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2. 发明专利

JP2014182372A Flow lithography technique to form microstructures using optical arrays 审中-公开
标题翻译：使用光学阵列形成微结构的流动平移技术
公开(公告)号：JP2014182372A
公开(公告)日：2014-09-29
申请号：JP2014032697
申请日：2014-02-24
申请人： Palo Alto Research Center Inc , パロ・アルト・リサーチ・センター・インコーポレーテッドPalo Alto Research Center Incorporated
发明人： MELDE KAI , PHILIPP H SCHMAELZLE
IPC分类号： G03F7/207 , G03F7/23 , G03F7/24
CPC分类号： G03F7/70141 , B81C99/0095 , G03F1/50 , G03F7/16 , G03F7/2012 , G03F7/24
摘要： PROBLEM TO BE SOLVED: To provide a scalable and cost-effective continuous flow projection lithography system and fabrication method capable of fabricating microparticles or microstructures of a custom shape and composition.SOLUTION: A mask 304 is placed at a distance from a microlens array 306. Each element of the array projects one image of the mask onto a substrate, effectively forming an array on the substrate. A coating process allows functional regions of particles, namely, supporting layers that prevent adhesion of crosslinked polymers to surfaces.
摘要翻译：要解决的问题：提供可扩展且具有成本效益的连续流动投影光刻系统和能够制造定制形状和组成的微粒或微结构的连续流动投影光刻系统和制造方法。解决方案：将掩模304放置在离微透镜阵列306一定距离处。阵列的每个元素将掩模的一个图像投射到衬底上，在衬底上有效地形成阵列。涂覆工艺允许颗粒的功能区域，即防止交联聚合物粘附到表面上的支撑层。

4. 发明专利

JP4023579B2 ArF excimer laser of the laser gas, ArF excimer laser and scan type exposure machine 有权
公开(公告)号：JP4023579B2
公开(公告)日：2007-12-19
申请号：JP16799999
申请日：1999-06-15
申请人：株式会社小松製作所
发明人：司堀 , 究武久 , 計溝口
IPC分类号： H01L21/027 , H01S3/225 , G03F7/20 , G03F7/23
CPC分类号： G03F7/70358
摘要： PROBLEM TO BE SOLVED: To obtain an ArF excimer laser capable of increasing pulse frequency without enlarging equipment, and an aligner using the high pulse frequency ArF excimer laser as a light source. SOLUTION: A semiconductor chip on a wafer is divided into a plurality of irradiation regions 46. Each of the regions is irradiated with a plurality of pulses of a laser light 11, one by one. When exposure of one irradiation region 46 is finished, the next irradiation region is exposed. Thus the whole part of the semiconductor chip is exposed. In this scanning type aligner 40, an ArF excimer laser 1 in which the main component of buffer gas in laser gas is He and preferably Xe is contained in the laser gas is used as a light source oscillating the laser light 11.

5. 发明专利

JP3880355B2 Scanning type exposure apparatus 有权
公开(公告)号：JP3880355B2
公开(公告)日：2007-02-14
申请号：JP2001305136
申请日：2001-10-01
申请人：キヤノン株式会社
发明人：慎一渡邉 , 浩之高橋
IPC分类号： G03F7/22 , H01L21/027 , G03F7/23
摘要： PROBLEM TO BE SOLVED: To provide an exposure device for reducing an exposure processing time, improving throughput of the device and improving productivity, and to provide a device manufacturing method or the like of a semiconductor device using the exposure device. SOLUTION: The scanning exposure device is provided with a mechanism for step-moving a board stage to an exposure position of a plurality of exposure areas in a forward X-direction and/or Y-direction in order to perform exposure of the plurality of the exposure areas on a board 22 through a projection optical system, and a mechanism for correcting magnification shift to perform exposure so that an image of a mask 12 is transferred to the exposure area of the board 22 without any error, only measurement of magnification of the X-direction is performed. The throughput of the exposure device is improved and the productivity is improved by eliminating measurement sequence of the magnification of the Y-direction.

