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    • 9. 发明专利
    • Mounting device, and electronic apparatus
    • 安装设备和电子设备
    • JP2010157372A
    • 2010-07-15
    • JP2008333593
    • 2008-12-26
    • Fujitsu Ltd富士通株式会社
    • TAKAO KAZUAKI
    • H01R13/639
    • H05K7/1417G06F1/185H01R12/7052H05K1/141H05K3/368Y10T292/696
    • PROBLEM TO BE SOLVED: To improve mounting efficiency when mounting a device to be mounted to a substrate, as to a mounting device and an electronic apparatus used for mounting the device to be mounted to the substrate. SOLUTION: This mounting device is to mount an electronic module 45 to a substrate 11, and has a socket 12 fixed to the substrate 11 and engaged with the tip part 47 of the electronic module 45 to hold it, a holding member 13A mounted to the substrate 11 and engaged with the rear end part 48 of the electronic module 45 to hold it, and position adjusting mechanisms (stud members 16A, 16B and an engagement member 17) to adjust the mounting position of the holding member 13 to the substrate 11. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提高将安装装置安装到基板上时的安装效率,安装装置和用于安装到基板上的装置的电子装置。 解决方案:该安装装置将电子模块45安装到基板11上,并且具有固定到基板11并与电子模块45的末端部分47相接合以将其固定的插座12,保持构件13A 安装到基板11并与电子模块45的后端部48接合以保持其,以及位置调整机构(螺柱构件16A,16B和接合构件17),以将保持构件13的安装位置调整到 底物11.版权所有(C)2010,JPO&INPIT