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    • 14. 发明公开
    • 유리판절단장치
    • 玻璃板切割设备
    • KR1020040064003A
    • 2004-07-16
    • KR1020030000645
    • 2003-01-06
    • 로체 시스템즈(주)
    • 유기룡김춘택안민영김미지
    • C03B33/09
    • C03B33/093C03B33/102G02F1/133351Y10T225/304Y10T225/307Y10T225/321
    • PURPOSE: A glass plate cutting apparatus and a display panel prepared by using a glass plate cut by the apparatus are provided, to cut a glass plate stably and cleanly by using a laser beam. CONSTITUTION: The glass plate cutting apparatus comprises a cracking means which gives micro-crack to the cutting starting point of a glass plate; an irradiation heating means by a laser beam absorbed to at least one glass material; a cooling means by cooling fluid after at least one laser beam irradiation; and a breaking means, wherein the laser beam generates a scribe line(17) by a first carbon dioxide gas laser beam irradiation means, a first control means controlling the plate irradiation density to be 0.05-2 J/mm2 to the irradiation area of 20-200 mm2 and a first cooling means by cooling fluid set in back of the first carbon dioxide gas laser beam irradiation means, and the glass plate where the scribe line is formed is broken. Preferably the breaking is carried out by using a second carbon dioxide gas layer beam set in back of the first cooling means.
    • 目的:提供通过使用由该装置切割的玻璃板制备的玻璃板切割装置和显示面板,通过使用激光束来稳定且干净地切割玻璃板。 构成:玻璃板切割装置包括对玻璃板的切割起点产生微裂纹的开裂装置; 照射加热装置,通过吸收至少一种玻璃材料的激光束; 在至少一个激光束照射之后冷却流体的冷却装置; 以及断开手段,其中激光束通过第一二氧化碳气体激光束照射装置产生刻划线(17),第一控制装置将照射区域的照射面积控制为0.05-2J / mm2 -200mm 2的第一冷却装置和通过冷却设置在第一二氧化碳气体激光束照射装置背面的流体的第一冷却装置和形成划线的玻璃板断裂。 优选地,通过使用设置在第一冷却装置的后面的第二二氧化碳气体束束进行断裂。
    • 16. 发明公开
    • 비금속 기판 절단 방법
    • 切割非金属基材的方法
    • KR1020030028305A
    • 2003-04-08
    • KR1020010061030
    • 2001-09-29
    • 삼성전자주식회사
    • 전백균추대호남형우권용준
    • B23K26/38
    • C03B33/093B23K26/40B23K26/60B23K2201/40B23K2203/50G02F1/133351Y02P40/57Y10T225/304
    • PURPOSE: A method for cutting a nonmetallic substrate is provided to improve speed of cutting and quality of cutting surface by optimizing shape and arrangement of an energy source for rapidly heating the nonmetallic substrate. CONSTITUTION: The method for cutting a nonmetallic substrate comprises steps of (i) rapidly heating the cutting path by irradiating first laser beam(210) on a cutting path set on the nonmetallic substrate(1) in an oval shape in which a ratio of major axis (Bl) to minor axis (Bw) is adjusted in the range of 40:1 to 80:1; (ii) forming a groove shaped scribe line(1c) on the surface of the nonmetallic substrate by thermal shock formed by spraying a cooling fluid(310) onto the cutting path; and (iii) cutting the nonmetallic substrate by scanning second laser beam(510) along a scanning path of the first laser beam, wherein the first laser beam is formed in a symmetrical shape centering around the major and minor axes, wherein the first laser beam is formed in a symmetrical shape centering around the major axis while it is formed in an asymmetrical shaped centering around the minor axis, and wherein length (Sw) of the minor axis is 1 to 2 mm while length (Sl) of the major axis is 40 to 80 mm.
    • 目的:提供一种用于切割非金属基底的方法,通过优化用于快速加热非金属基底的能量源的形状和布置来提高切割速度和切割表面的质量。 构成:用于切割非金属基底的方法包括以下步骤:(i)通过在设置在非金属基底(1)上的切割路径上照射第一激光束(210)来快速加热切割路径,椭圆形形状为主 轴线(B1)与短轴(Bw)的比例调整为40:1〜80:1; (ii)通过将冷却流体(310)喷射到切割路径上形成的热冲击在非金属基板的表面上形成槽形划线(1c); 以及(iii)沿着所述第一激光束的扫描路径扫描第二激光束(510)来切割所述非金属基底,其中所述第一激光束以围绕所述主轴和短轴为中心的对称形状形成,其中所述第一激光束 形成为围绕长轴的对称形状,同时围绕短轴形成为不对称形状,并且其中短轴的长度(Sw)为1至2mm,而长轴的长度(S1)为 40至80毫米。