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    • 33. 发明公开
    • 칩층 내부무늬와 표면엠보가 일치하는 칩 인레이드바닥타일
    • 芯片层和地面EMBO的内部图案的芯片嵌入式地板是和谐的
    • KR1020080064392A
    • 2008-07-09
    • KR1020070001242
    • 2007-01-05
    • (주)엘지하우시스
    • 김규열박창환
    • E04F15/024E04C2/32E04F15/10
    • E04F15/107B29C43/46B29C2043/463
    • A chip inlaid flood tile with a chip layer of which interior patterns of a chip layer are harmonious with surface embossment is provided to form various patterns, to improve durability by forming a chip layer on the upper part and to minimize gap formation in use by using a water control reinforcement layer. A chip inlaid flood tile includes a chip layer(1) formed by coating the front and rear sides of a water control reinforcement layer(4) with vinyl chloride resin and arranging many chips on the upper part of the water control reinforcement layer to the appointed thickness, and surface embossment(6) harmonized with internal patterns of the chip layer, wherein the internal patterns of the chip layer are intaglio mechanical embossing patterns formed by pressing cloth with a relief press roll.
    • 提供具有芯片层的芯片嵌入式瓦片,其芯片层的内部图案与表面压纹协调,以形成各种图案,以通过在上部形成芯片层来提高耐久性,并且通过使用使最小化间隙形成 一个水控加强层。 芯片嵌入式瓦片包括通过用氯乙烯树脂涂覆水控制加强层(4)的前侧和后侧而形成的芯片层(1),并将多个芯片安装在控制水层的上部, 厚度和表面压纹(6)与芯片层的内部图案协调,其中芯片层的内部图案是通过用布压辊压制布形成的凹版机械压花图案。