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31. 发明公开

KR1020120067958A 스크린을 구비한 인쇄회로기판 无效
标题翻译：印刷电路板与屏幕
公开(公告)号：KR1020120067958A
公开(公告)日：2012-06-26
申请号：KR1020110135673
申请日：2011-12-15
申请人： 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지
发明人： 알렉산더바이겔 , 마리오미첼
IPC分类号： H05K9/00 , H05K3/46 , H05K1/18
CPC分类号： H05K1/0218 , H05K1/0228 , H05K1/0237 , H05K2201/09354 , H05K2201/09618 , H05K2201/09972
摘要： PURPOSE: A printed circuit board which includes a screen is provided to improve electromagnetic compatibility(EMC) of an entire circuit board by arranging the screen between partial circuits which are sensitive to EMC interference. CONSTITUTION: A carrier plate(4) has an upper surface(6) and a lower surface(8). An electric circuit(12) comprises a first conductor track surface(10a) and a second conductor track surface(10b) separated from the first conductor track surface. The electric circuit occupies one or more parts(18) of the carrier plate. A printed circuit board(2) comprises a screen(20) which isolates the circuit from indirect electromagnetic radiation. The screen is arranged on the first conductor track surface. A first screen conductor track(22a) confines the part in a closed mode. A second screen conductor track(22b) is arranged on the second conductor track surface. The first screen conductor track and the second screen conductor track are mutually matched at least on a peripheral region(24). The screen penetrates the carrier plate on the peripheral region.
摘要翻译：目的：提供一种包括屏幕的印刷电路板，通过在对EMC干扰敏感的部分电路之间布置屏幕来提高整个电路板的电磁兼容性（EMC）。构成：承载板（4）具有上表面（6）和下表面（8）。电路（12）包括与第一导体轨道表面分离的第一导体轨道表面（10a）和第二导体轨迹表面（10b）。电路占据载体板的一个或多个部分（18）。印刷电路板（2）包括将电路与间接电磁辐射隔离的屏幕（20）。屏幕布置在第一导体轨道表面上。第一屏幕导体轨道（22a）将零件限制在闭合模式。在第二导体轨道表面上布置有第二屏蔽导体轨道（22b）。至少在周边区域（24）上相互匹配第一屏幕导体轨道和第二屏幕导体轨迹。屏幕穿透周边区域上的载板。

32. 发明公开

KR1020090042841A 동일 평면 회로 및 접지 트레이스들을 갖고, 설정가능한 접지 링크를 갖는 회로 보드 无效
标题翻译：具有可配置地线的电路板和共模电路和地线
公开(公告)号：KR1020090042841A
公开(公告)日：2009-04-30
申请号：KR1020097005008
申请日：2007-08-10
申请人： 티이 커넥티비티 코포레이션
发明人： 바르톨로뮤,빅터,엘.
IPC分类号： H05K1/02
CPC分类号： H05K1/0219 , H05K1/0201 , H05K1/0293 , H05K1/117 , H05K3/3405 , H05K3/3452 , H05K2201/0305 , H05K2201/062 , H05K2201/09236 , H05K2201/093 , H05K2201/09336 , H05K2201/09354 , H05K2201/0969 , H05K2201/10356 , H05K2203/173 , Y10S439/943 , Y10T29/49155
摘要： A transition circuit board (100) for transitioning a cable to a connector is provided. A circuit board has an outer surface (104) with a circuit trace (106), ground plane (120) and ground link (118) provided thereon. A cable pad (114) and a contact pad (116) are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating (168) is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.
摘要翻译：提供了一种用于将电缆转换到连接器的过渡电路板（100）。电路板具有其上设置有电路迹线（106），接地平面（120）和接地连接（118）的外表面（104）。在电路迹线的相对端设有电缆垫（114）和接触垫（116）。接地链路与地平面电气共用，并且位于与电路迹线相邻并与电路迹线隔开的空间。在电路板的至少一部分，接地平面和电路板的外表面上提供绝缘涂层（168）。绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