6. 发明专利

JP2005316411A Exposure apparatus and exposure method 有权
标题翻译：曝光装置和曝光方法
公开(公告)号：JP2005316411A
公开(公告)日：2005-11-10
申请号：JP2005059732
申请日：2005-03-03
申请人： Fuji Photo Film Co Ltd , 富士写真フイルム株式会社
发明人： KATAYAMA TORU , NAKATANI DAISUKE , JOGO HISAZUMI
IPC分类号： G03F7/23 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an exposure apparatus and an exposure method that can reduce distortion of an image to be drawn on a recording medium by detecting meandering caused by movement of a stage. SOLUTION: As the exposure stage wobbles accompanied by its movement to generate displacement, distortion is induced in an image transferred onto a recording medium by exposure. To avoid the problem, distortion in an image transferred onto a recording medium by exposure is corrected by imaging markings by a CCD camera at each imaging timing to detect the displacement in the direction intersecting with the moving direction of the recording stage by meandering with respect to the stage plane, and carrying out an image shift process. The image shift process is carried out by reading out the adjacent image regions from the storage memory of divided images and adding the acquired data to the both ends of the image data in each head assembly, shifting the entire image with the adjacent images added according to the displacement caused by meandering, and trimming the shifted image at the connecting-line position to produce the image data for exposure to be performed by the head assembly. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种曝光装置和曝光方法，其可以通过检测由舞台的移动引起的曲折来减少在记录介质上绘制的图像的变形。
解决方案：随着曝光阶段伴随其运动而产生位移，在通过曝光转印到记录介质上的图像中引起失真。为了避免这个问题，通过在每个成像定时通过CCD照相机成像标记来校正通过曝光转印到记录介质上的图像的失真，以通过相对于记录介质的移动方向相交的方向来检测与记录级的移动方向相交的方向上的位移舞台平面，并执行图像移位过程。通过从分割图像的存储存储器中读出相邻图像区域并将获取的数据添加到每个头部组件中的图像数据的两端来执行图像移位处理，使用根据通过曲折引起的位移，以及在连接线位置修整移动的图像，以产生由头组件执行的用于曝光的图像数据。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2002319541A ALIGNER COMPRISING LASER INTERFEROMETER 审中-公开
公开(公告)号：JP2002319541A
公开(公告)日：2002-10-31
申请号：JP2002028332
申请日：2002-02-05
申请人： CANON KK
发明人： TAKAI AKIRA , IWAMOTO KAZUNORI
IPC分类号： G01B11/00 , G01B11/02 , G01B11/245 , G03F7/20 , G03F7/23 , G03F9/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an aligner which measures and controls the position and attitude of a stage device with high precision. SOLUTION: There are provided a projection optical system 34 for projecting a pattern formed on an original plate onto a substrate, stages 27, 31, and 40 which are, holding the substrate or original plate, movable relative to the projection optical system 34, and a lens barrel support 35 which supports the projection optical system 34. An interferometer system comprises a Z measurement mirror 30 which, disposed on a Y stage 31, comprises a reflecting surface substantially parallel to an XY plane, and a Z interferometer 25 disposed on the Y stage 31. It measures Z position and displacement of a top stage 27 with the lens barrel support 35 independent of it in terms of vibration as a base.

8. 发明专利

JP3282751B2 失效
公开(公告)号：JP3282751B2
公开(公告)日：2002-05-20
申请号：JP17416193
申请日：1993-07-14
IPC分类号： G03F9/00 , G03F7/20 , G03F7/23 , H01L21/027

9. 发明专利

JP2001203140A STAGE DEVICE, ALIGNER AND DEVICE MANUFACTURING METHOD 失效
公开(公告)号：JP2001203140A
公开(公告)日：2001-07-27
申请号：JP2000011179
申请日：2000-01-20
申请人： NIKON CORP
发明人： TANIGUCHI TETSUO , YODA YASUSHI
IPC分类号： G03F7/23 , G03F7/20 , H01L21/027 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide an aligner which can realize high throughput and accurate exposure. SOLUTION: Tables TB1 and TB2 can be transferred by transfer systems 80A and 80B. The tables TB1 and TB2 can be supported, so that they can freely be attached/detached to/from the stage main bodies ST1 and ST2 without making contact and the tables can be driven with respect to the stage main bodies in a supported state. While a wafer on the table supported on the stage main body ST1 is exposed via a projection optical system PL, a wafer on the other table is aligned by an alignment system ALG. When exposure is terminated, the table holding the exposed wafer is transferred from the stage main body ST1 by the transfer system. The table holding the wafer after alignment is carried onto the stage main body ST1, and the exposure of the wafer is started immediately. The stage main bodies ST1 and ST2 are installed on different bases, and they do not mutually causes vibrations.

10. 发明专利

JP2001176769A EXPOSURE METHOD 失效
公开(公告)号：JP2001176769A
公开(公告)日：2001-06-29
申请号：JP35527099
申请日：1999-12-15
申请人： SONY CORP
发明人： NOUDO SHINICHIRO , KOIKE KAORU
IPC分类号： H01L21/027 , G03F7/23 , G03F9/00
摘要： PROBLEM TO BE SOLVED: To provide an exposure method in which throughput is improved, while performing alignment with high accuracy. SOLUTION: In this exposure method in which pattern exposure is performed, by superposing on a pattern of an n-th layer formed on a board, initial distortion data, that indicates formation position distortion of a first layer pattern in the entire surface of the board is superposed on alignment coefficient obtained, based on the detecting position of an n-the layer alignment pattern (S15), then the data is compensated with process data that indicates change of the detecting position of the n-th layer alignment pattern caused by a process performed for the board (S16) and is further compensated with device data that indicates deviating of position of an exposure pattern characteristic of an aligner (S17), and pattern exposure is performed, while compensating for an exposure position based on the compensated value (S18).

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