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91. 发明公开

KR1020000048298A 동축 구조의 신호선 및 그의 제조 방법 失效
标题翻译：同轴结构信号线及其制造方法
公开(公告)号：KR1020000048298A
公开(公告)日：2000-07-25
申请号：KR1019990059866
申请日：1999-12-21
申请人： 한국과학기술원 , 에이치엔에스하이텍 (주)
发明人： 권영세 , 정인호
IPC分类号： H01L27/00
CPC分类号： H05K1/0221 , H01L23/5225 , H01L23/66 , H01L2223/6622 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H01L2924/3011 , H01P3/06 , H01P11/005 , H05K1/0272 , H05K2201/09809 , H05K2201/09981 , H05K2203/0733 , H01L2924/00
摘要： PURPOSE: A signal line of a coaxial structure is to solve problems of a signal interference generated in a high frequency electrical system and a connection of the signal line, thereby reducing a signal loss generated when transferring a signal. CONSTITUTION: A signal line of a coaxial structure comprises a board(11) which is formed with a groove, a first grounding wire(21) which is formed on a surface of the groove and a flat surface of the board, a first dielectric layer(31) which is formed on the first grounding wire formed on the surface of the groove, a signal wire(41) which is formed on the first dielectric layer to transfer a signal, a second dielectric layer(51) which is formed on the signal wire and the first dielectric layer to encapsulate the signal wire, and a second grounding wire(61) which is formed on the second dielectric layer and the first grounding wire to electrically shield the signal wire.
摘要翻译：目的：同轴结构的信号线是解决在高频电气系统中产生的信号干扰和信号线连接的问题，从而减少传送信号时产生的信号损失。构成：同轴结构的信号线包括形成有沟槽的板（11），形成在槽的表面上的第一接地线（21）和板的平坦表面，第一介电层（31），其形成在形成在所述槽的表面上的所述第一接地线上;信号线（41），形成在所述第一电介质层上以传递信号;第二介电层（51），形成在所述第一接地线信号线和第一介电层以封装信号线;以及第二接地线（61），其形成在第二介电层和第一接地线上以电屏蔽信号线。

92. 发明公开

KR1020000005583A 반도체 장치 失效
标题翻译：半导体器件
公开(公告)号：KR1020000005583A
公开(公告)日：2000-01-25
申请号：KR1019990004046
申请日：1999-02-05
申请人： 미쓰비시덴키 가부시키가이샤
发明人： 구니끼요다쯔야
IPC分类号： H01L23/10
CPC分类号： H01L23/49827 , H01L23/3114 , H01L23/49816 , H01L2223/6622 , H01L2224/14515 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/3025 , H05K1/0218 , H05K3/3436
摘要： PURPOSE: A semiconductor device is provided to reduce the stress of an electrode bump and noise, to suppress crosstalk between electrodes, and to enhance heat radiation efficiency. CONSTITUTION: The semiconductor device comprises: a semiconductor chip(2) having circuit elements in its periphery; an insulation substrate(8) having the same area as that of the semiconductor for mounting the semiconductor chip on a motherboard; signal electrodes arrayed in pin grid array structure in the periphery of the insulation substrate; blocking electrodes(4a) arranged in the periphery of the insulation substrate with surrounding the signal electrode and connected to a power supply to block the signal electrode; a stress alleviation film(13) adhered to the periphery of the chip and the insulation substrate to alleviate stress generated in the semiconductor chip; resin sealing substance(11) sealed between the periphery of the semiconductor chip and the insulation substrate; and a resin package(12) packing the semiconductor chip and the insulation substrate
摘要翻译：目的：提供半导体器件以减少电极凸起和噪声的应力，以抑制电极之间的串扰并提高散热效率。构成：半导体器件包括：半导体芯片（2），其周边具有电路元件; 绝缘基板（8），其具有与用于将所述半导体芯片安装在母板上的所述半导体相同的面积; 信号电极排列在绝缘基板周边的针格阵列结构中; 阻挡电极（4a），其布置在所述绝缘基板的周围，围绕所述信号电极并连接到电源以阻挡所述信号电极; 粘附到芯片周边和绝缘基板上的减轻应力薄膜（13）以减轻在半导体芯片中产生的应力; 密封在半导体芯片的周边与绝缘基板之间的树脂密封物质（11）以及包装半导体芯片和绝缘基板的树脂封装（12）

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