33. 发明公开

KR1020090010801A 분리 그라운드를 구비하는 인쇄 회로 기판과 이를 이용한휴대 단말기 无效
标题翻译：具有独立地面的印刷电路板和使用其的移动终端
公开(公告)号：KR1020090010801A
公开(公告)日：2009-01-30
申请号：KR1020070074195
申请日：2007-07-24
申请人： 삼성전자주식회사
发明人： 장석민 , 이한덕 , 라용준
IPC分类号： H05K1/02 , H04B1/38
CPC分类号： H05K1/0215 , H01Q1/243 , H04B1/3833 , H05K2201/09354
摘要： A PCB and mobile terminal using the same are provided to control ground length of a PCB by controlling inductance or capacitance of a connection device. A PCB comprises a substrate ground and connection devices(130, 131, 132). The substrate ground comprises main grounds(110, 111, 112) and isolation grounds(120, 121, 122). The isolation ground is separated from the main ground. The connection device is an inductor or a capacitor. A size of the main ground is larger than a size of the isolation ground. A ground length of the PCB is controlled according to inductance of the inductor or capacitance of the capacitor. If the inductance of the inductor increases, the ground length is increased. If the inductance of the inductor decreases, the ground length is decreased. If the capacitance of the capacitor increases, the ground length is decreased. If the capacitance of the capacitor decreases, the ground length is increased.
摘要翻译：通过控制连接装置的电感或电容，提供使用其的PCB和移动终端来控制PCB的接地长度。 PCB包括衬底接地和连接装置（130,131,132）。衬底接地包括主接地（110,111,112）和隔离接地（120,121,122）。隔离地与主地相分离。连接装置是电感器或电容器。主地面的尺寸大于隔离地面的大小。 PCB的接地长度根据电感的电感或电容的电容来控制。如果电感的电感增加，则接地长度增加。如果电感的电感减小，则接地长度减小。如果电容器的电容增加，则接地长度减小。如果电容器的电容减小，则接地长度增加。

34. 发明公开

KR1020080081341A 몰드형 어레이 패키지에 통합 무선 주파수 차폐물을제공하는 방법 및 시스템 无效
标题翻译：用于在模制阵列包中提供整体无线电频率屏蔽的方法和系统
公开(公告)号：KR1020080081341A
公开(公告)日：2008-09-09
申请号：KR1020087017997
申请日：2006-12-21
申请人： 아트멜 코포레이션
发明人： 람,켄
IPC分类号： H01L23/552 , H01L21/00
CPC分类号： H01L23/552 , H01L21/561 , H01L23/3121 , H01L24/97 , H01L2224/16 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/15747 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/284 , H05K2201/09354 , H01L2924/00
摘要： A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature, and a protective layer. The electronics package is physically coupled to at least one additional electronics package through at least the substrate. The method and system include exposing a portion of the ground contact feature(s) by removing a portion of the electronics package above the ground contact feature(s). The exposing step forms at least one trench above the ground contact feature(s). The method and system also include depositing an electromagnetic radiation shield that substantially covers the electronics package, fills the trench(es), and is electrically connected to the ground contact feature(s). The method and system also include separating the electronics package from the additional electronics package(s) such that a remaining portion of the electromagnetic radiation shield that substantially encloses a portion of the electronics package above the ground contact feature(s) remains.
摘要翻译：公开了一种用于制造电子封装的电磁辐射屏蔽的方法和系统。电子封装包括衬底，至少一个接地接触特征和保护层。所述电子封装通过至少所述衬底与至少一个额外的电子封装物理耦合。该方法和系统包括通过移除地面接触特征之上的电子组件的一部分来暴露接地接触特征的一部分。曝光步骤在地面接触特征之上形成至少一个沟槽。该方法和系统还包括沉积基本上覆盖电子封装的电磁辐射屏蔽物，填充沟槽，并且电连接到接地触点特征。该方法和系统还包括将电子封装与附加的电子封装分开，使得电磁辐射屏蔽的剩余部分基本上封闭电子封装在接地触头特征之上的部分。

35. 发明公开

KR1020070093849A 접지 도체를 구비한 전기 모터용 인쇄 회로 기판 및 전기모터 无效
标题翻译：印刷电路板与电动马达与电动马达接地导体
公开(公告)号：KR1020070093849A
公开(公告)日：2007-09-19
申请号：KR1020070024386
申请日：2007-03-13
申请人： 인테바 프로덕츠 프랑스 에스에이에스
发明人： 브나마리-피에르 , 르브르주아미카엘 , 로벵로랑
IPC分类号： H05K1/02 , H02K11/00
CPC分类号： H05K1/0215 , H02K11/33 , H02K11/40 , H02K2211/03 , H05K3/325 , H05K2201/09354
摘要： A PCB(Printed Circuit Board) with a ground conductor for an electric motor and an electric motor are provided to implement a reliable contact with the ground conductor by forming a metal wiring on the outer terminal part of the PCB. A PCB with a ground conductor for an electric motor includes two main substrate planes(12,14), four outer terminal parts(16,18,20,22), electric devices(12), and a metal wiring(26). The metal wiring(26) is formed on one of the outer terminal parts(18). The metal wiring(26) is made of a material substance which has a high electrical conductivity. The metal wiring(26) is plated to prevent corrosion and makes electrical connection with the ground conductor on the PCB.
摘要翻译：提供具有用于电动机和电动机的接地导体的PCB（印刷电路板），以通过在PCB的外部端子部分上形成金属布线来实现与接地导体的可靠接触。具有用于电动机的接地导体的PCB包括两个主要基板平面（12,14），四个外部端子部分（16,18,20,22），电气装置（12）和金属布线（26）。金属配线（26）形成在外端子部（18）的一方上。金属布线26由具有高导电性的材料制成。电镀金属布线（26）以防止腐蚀并与PCB上的接地导体电连接。

