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    • 14. 发明公开
    • 카메라 모듈 검사 장치
    • 相机模块检测系统
    • KR1020150015985A
    • 2015-02-11
    • KR1020130092127
    • 2013-08-02
    • 삼성전기주식회사
    • 최규홍
    • G01R31/3181G01R31/3187H04N5/225
    • 카메라 모듈 검사 장치가 개시된다. 커넥터를 구비한 카메라 모듈이 안착되는 하부지그; 상기 하부지그 상측에 상기 하부지그를 커버 가능하게 설치되는 상부지그; 상기 상부지그에 상기 커넥터와 맞물리게 결합되어, 상기 상부지그가 상기 하부지그를 커버하는 경우 상기 커넥터 위치가 고정되도록 상기 커넥터를 지지하는 지지부; 및 상기 지지부에 의하여 지지되는 상기 커넥터를 통한 전원 공급에 따라 상기 카메라 모듈이 정상적으로 작동하는지 여부를 검사하기 위하여, 상기 커넥터 상에 형성된 단자의 위치에 상응하도록 상기 지지부에 결합되어 상기 커넥터와 전기적으로 접속하는 검사핀을 포함하는 카메라 모듈 검사 장치가 제공된다.
    • 本发明公开了一种相机模块检查装置。 相机模块检查装置包括:下夹具,其具有安装在其表面上的连接器的相机模块; 上夹具,其安装在下夹具的上部以覆盖下夹具; 支撑单元,其安装成与上夹具和连接器啮合并且当上夹具覆盖下夹具时支撑连接器固定连接器; 以及检查销,其连接到所述支撑单元,以对应于形成在所述连接器上的端子的位置,以与所述连接器电连接,并且根据由所述连接器支撑的所述连接器根据所述电源来检查所述相机模块是否正常工作 支持单位
    • 15. 发明公开
    • 반도체 테스트 장치 및 그의 동작 방법
    • 半导体测试装置及其操作方法
    • KR1020120095701A
    • 2012-08-29
    • KR1020110015178
    • 2011-02-21
    • 에스케이하이닉스 주식회사
    • 정충만
    • G01R31/3187
    • PURPOSE: A semiconductor test device and an operation method thereof are provided to rapidly process a test result of high capacity, thereby reducing costs required for a semiconductor test process. CONSTITUTION: A semiconductor test device(100) tests a semiconductor element(200). The semiconductor test device comprises a BOST(Built Off Self Test) system(110). The BOST system comprises a test control chip(111) and a memory element(112). The test control chip comprises an algorithm for testing the property of the semiconductor element. The memory element records test conditions. The test conditions are necessary for processing the algorithm for testing the property of the semiconductor element of the test control chip.
    • 目的:提供半导体测试装置及其操作方法以快速处理高容量的测试结果,从而降低半导体测试过程所需的成本。 构成:半导体测试装置(100)测试半导体元件(200)。 半导体测试装置包括BOST(内置自检)系统(110)。 BOST系统包括测试控制芯片(111)和存储元件(112)。 测试控制芯片包括用于测试半导体元件的性质的算法。 内存元素记录测试条件。 测试条件对于处理用于测试测试控制芯片的半导体元件的性能的算法是必要的。
    • 16. 发明公开
    • 번인 보드 테스트 장치 및 방법, 이를 이용한 번인 보드 실장 장치
    • 烧结板测试装置及使用其的测试方法,以及安装灼热板的装置
    • KR1020120026667A
    • 2012-03-20
    • KR1020100088684
    • 2010-09-10
    • 주식회사 윈탑
    • 김진형
    • G01R31/3187
    • PURPOSE: An apparatus and a method for testing a burn-in board, and a burn-in board mounting device using the same are provided to enable automatic determination of errors when a pusher is pressed in each boding position of a main board and a DUT board. CONSTITUTION: A burn-in board testing device(200) comprises a main controller(210), a driver control unit interface(240), a determining unit(250), and an error signal generator(260). The main controller is connected to the tester and receives resistance measuring values of each signal wire of an inboard from the tester. The driver control unit interface receives the operation state of a pusher from a driver control unit. After checking the completion of the pressing operation by a pusher through the driver control unit interface, the determining unit checks errors according to the resistance measuring value of the tester. The error signal generator transmits the error signals to the driver control unit.
    • 目的:提供一种用于测试老化板的装置和方法,以及使用其的老化板安装装置,以便能够在主板和DUT的每个封装位置按下推动器时自动确定错误 板。 构成:老化板测试装置(200)包括主控制器(210),驱动器控制单元接口(240),确定单元(250)和错误信号发生器(260)。 主控制器连接到测试仪,并从测试仪接收内部信号线的电阻测量值。 驾驶员控制单元接口从驾驶员控制单元接收推动器的操作状态。 在通过驱动器控制单元接口检查推动器的按压操作完成之后,确定单元根据测试器的电阻测量值来检查错误。 误差信号发生器将误差信号发送到驱动器控制单元。
    • 17. 发明公开
    • 외부 인터페이스들의 기능성을 검증하기 위한 자체-테스트 특징을 갖는 집적 회로
    • 具有自检功能的集成电路,用于验证外部接口的功能
    • KR1020100027214A
    • 2010-03-10
    • KR1020107000661
    • 2008-06-12
    • 퀄컴 인코포레이티드
    • 말라디,스리니바스
    • G01R31/3187G01R31/307
    • G01R31/3187G06F11/27
    • This disclosure describes an integrated circuit with self-test features for validating functionality of external interfaces. Example external interfaces include memory interfaces and bus interfaces, such as a peripheral component interconnect (PCI) bus, an advanced high-performance bus (AHB), an advanced extensible interface (AXI) bus, and other external interfaces that operate a high frequency, e.g., 200 MHz or greater. Test logic may be embedded on the integrated circuit and configured to validate functionality of external interfaces while receiving power and non-test signals from external test equipment. Thus, external test equipment may not supply high frequency test signals to the integrated circuit. The external test equipment may, however, independently validate functionality of a pin interface of the integrated circuit. As a result, the integrated circuit may reduce cost and time required to verify functionality and timing of the external interfaces.
