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    • 94. 发明公开
    • 오류 정정 장치, 그 방법 및 상기 장치를 포함하는 메모리장치
    • 错误校正装置,包含装置的方法和存储装置
    • KR1020090122060A
    • 2009-11-26
    • KR1020080048264
    • 2008-05-23
    • 삼성전자주식회사
    • 설광수박성일조경래
    • G11C29/42G11C16/04
    • G11C16/26G06F11/1072G11C11/5642G11C29/00G11C2211/5634
    • PURPOSE: An error correction apparatus, a method thereof and a memory device comprising the apparatus are provided to select a cord word corresponding to a reading word based on a selected reading error pattern when a reading error read from a multi-level cell does not exist in an error correction capability range. CONSTITUTION: An error correction device(120) includes a judgment unit(121), a reading voltage control unit(122) and a cord word determining unit(123). The judgment unit judges whether or not read words from a multi-level cell exists in an error correction capability range. The reading voltage control unit increases or decreases the reading voltage applied to a multi-level cell in case that the reading word does not exist in the error correction capability range. The cord word determining unit analyzes a bit error depending on the increase or decrease of the reading voltage, and selects the cord words based on the selected reading error pattern by corresponding to the analyzed bit error.
    • 目的:提供一种纠错装置,其方法和包括该装置的存储装置,用于当不存在从多级单元读取的读取错误时,基于所选择的读取错误模式来选择与读取字对应的绳索字 在纠错能力范围内。 构成:纠错装置(120)包括判断单元(121),读取电压控制单元(122)和电话词确定单元(123)。 判断单元判断来自多级单元的读取字是否存在于纠错能力范围内。 读取电压控制单元增加或减少在纠错能力范围内不存在读取字的情况下施加到多电平单元的读取电压。 绳字确定单元根据读取电压的增加或减少来分析位错误,并且通过对应于分析的位错误,基于所选择的读取错误模式来选择线字。
    • 97. 发明公开
    • 비휘발성 메모리 소자의 프로그램 방법
    • 非易失性存储器件的编程方法
    • KR1020090022191A
    • 2009-03-04
    • KR1020070087312
    • 2007-08-29
    • 삼성전자주식회사
    • 박상진설광수성정헌
    • G11C16/34G11C16/10G11C16/12
    • G11C16/0483G11C16/10G11C16/3454
    • A programming method of a non volatile memory device is provided to saturate a threshold voltage within a fast time and to hasten stabilization of a charge by adding a perturbation pulse. In a first programming step(S100), a program voltage is supplied to a memory cell, and is verified by a first verification voltage. A perturbation pulse for hastening stabilization of a charge is supplied to the memory cell passing verification using the first verification voltage(S200). After the perturbation pulse is supplied, the program voltage is verified by a second verification voltage larger than the first verification voltage(S300). When the program voltage does not pass the verification using the second verification voltage, a program voltage is supplied to the memory cell, receives a perturbation pulse, and is verified by the second verification voltage again(S500).
    • 提供了一种非易失性存储器件的编程方法,以在快速时间内使阈值电压饱和,并通过加入扰动脉冲来加速电荷的稳定。 在第一编程步骤(S100)中,将编程电压提供给存储单元,并通过第一验证电压进行验证。 用于加速电荷稳定的扰动脉冲被提供给使用第一验证电压的存储器单元通过验证(S200)。 在提供扰动脉冲之后,通过大于第一验证电压的第二验证电压验证编程电压(S300)。 当编程电压不通过使用第二验证电压的验证时,将编程电压提供给存储单元,接收扰动脉冲,并再次通过第二验证电压进行验证(S500)。
    • 100. 发明公开
    • 전하 트랩층을 가지는 비휘발성 메모리 소자 및 그 제조방법
    • 具有电荷捕获层的非易失性存储器件及其制造方法
    • KR1020090020129A
    • 2009-02-26
    • KR1020070084600
    • 2007-08-22
    • 삼성전자주식회사
    • 최상무설광수박상진성정헌
    • H01L27/115H01L21/8247
    • H01L21/28282H01L29/792H01L29/4234H01L29/66833
    • A non-volatile memory device and a manufacturing method thereof are provided to prevent the leakage of electric charge and the delay of operating speed by trapping the electric charge to the deformity level of the specific energy level. A gate structure(20) comprises a charge trapping layer(23) including a crystalline substance. The charge trapping layer comprises the crystalline substance formed on a tunneling insulating layer(21). A blocking insulation layer(25) is formed on the charge trapping layer. A gate electrode(27) is formed on the blocking insulation layer. The first and second impurity regions(13,15) are formed in a substrate(11) in order to contact the tunneling insulating layer. The gate electrode comprises the TaN metal layer. The charge trapping layer comprises the crystalline silicon nitride.
    • 提供一种非易失性存储器件及其制造方法,以通过将电荷俘获到特定能级的畸形水平来防止电荷的泄漏和操作速度的延迟。 栅极结构(20)包括包含结晶物质的电荷捕获层(23)。 电荷捕获层包括在隧道绝缘层(21)上形成的结晶物质。 在电荷俘获层上形成阻挡绝缘层(25)。 栅极电极(27)形成在阻挡绝缘层上。 第一和第二杂质区(13,15)形成在衬底(11)中,以便与隧道绝缘层接触。 栅电极包括TaN金属层。 电荷捕获层包括晶体氮化硅。