36. 发明授权

KR100455021B1 인쇄회로기판용 이엠아이 차폐구조 및 차폐방법 失效
标题翻译：印制电路板的EMI屏蔽结构和屏蔽方法
公开(公告)号：KR100455021B1
公开(公告)日：2004-11-06
申请号：KR1020030058610
申请日：2003-08-25
申请人： 비아시스템즈 그룹 아이엔씨
发明人： 코톤,마틴,에이.
IPC分类号： H05K1/02
CPC分类号： H05K1/0221 , H01L23/552 , H01L2924/0002 , H05K1/0218 , H05K1/115 , H05K3/0035 , H05K3/0041 , H05K3/4652 , H05K2201/09036 , H05K2201/09354 , H05K2201/09509 , H05K2201/09854 , H05K2201/09981 , H01L2924/00
摘要： Non-circular micro-vias (102) for printed circuit boards are disclosed and a method of making them.
摘要翻译：公开了用于印刷电路板的非圆形微通孔（102）及其制造方法。

37. 发明公开

KR1020030074544A 인쇄회로기판의 기준면 구조 无效
标题翻译：印刷电路板的参考平面结构
公开(公告)号：KR1020030074544A
公开(公告)日：2003-09-19
申请号：KR1020030058608
申请日：2003-08-25
申请人： 비아시스템즈 그룹 아이엔씨
发明人： 코톤,마틴,에이.
IPC分类号： H05K3/40
CPC分类号： H05K1/0221 , H01L23/552 , H01L2924/0002 , H05K1/0218 , H05K1/115 , H05K3/0035 , H05K3/0041 , H05K3/4652 , H05K2201/09036 , H05K2201/09354 , H05K2201/09509 , H05K2201/09854 , H05K2201/09981 , H01L2924/00
摘要： 본 발명은 다수의 인쇄회로기판(PCB) 층에 의해 그들 사이에 전기적으로 고립된 다수의 배선 회로 트레이스 층에 대한 전위 기준을 제공하는 PCB의 기준면 구조에 관한 것이다.
본 발명은 다수의 인쇄회로기판(PCB) 층에 의해 그들 사이에 전기적으로 고립된 다수의 배선 회로 트레이스 층에 대한 전위 기준을 고정시키며 메인 면을 갖는 PCB 제1층을 구비한 PCB의 기준면 구조에 있어서, 상기 메인 면에 적용되는 제1배선 트레이스 회로층; 상기 제1배선 트레이스 회로층 상부에 형성되는 제1 PCB 절연층; 상기 제1 PCB 절연층 상부에 적용되는 제1기준면; 내측벽을 구비하며 제1배선 트레이스 회로층을 둘러싸는 외주 주위로 연장되고 PCB 제1층을 통하여 연장되며, 제1배선 트레이스 회로층을 통하여 연장되어 노출되고, 제1절연층을 통하여 기준면을 노출시키는 기준면으로 연장되는 트렌치; 및 상기 내측벽에 형성되어 제1배선 트레이스 회로층을 접지면에 전기적으로 연결하는 도전성 도금층을 포함하는 것을 특징으로 한다.

38. 发明公开

KR1020020050704A 플렉시블 배선판 및 그 제조방법 无效
标题翻译：柔性接线板及其制造方法
公开(公告)号：KR1020020050704A
公开(公告)日：2002-06-27
申请号：KR1020010079368
申请日：2001-12-14
申请人： 데쿠세리아루즈 가부시키가이샤
发明人： 가네다유따까
IPC分类号： H05K1/14
CPC分类号： H05K3/20 , H05K1/0271 , H05K1/0346 , H05K1/0393 , H05K3/06 , H05K3/28 , H05K2201/0154 , H05K2201/0394 , H05K2201/09354 , H05K2201/0969 , H05K2201/09781 , H05K2201/09881 , H05K2201/2009 , H05K2203/0369 , H05K2203/0759 , H05K2203/1476 , H05K2203/167
摘要： PURPOSE: A flexible wiring board and a method for manufacturing the same are provided to reduce manufacturing costs and simultaneously manufacturing a flexible wiring board which is easy to handle. CONSTITUTION: In the manufacturing method of a flexible wiring board, a plurality of first wiring patterns(2) are formed on a copper foil(12) and a plurality of guide patterns(3) are simultaneously formed at the outer-periphery portion of the first wiring patterns(2). Then, an insulating film(14) is formed on the first wiring patterns(2) and the guide patterns(3).
摘要翻译：目的：提供柔性布线板及其制造方法，以降低制造成本，同时制造易于处理的柔性布线板。构成：在柔性布线基板的制造方法中，在铜箔（12）上形成有多个第一布线图案（2），并且在所述铜箔（12）的外周部同时形成有多个引导图案第一布线图案（2）。然后，在第一布线图案（2）和引导图案（3）上形成绝缘膜（14）。

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