    • 本公开描述了具有用于验证外部接口的功能的自检特征的集成电路。 示例外部接口包括存储器接口和总线接口,例如外围组件互连(PCI)总线,高级高性能总线(AHB),高级可扩展接口(AXI)总线和其他操作高频率的外部接口, 例如,200MHz或更大。 测试逻辑可以嵌入在集成电路中,并被配置为在从外部测试设备接收电力和非测试信号的同时验证外部接口的功能。 因此,外部测试设备可能不会向集成电路提供高频测试信号。 然而,外部测试设备可以独立地验证集成电路的引脚接口的功能。 结果,集成电路可以降低验证外部接口的功能和定时所需的成本和时间。
    • 18. 发明公开
    • 기준 DUT 보드 및 이를 이용한 반도체 소자의 실장 테스터
    • 测试板下的参考设备和使用该测试板的半导体器件应用测试仪
    • KR1020100025088A
    • 2010-03-09
    • KR1020080083707
    • 2008-08-27
    • 주식회사이은
    • 이상식이인엽함병구이인철이유용김건
    • G01R31/3187G01R31/26H01L21/66
    • G01R31/2601G01R1/0433G01R31/2801G01R31/2851H01L22/30
    • PURPOSE: A reference DUT(Device Under Test) board and a semiconductor device application tester using the same are provided to test a plurality of DUTs quickly without an interference of an external signal by distributing record data and reference data to a test performing unit through a test signal distributer. CONSTITUTION: A reference DUT board(100) is installed on the rear side of a motherboard. A reference DUT is equipped. A controller(200) records log data in the reference DUT. The reference date saved in the standards DUT is deciphered. A test signal division unit(300) distributes record data received a message from controller and the reference date which controller deciphered. A test run part(400) receives the record data and the reference date. A plurality of DUTs are tested.
    • 目的:提供参考DUT(被测设备)板和使用其的半导体器件应用测试仪,通过将测试执行单元分配记录数据和参考数据通过一个 测试信号分配器。 规定:在主板背面安装参考DUT板(100)。 配备了参考DUT。 控制器(200)将参考DUT中的日志数据记录下来。 保存在标准DUT中的参考日期被解密。 测试信号分割单元(300)分配从控制器接收到的消息的记录数据和解密的控制器的参考日期。 测试运行部分(400)接收记录数据和参考日期。 测试了多个DUT。
    • 20. 发明授权
    • 멀티보드 멀티드롭 시스템에서의 경계주사 자체테스트 장치
    • 멀티보드멀티드롭시스템에서의경계주사자체테스트장치
    • KR100425046B1
    • 2004-03-30
    • KR1020010030657
    • 2001-06-01
    • 강성호배상민송동섭
    • 강성호배상민송동섭
    • G01R31/3187
    • PURPOSE: An apparatus for performing a self test for boundary scan in a multi-board and multi-drop system is provided to reduce existing overheads by using only a part of BSC(Boundary Scan Cell) within CUT(Circuit Under Test) and a logic gate. CONSTITUTION: A BIST(Built-In Self Test) logic(1) is used for performing a BIST. An address boundary scan cell(2) is used for determining an enable/disable state of a CUT if a JTAG master transfers an address of the CUT and generates an UpdateDR signal. An address register(3) is used for loading the address of the CUT including the BIST. A board enable/disable BSC(4) is used for preventing a transferring operation of all address values when the JTAG master activates a particular CUT and maintains a boundary path. A TDO 3-state driver(5) is activated when the address of the CUT is identical with the address of the JTAG master. A BIST result BSC(6) is used for transferring a result of a BIST operation to the JTAG master after the BIST operation of the CUT is finished.
    • 目的:提供一种用于执行多板和多点系统中的边界扫描的自测的设备,以通过仅使用CUT(被测电路)内的一部分BSC(边界扫描单元)和逻辑 门。 构成:BIST(内置自测试)逻辑(1)用于执行BIST。 如果JTAG主机传送CUT的地址并产生UpdateDR信号,则地址边界扫描单元(2)用于确定CUT的启用/禁用状态。 地址寄存器(3)用于加载包括BIST的CUT的地址。 当JTAG主机激活特定CUT并保持边界路径时,电路板启用/禁用BSC(4)用于防止所有地址值的传输操作。 当CUT的地址与JTAG主机的地址相同时,TDO三态驱动器(5)被激活。 在CUT的BIST操作完成之后,BIST结果BSC(6)用于将BIST操作的结果传送给JTAG主机。