06-19
    • KR1020077011166
    • 2005-10-14
    • 닛코 킨조쿠 가부시키가이샤
    • 미야시타히로히토
    • C23C14/34
    • H01J37/3423C23C14/3407H01J37/3435
    • A sputtering target, i.e. a planar target on which an erosion portion and a non-erosion portion are formed, characterized in that the surface area thereof is between 100% and 125% of a surface area when the target is assumed to be planar. A sputtering target, i.e. a planar target on which an erosion portion and a non-erosion portion are formed, characterized in that one or a plurality of recesses are provided in the target surface region, and the surface area thereof is between 100% and 125% of a surface area when the target is assumed to be planar. An inexpensive, small-capacity power supply can be used by minimizing electrical variation in a sputter circuit as much as possible throughout the lifetime of the target by self sputtering or high power sputtering.
    • 溅射靶,即其上形成有侵蚀部分和非侵蚀部分的平面靶,其特征在于当所述靶被假定为平面时,其表面积在表面积的100%至125%之间。 溅射靶,即其上形成有侵蚀部分和非侵蚀部分的平面靶,其特征在于,在目标表面区域中设置一个或多个凹部,其表面积为100〜125 假定目标为平面时的表面积的%。 通过自溅射或高功率溅射,尽可能地在靶的整个寿命期间最小化溅射电路中的电变化,可以使用廉价的小容量电源。
    • 89. 发明公开
    • 가공이 용이한 고력 고도전성 구리합금
    • 易于操作的导电铜合金,具有高强度和高电导率
    • KR1020040038677A
    • 2004-05-08
    • KR1020030074083
    • 2003-10-23
    • 닛코 킨조쿠 가부시키가이샤
    • 간무리가쯔끼후까마찌가즈히꼬
    • C22C9/00
    • PURPOSE: To provide easily-workable conductive copper alloy with high strength and high electric conductivity which does not impair the action of so-called third element. CONSTITUTION: The copper alloy has a composition comprising 0.05 to 1.0 wt.% of Cr and 0.05 to 0.25 wt.% of Zr, and further comprising 0.01 to 1.0 wt.%, in total, of one or two or more selected from Zn, Sn, Mn, P, In, Mg, Fe, Ni, Be, Al, B, Co and Si, and the balance of Cu and inevitable impurities, wherein a total amount of Zn, Sn, Mn, P, In, Mg, Fe, Ni, Be, Al, B, Co and Si contained in an inclusion having a particle diameter of 2 μm or more is 5 wt.% or less.
    • 目的:提供高强度,高导电性的易于使用的导电铜合金,不会损害所谓的第三元素的作用。 构成:铜合金具有0.05〜1.0重量%的Cr和0.05〜0.25重量%的Zr的组成,进一步含有0.01〜1.0重量%的选自Zn, Sn,Mn,P,In,Mg,Fe,Ni,Be,Al,B,Co和Si,其余为Cu和不可避免的杂质,其中Zn,Sn,Mn,P,In,Mg, 包含在粒径为2μm以上的夹杂物中的Fe,Ni,Be,Al,B,Co和Si为5重量%以下。
    • 90. 发明授权
    • 구리 전해전물의 처리방법
    • 구리전해전물의처리방법
    • KR100423350B1
    • 2004-03-18
    • KR1020010034765
    • 2001-06-19
    • 닛코 킨조쿠 가부시키가이샤
    • 아베요시후미다께바야시가즈아끼
    • C22B11/00
    • PURPOSE: A method for treating anode slime of copper electrolysis is provided to develop anode slime wet type treating process capable of efficiently separating platinum group·gold and selenium·tellurium and efficiently separating and recovering the selenium and tellurium. CONSTITUTION: The method comprises the processes of performing pretreatment by passing the anode slime through decopper process, chloridation process and gold extraction process; and performing a treatment comprising the steps of obtaining platinum group·gold contained tailings by blowing sulfur dioxide diluted to a concentration of 8 to 12% using air to the obtained gold extracted solution at a temperature of 60 to 90 deg.C in the amount of 8 to 15 times of mole concentration of the platinum group·gold with chlorine ion concentration in the gold extracted solution being maintained to 1.5 mol/L or less, thereby separating the platinum group·gold and selenium·tellurium remained in the gold extracted solution, obtaining selenium contained tailings by blowing sulfur dioxide to the platinum group·gold separated solution in the amount of 2 times or less of mole concentration of selenium at a temperature of 60 to 90 deg.C as maintaining chlorine ion concentration in the platinum group·gold separated solution to 2.0 mol/L or less and maintaining concentration of selenium in the solution to 3 g/L or more, and obtaining tellurium contained tailings by blowing sulfur dioxide to the selenium separated solution at a temperature of 60 to 90 deg.C.
    • 目的:提供一种处理铜电解阳极泥的方法,以开发能够有效分离铂族和金和硒碲并有效分离和回收硒和碲的阳极泥湿法处理工艺。 构成:该方法包括将阳极泥通过脱铜过程,氯化过程和金萃取过程进行预处理的过程; 并且进行处理,该处理包括以下步骤:通过将空气稀释至浓度为8至12%的二氧化硫,在60至90℃的温度下,使用空气将金属萃取的所得溶液吹入含有铂族和含金的尾矿 用量为金属萃取溶液中氯离子浓度保持在1.5mol / L或更低的铂族和金的摩尔浓度的8到15倍,从而分离出铂族金和硒的中间体。 碲保留在金提取溶液中,通过将二氧化硫吹入温度为60至90℃的铂族和金分离溶液的量为2倍或更少硒摩尔浓度,得到含硒尾矿, 将铂族和金分离溶液中的氯离子浓度保持在2.0mol / L以下,并将该溶液中的硒浓度保持在3g / L以上 通过在60〜90℃的温度下向二氧化硒分离液中吹入二氧化硫而得到含碲尾矿。