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    • 21. 发明公开
    • 절연용 유리부분을 포함하는 수직관통형 금속 전극의 제작 방법
    • 通过金属的制造方法,包括用于绝缘的玻璃区域
    • KR1020110082949A
    • 2011-07-20
    • KR1020100002897
    • 2010-01-12
    • 서울대학교산학협력단
    • 김용권박재형유병욱
    • H01L21/60H01L23/48H01L23/12
    • PURPOSE: A method for manufacturing a vertically penetrated metal electrode including an insulating glass part is provided to plate or deposit metal on the circumference of a low resistive silicon pillar, thereby lowering the resistance of a penetration resistor under an existing via resistance. CONSTITUTION: A protection pattern for forming a low resistance silicon pillar is formed on one side of a low resistance silicon wafer(S100). The low resistance silicon wafer is etched to form a low resistance silicon pillar(S200). Metal is plated or deposited on the low resistance silicon wafer(S300). The low resistance silicon wafer is bonded with a glass wafer(S400). The bonded glass wafer is dissolved(S500). The bonded low resistance silicon wafer and both sides of the glass wafer are processed(S600).
    • 目的:提供一种用于制造包括绝缘玻璃部件的垂直穿透的金属电极的方法,以在低电阻硅柱的圆周上镀金或沉积金属,从而降低了现有通孔电阻下的穿透电阻器的电阻。 构成:在低电阻硅晶片的一侧形成用于形成低电阻硅柱的保护图案(S100)。 蚀刻低电阻硅晶片以形成低电阻硅柱(S200)。 将金属电镀或沉积在低电阻硅晶片上(S300)。 低电阻硅晶片与玻璃晶片(S400)接合。 粘合玻璃晶片溶解(S500)。 处理粘合低电阻硅晶片和玻璃晶片的两侧(S600)。
    • 25. 发明授权
    • 마이크로 렌즈를 구비한 광학장치 및 이의 제작방법
    • 具有微生物的光学装置及其制造方法
    • KR101380497B1
    • 2014-04-01
    • KR1020130036210
    • 2013-04-03
    • 서울대학교산학협력단
    • 유승현김용권진주영하준근
    • B81C1/00B81B7/02G02B3/00G02B7/00
    • According to an embodiment of the present invention, in a method for fabricating an optical device having a micro lens, an optical device fabricating method comprises a step of bonding a first glass substrate to a main substrate formed with a first cavity; a step of filling the cavity with glass by a first thermal reflow process; a step of forming a glass column from the glass filled in the cavity; a step of forming a micro lens from the glass column by a second thermal reflow process; and a step of forming a driving apparatus of an optical device on the main substrate. [Reference numerals] (AA) Start; (BB) End; (S110) Etch a silicon substrate; (S120) Bond glass to the silicon substrate; (S130) First thermal reflow; (S140) Form a glass column; (S150) Form a lens by a second thermal reflow process; (S160) Wet etch the glass; (S170) Anodic bonding; (S180) Polish the silicon substrate and deposit a mask; (S190) Etch the silicon substrate; (S200) Package
    • 根据本发明的实施例,在一种具有微透镜的光学器件的制造方法中,光学器件制造方法包括将第一玻璃衬底接合到形成有第一腔的主衬底的步骤; 通过第一热回流工艺用玻璃填充空腔的步骤; 从填充在空腔中的玻璃形成玻璃柱的步骤; 通过第二热回流工艺从玻璃柱形成微透镜的步骤; 以及在主基板上形成光学装置的驱动装置的步骤。 (附图标记)(AA)开始; (BB)结束; (S110)蚀刻硅衬底; (S120)将玻璃贴到硅衬底上; (S130)第一热回流; (S140)形成玻璃柱; (S150)通过第二热回流工艺形成透镜; (S160)湿法蚀刻玻璃; (S170)阳极接合; (S180)抛光硅衬底并沉积掩模; (S190)蚀刻硅衬底; (S200)包装