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    • 11. 发明授权
    • X-ray detector panel and method for manufacturing the x-ray detector panel
    • X射线探测器面板和制造X射线探测器面板的方法
    • KR101139870B1
    • 2012-05-02
    • KR20100113464
    • 2010-11-15
    • SEHYUN CO LTD
    • CHOO DAE HOLEE JI WON
    • H01L31/115H01L27/14
    • H01L27/14H01L31/085H01L31/115H01L31/18
    • PURPOSE: An x-ray detector panel and a manufacturing method thereof are provided to prevent a bias connection line to be electrically connected to data lines by arranging the bias connection line on the upper side of data contact parts to be crossed to the data contact parts. CONSTITUTION: A gate liner is formed on a base substrate to a first direction(D1). A gate isolation layer is formed on the base substrate in order to cover the gate line. A data connecting electrode is formed on the gate isolation layer. A thin film transistor(TFT) comprises a gate electrode, a drain electrode, and a source electrode. A PIN diode(400) comprises a P-electrode, a PIN semiconductor pattern, and an N-electrode.
    • 目的:提供一种x射线检测器面板及其制造方法,以通过将偏置连接线布置在与数据接触部分交叉的数据接触部分的上侧来防止偏置连接线电连接到数据线 。 构成:在第一方向(D1)的基底基板上形成闸板。 为了覆盖栅极线,在基底基板上形成栅极隔离层。 数据连接电极形成在栅极隔离层上。 薄膜晶体管(TFT)包括栅电极,漏电极和源电极。 PIN二极管(400)包括P电极,PIN半导体图案和N电极。
    • 13. 发明公开
    • 엑스레이 검출기용 박막트랜지스터 어레이기판의 제조방법
    • 用于X射线探测器的薄膜晶体管阵列衬底的制造方法
    • KR1020110066806A
    • 2011-06-17
    • KR1020090123599
    • 2009-12-11
    • 엘지디스플레이 주식회사
    • 조재형김주한이종문
    • H01L29/786H01L27/14
    • H01L27/14658G01T1/24G03B42/02H01L27/14676H01L31/115
    • PURPOSE: A method for manufacturing of a thin film transistor array substrate for an x-ray detector is provided to prevent a bubble failure which is generated in a photo conductive layer due to the stress difference between a protective layer and the photo conductive layer b forming a metal pattern in the outside of an array. CONSTITUTION: In a method for manufacturing of a thin film transistor array substrate for an x-ray detector, a protective film(22) is formed in front of a substrate(10) having an array unit(AA) and an array edge(NAA). An pixel electrode(26a) is formed on the protective film of the array unit. A plurality of metal patterns(26b) are formed in the array edge. A top electrode of a PIN photo diode and an optical conductive layer is formed on the pixel electrode of the substrate. The metal pattern is formed to cause the tension between the protective film and the optical conductive layer.
    • 目的:提供一种用于制造用于X射线检测器的薄膜晶体管阵列基板的方法,以防止由于保护层和光导层b形成之间的应力差而在光导层中产生的气泡故障 阵列外的金属图案。 构成:在用于制造X射线检测器的薄膜晶体管阵列基板的方法中,在具有阵列单元(AA)和阵列边缘(NAA)的基板(10)的前方形成保护膜(22) )。 像素电极(26a)形成在阵列单元的保护膜上。 在阵列边缘中形成多个金属图案(26b)。 在基板的像素电极上形成PIN光电二极管的顶部电极和光导体层。 形成金属图案以引起保护膜和光导电层之间的张力。
    • 14. 发明公开
    • 엑스선 검출장치 및 이의 제조방법
    • X射线探测器及其相关方法
    • KR1020110063243A
    • 2011-06-10
    • KR1020100016143
    • 2010-02-23
    • 주식회사바텍
    • 이영훈문장원이진식
    • H01L31/115
    • H01L31/115H01L27/14676H01L31/048H01L31/085H01L31/18
    • PURPOSE: A method for detecting X-ray and a method for manufacturing the same are provided to form a stable sealing structure by triple-sealing the outer peripheral of the junction part of a thin film transistor panel and a scintillator panel. CONSTITUTION: A first dam unit(230) is formed in a frame shape by being separated from the edge of the fluorescent layer of a scintillator panel. The first dam unit is formed between the fluorescent layer of the scintillator panel and the active region of an image sensor panel. A curable material layer(240) is filled in the first dam unit and uniformly bonds the scintillator panel and the image sensor panel. A second dam unit(250) is formed at the edge of the image sensor panel. A first sealing unit(260) is filled in a space between the second dam unit and the first dam unit.
