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    • 9. 发明专利
    • Thermally conductive filler and method for producing the same
    • 导热填料及其制造方法
    • JP2007112843A
    • 2007-05-10
    • JP2005303270
    • 2005-10-18
    • Sanyo Chem Ind Ltd三洋化成工業株式会社
    • TANIMURA TOSHIHIRO
    • C09K5/08C01B21/072C01B33/12C01F7/22C01F7/36C08J3/12C08K7/24C08L101/00H01L23/373
    • PROBLEM TO BE SOLVED: To provide a thermally conductive filler giving a resin having high thermal conductivity per weight of the thermally conductive filler when the thermally conductive filler is kneaded in the resin, and by which the lightweight resin can be obtained. SOLUTION: The composite thermally conductive filler (C) is prepared by forming a thermally conductive layer comprising an inorganic compound (B) having 1-1,000 nm average thickness on the surface of particles (A) having 1-1,000 nm average minor axis and has 2-2,000 nm average minor axis, preferably 10 nm-100 μm average major axis and 10-10,000 aspect ratio expressed by the average major axis/the average minor axis. The hollow inorganic thermally conductive filler (D) is prepared by removing at least a part of the particles (A) presenting inside the composite thermally conductive filler (C) and has cavities inside the same and 20-95 volume% volume fraction of the cavities. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:当导热填料在树脂中被捏合时,提供一种赋予导热填料重量高导热性树脂的导热性填料,由此得到轻质树脂。 解决方案:复合导热填料(C)通过在具有1-1000nm平均次要粒子(A)的表面上形成包含平均厚度为1-1,000nm的无机化合物(B)的导热层 平均长轴为2-2000nm,平均长轴为10nm〜100μm,长轴平均值为10〜10000倍。 中空无机导热填料(D)通过除去呈现在复合导热填料(C)内部的至少一部分颗粒(A)而制备,并且具有内部的空腔和20-95体积体积分数的空腔 。 版权所有(C)2007,JPO&INPIT