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    • 3. 发明公开
    • 반도체 제조용 횡형 확산로
    • 用于制造半导体的水平扩散炉
    • KR1020100063867A
    • 2010-06-14
    • KR1020080122215
    • 2008-12-04
    • 한국전자통신연구원
    • 유성욱박건식박종문윤용선김상기구진근김보우강진영
    • H01L21/324
    • H01L21/67098H01L21/67017H01L21/67778
    • PURPOSE: A horizontally shaped diffusion furnace is provided to form a gate insulating layer with a superior thin film by uniformly injecting reaction gas in top, down, left and right direction of silicon wafer substrate. CONSTITUTION: A reaction chamber(21) comprises a reacting gas inlet. In the reaction chamber, the thermal diffusion process about the silicon wafer substrate is executed. A heating part heats the inside of the reaction chamber. A loading part(23) loads a plurality of silicon wafer substrates. A carrying part(24) transfers the loading part to the inside of the reaction chamber. A nitrogen gas injecting part(25) injects the nitrogen gas into the inside of the loading part.
    • 目的:提供一种水平形状的扩散炉,通过在硅晶片衬底的上,下,左,右方向上均匀注入反应气体,形成具有优良薄膜的栅极绝缘层。 构成:反应室(21)包括反应气体入口。 在反应室中,执行关于硅晶片衬底的热扩散过程。 加热部件加热反应室的内部。 装载部件(23)装载多个硅晶片基板。 承载部件(24)将装载部件转移到反应室的内部。 氮气注入部(25)将氮气注入到装载部的内部。
    • 5. 发明公开
    • 실리콘 포토멀티플라이어 및 그 제조 방법
    • 硅光电子器件及其制造方法
    • KR1020100063479A
    • 2010-06-11
    • KR1020080122019
    • 2008-12-03
    • 한국전자통신연구원
    • 윤용선박건식박종문김보우강진영
    • H01L31/00
    • H01L31/102H01L31/0224H01L31/18
    • PURPOSE: A silicon photomultiplier and a manufacturing method thereof are provided to enhance accuracy about location information with suppressing a cross talk by separating an interval of a micro pixel through trench isolation. CONSTITUTION: An active layer(22) is formed on upper part of a substrate(21). A production and an amplification of current by an input light are included on the active layer. A trench controls a cross talk between contiguous micro pixels by filling in inside with a material including an electrical insulation and a light-reflection function. An anode electrode(28) and a cathode electrode(29) are respectively formed on an upper side of the active layer. An insulating layer(27) is formed on the rest upper side of the active layer in which the anode electrode and cathode electrode are not formed.
    • 目的:提供硅光电倍增管及其制造方法,通过沟槽隔离分离微像素的间隔,抑制串扰,提高位置信息的精度。 构成:在衬底(21)的上部形成有源层(22)。 通过输入光产生和放大电流被包括在有源层上。 沟槽通过用包括电绝缘和光反射功能的材料填充内部来控制连续微像素之间的串扰。 阳极电极(28)和阴极电极(29)分别形成在有源层的上侧。 绝缘层(27)形成在不形成阳极电极和阴极的有源层的其余上侧。
    • 9. 发明公开
    • 화합물 반도체 소자의 티형 게이트 제조 방법
    • 化合物半导体器件中制造T型栅极的方法
    • KR1020050019477A
    • 2005-03-03
    • KR1020030057274
    • 2003-08-19
    • 한국전자통신연구원
    • 박종문박건식유성욱윤용선김상기김보우구진근
    • H01L21/335
    • PURPOSE: A method for fabricating T gate in a compound semiconductor device is provided to reduce number of a manufacturing process by once coating one kind of resist. CONSTITUTION: A dielectric film(52) is formed on a semiconductor substrate(50). A resist layer is formed on the dielectric film. A resist layer pattern(54a) is formed by patterning firstly the resist layer. The compound semiconductor substrate is exposed by a first opening(62) that is formed by etching the dielectric film with the resist layer pattern as a mask. A second opening that is larger than the first opening is formed by patterning secondly the resist layer pattern. A metal film buries the first opening, simultaneously the metal film is also formed at the lower portion of the second opening and on the whole surface of the compound semiconductor substrate that the resist layer pattern is formed thereon. A T-type gate showing a leg-type in the first opening and a body-type on the dielectric film is formed by removing the resist layer pattern.
    • 目的:提供一种在化合物半导体器件中制造T栅的方法,以通过一次涂覆一种抗蚀剂来减少制造工艺的数量。 构成:在半导体衬底(50)上形成电介质膜(52)。 在电介质膜上形成抗蚀剂层。 通过首先形成抗蚀剂层形成抗蚀剂层图案(54a)。 化合物半导体衬底通过用抗蚀剂层图案作为掩模蚀刻电介质膜而形成的第一开口(62)暴露。 大于第一开口的第二开口通过二次图案化形成抗蚀剂层图案。 金属膜掩埋第一开口,同时金属膜也形成在第二开口的下部和化合物半导体衬底的形成有抗蚀剂层图案的整个表面上。 通过去除抗蚀剂层图案,形成在第一开口中显示腿型的T型栅极和电介质膜上的体型。
    • 10. 发明公开
    • 전계 방출 소자의 MIM 에미터 및 그 제조방법
    • 场发射显示器的MIM发射体及其制造方法
    • KR1020040033600A
    • 2004-04-28
    • KR1020020062752
    • 2002-10-15
    • 한국전자통신연구원
    • 박상희윤선진박종문박건식강남석
    • H01J1/30
    • PURPOSE: An MIM(Metal/Insulator/Metal) emitter of field emission display and a method for manufacturing the same are provided to deposit an etch stopper on a tunneling insulation film of an MIM emitter through a simple process method. CONSTITUTION: A method for manufacturing an MIM(Metal/Insulator/Metal) emitter of field emission display comprises a step of patterning a lower electrode(116) on a substrate(110), a step of forming a tunneling insulation film(120) and a field insulation film(118) on the lower electrode, a step of forming an etch stopper(123) made of a ZnO thin film on the field insulation film and the tunneling insulation film, a step of etching a protection layer(126), a bus electrode(124), and a contact electrode(122) by forming the contact electrode, the bus electrode, and the protecting layer in order, a step of wet-etching the etch stopper, the contact electrode, the bus electrode, and the protecting layer as a mask, and a step of forming an upper electrode(128) on the tunneling insulation film.
    • 目的:提供场发射显示器的MIM(金属/绝缘体/金属)发射体及其制造方法,以通过简单的工艺方法在MIM发射器的隧道绝缘膜上沉积蚀刻停止层。 构成:用于制造场发射显示器的MIM(金属/绝缘体/金属)发射体的方法包括在衬底(110)上图形化下电极(116)的步骤,形成隧道绝缘膜(120)和 在所述下电极上的场绝缘膜(118),在所述场绝缘膜和所述隧道绝缘膜上形成由ZnO薄膜制成的蚀刻停止器(123)的步骤,蚀刻保护层(126)的步骤, 总线电极(124)和接触电极(122),通过依次形成接触电极,总线电极和保护层,湿法蚀刻蚀刻停止器,接触电极,总线电极和 保护层作为掩模,以及在隧道绝缘膜上形成上电极(128)的步骤。