    • 目的:提供一种用于检测X射线的方法及其制造方法,以通过三次密封薄膜晶体管板和闪烁体面板的接合部分的外周来形成稳定的密封结构。 构成:第一堰单元(230)通过与闪烁体面板的荧光层的边缘分离而形成为框形。 第一堰单元形成在闪烁体面板的荧光层和图像传感器面板的有源区域之间。 可固化材料层(240)填充在第一堰单元中,并均匀地粘合闪烁体面板和图像传感器面板。 第二堰单元(250)形成在图像传感器面板的边缘处。 第一密封单元(260)填充在第二坝单元和第一坝单元之间的空间中。
    • 17. 发明公开
    • 엑스레이 검출기 및 이의 제조 방법
    • X射线探测器及其制造方法
    • KR1020100086098A
    • 2010-07-30
    • KR1020090005288
    • 2009-01-22
    • (주)세현
    • 추대호
    • H01L31/115H01L29/786
    • H01L31/115G01T1/24H01L27/14658H01L27/14676
    • PURPOSE: An X-ray detector and a manufacturing method thereof are provided to stably attach a scintillator to a photoelectric conversion substrate by forming an adhesive layer with uniform thickness on only necessary region. CONSTITUTION: A photoelectric conversion substrate comprises a photoelectric conversion region and a pad region. A thin film transistor unit and a photoelectric conversion unit are formed on a photoelectric conversion region. A pad region surrounds the photoelectric conversion region. A sealing member(300) is formed between the photoelectric conversion region and the pad region to surround the photoelectric conversion region. The sealing member includes thermosetting resin or photo-curable resin. An adhesive layer(400) is formed on the photoelectric conversion region surrounded with the sealing member. A scintillator(500) is attached to the photoelectric conversion substrate with the adhesive layer.
    • 目的:提供一种X射线检测器及其制造方法,通过仅在必要区域形成均匀厚度的粘合剂层,将闪烁体稳定地附着于光电转换基板。 构成:光电转换基板包括光电转换区域和焊盘区域。 在光电转换区域上形成薄膜晶体管单元和光电转换单元。 衬垫区域围绕光电转换区域。 在光电转换区域和焊盘区域之间形成密封构件(300),以包围光电转换区域。 密封构件包括热固性树脂或光固化树脂。 在由密封构件包围的光电转换区域上形成粘合剂层(400)。 闪烁体(500)用粘合剂层附着到光电转换基板上。
    • 18. 发明公开
    • 엑스레이 디텍터 및 이의 제조방법
    • X射线探测器及其制造X射线探测器的方法
    • KR1020100085517A
    • 2010-07-29
    • KR1020090004848
    • 2009-01-21
    • (주)세현
    • 추대호
    • A61B6/00H01L29/786
    • H01L27/14658G01T1/24H01L27/14676H01L31/115
    • PURPOSE: An X ray detector and a manufacturing method thereof are provided to increase a fill factor by forming a lower electrode unit made of transparent conductive materials on a drain electrode. CONSTITUTION: A PIN diode(DI) includes a lower electrode unit which is electrically connected to a drain electrode of a thin film transistor and is formed on the upper side of the drain electrode to cover the drain electrode of the thin film transistor, a photo conversion semiconductor arranged on the lower electrode unit, and an upper electrode unit formed on the photo conversion semiconductor. A diode protection layer(150) covers the PIN diode and includes a bias contact hole to expose the part of the upper side of the PIN diode. The part of the upper side of the PIN diode is exposed through the bias contact hole. A bias wiring(160) is electrically contacted with the upper side of the PIN diode through the bias contact hole. An optical wavelength transformer(190) transforms the X ray into the wavelength which is absorbed in the PIN diode.
    • 目的:提供一种X射线检测器及其制造方法,以通过在漏电极上形成由透明导电材料制成的下电极单元来增加填充因子。 PIN二极管(DI)包括电连接到薄膜晶体管的漏极的下电极单元,并形成在漏电极的上侧以覆盖薄膜晶体管的漏电极,照片 布置在下电极单元上的转换半导体和形成在光转换半导体上的上电极单元。 二极管保护层(150)覆盖PIN二极管并且包括偏置接触孔以暴露PIN二极管的上侧的一部分。 PIN二极管的上侧部分通过偏压接触孔露出。 偏置布线(160)通过偏置接触孔与PIN二极管的上侧电接触。 光波长变换器(190)将X射线转换成在PIN二极管中吸收的波长。
    • 19. 发明公开
    • 대면적 X선 검출장치의 제조방법
    • 用于制作大面积X射线探测器的方法
    • KR1020090090156A
    • 2009-08-25
    • KR1020080015457
    • 2008-02-20
    • 주식회사바텍
    • 김일경정헌용송현진
    • G03B42/02A61B6/14
    • G03B42/02A61B6/14G01T1/20H01L31/115
    • A manufacturing method of a large area x-rays detector is provided to obtain various images of the various kinds and to increase the performance of the detector by making the thickness of a bonding layer uniform. A manufacturing method of a large area x-rays detector comprises followings. A sensor panel(110) is set up so that the front face of the sensor panel has the fixed angle with a horizontal plane. Adhesive is sprayed on the upper part of the front face of the sensor panel. An adhesive layer(130) of the fixed thickness is made by making the sprayed adhesive stream down to the lower front face from the upper front face of the sensor panel. A scintillator panel(120) converting X-rays into visible ray is adhered to the front face of a bonding layer. The sensor panel outputs an electric signal after receiving the visible ray. The thickness of the bonding layer is 10~40mum.
    • 提供大面积x射线检测器的制造方法以获得各种各样的图像,并且通过使粘结层的厚度均匀而提高检测器的性能。 大面积X射线检测器的制造方法如下。 传感器面板(110)被设置成使得传感器面板的前表面与水平面具有固定角度。 粘合剂喷在传感器面板正面的上部。 通过使喷射的粘合剂流从传感器面板的上前表面下降到下前表面,制成固定厚度的粘合剂层(130)。 将X射线转换为可见光的闪烁体面板(120)粘附到粘结层的前表面。 传感器面板在接收到可见光线后输出电信号。 结合层的厚度为10〜40μm。