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1. 发明专利

JP6091698B2 医療デバイス構成要素のための接続システム有权
标题翻译：用于医疗装置的组件连接系统
公开(公告)号：JP6091698B2
公开(公告)日：2017-03-08
申请号：JP2016501381
申请日：2014-03-12
申请人：ベクトンディキンソンアンドカンパニーリミテッド
发明人：ポールパイアマリーチ , ミランイヴォセヴィッチ
IPC分类号： A61J1/20
CPC分类号： A61J1/2096 , A61J1/201 , A61J1/2048 , A61J1/2082 , A61M39/12 , A61M39/14 , A61J1/2055 , A61J1/2065 , A61J1/2072 , A61M2039/1027 , A61M2039/1044 , A61M2039/1072 , Y10T29/49217

2. 发明专利

JP2014130836A Locking connector for engaging usb receptacle, method of operating locking connector, and method of manufacturing locking connector 有权
标题翻译：用于接合USB接收器的锁定连接器，操作锁定连接器的方法和制造锁定连接器的方法
公开(公告)号：JP2014130836A
公开(公告)日：2014-07-10
申请号：JP2014035988
申请日：2014-02-26
申请人： Toshiba Global Commerce Solutions Holdings Corp , 東芝グローバルコマースソリューション・ホールディングス株式会社
发明人： DESROSIERS NORMAN B , HERRING DEAN F , KANGAS PAUL D , THOMAS JEFF D
IPC分类号： H01R13/639
CPC分类号： H01R13/639 , Y10T29/49217
摘要： PROBLEM TO BE SOLVED: To provide a locking connector for engaging a USB receptacle.SOLUTION: A locking connector 100 comprises: a connector housing 108 having a locking cam opening 114 on one side of the connector housing, and being split along a longitudinal axis of the locking connector forming a connector housing gap 110 on the same side of the connector housing as the locking cam opening; a locking cam surface positioned within the locking cam opening and in contact with the connector housing; and a pivotable locking cam actuating lever 106 connected to a top of the locking cam surface. The locking cam actuating lever has a locked position and an unlocked position. The locking cam surface is in a rotated position expanding the connector housing when the locking cam actuating lever is in the locked position, and the locking cam surface is in a relaxed position with the connector housing not expanded when the locking cam actuating lever is in the unlocked position.
摘要翻译：要解决的问题：提供用于接合USB插座的锁定连接器。解锁：锁定连接器100包括：连接器壳体108，其在连接器壳体的一侧具有锁定凸轮开口114，并且沿着纵向轴线锁定连接器在连接器壳体的与锁定凸轮开口相同的一侧上形成连接器壳体间隙110; 定位在所述锁定凸轮开口内并与所述连接器壳体接触的锁定凸轮表面; 以及连接到锁定凸轮表面的顶部的可枢转的锁定凸轮致动杆106。锁定凸轮致动杆具有锁定位置和解锁位置。当锁定凸轮致动杆处于锁定位置时，锁定凸轮表面处于使连接器壳体膨胀的旋转位置，并且当锁定凸轮致动杆处于锁定凸轮致动杆时，锁定凸轮表面处于松弛位置，连接器壳体不膨胀解锁位置

3. 发明专利

JP4323055B2 Contactor and a method of manufacturing the semiconductor device test 有权
公开(公告)号：JP4323055B2
公开(公告)日：2009-09-02
申请号：JP2000080974
申请日：2000-03-22
申请人：富士通マイクロエレクトロニクス株式会社
发明人：茂幸丸山 , 浩久松木
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L21/66 , H01R11/01 , H01R33/76 , H01R43/00 , H01R43/16 , H05K3/32
CPC分类号： G01R1/0408 , G01R1/073 , H05K3/326 , Y10T29/49151 , Y10T29/49204 , Y10T29/49208 , Y10T29/49217 , Y10T29/49218

4. 发明专利

JP2003036941A Automatic insertion method of connection terminal to half-coupling preventing connector 审中-公开
标题翻译：连接端子自动插入方法预防连接器
公开(公告)号：JP2003036941A
公开(公告)日：2003-02-07
申请号：JP2001269061
申请日：2001-09-05
申请人： Yazaki Corp , 矢崎総業株式会社
发明人： ENDO TOMOMI , TAGUCHI NAOTO
IPC分类号： H01R13/64 , H01R13/641 , H01R43/00 , H01R43/20
CPC分类号： H01R13/641 , H01R43/20 , Y10T29/49147 , Y10T29/49169 , Y10T29/49208 , Y10T29/49217 , Y10T29/49222
摘要： PROBLEM TO BE SOLVED: To provide an automatic insertion method of connection terminals to a half-coupling preventing connector, which enables automatic insertion by an automatic terminal insertion machine, by making the rear end of a coupling detecting component equipped to one side connector housing among male/ female connector housings not come outside of the rear end of this connector housing at the time inserting the connector terminals. SOLUTION: The half-coupling preventing connector 31 of this invention makes a coupling detecting component 60 move to a proper coupling detection position of the female connector 40 before the connector terminals are inserted automatically with the automatic terminal insertion machine. By this transfer, with making the rear end of the coupling detecting component 60 approximately coincidence with the rear end face of the female connector 40, the connection terminals can be automatically inserted into the terminal accommodation room 40a with the automatic terminal insertion machine.
摘要翻译：要解决的问题：为了提供一种将连接端子自动插入到半耦合防止连接器的插入方法，其能够通过使自动插入机自动插入，通过使耦合检测部件的后端设置在一侧连接器壳体之间在插入连接器端子时，公/母连接器外壳不会脱离该连接器外壳的后端。解决方案：本发明的半耦合防止连接器31在连接器端子与自动端子插入机自动插入之前使耦合检测部件60移动到阴连接器40的适当耦合检测位置。通过这种转移，通过使耦合检测部件60的后端大致与阴连接器40的后端面一致，可以利用自动端子插入机将连接端子自动插入终端容纳室40a。

5. 发明专利

JP2016511121A 流体の閉鎖移送のためのシステム审中-公开
标题翻译：系统关闭流体输送
公开(公告)号：JP2016511121A
公开(公告)日：2016-04-14
申请号：JP2016501390
申请日：2014-03-12
申请人：ベクトンディキンソンアンドカンパニーリミテッド , ベクトンディキンソンアンドカンパニーリミテッド
发明人：パイアマリーチポール , パイアマリーチポール , イヴォセヴィッチミラン , イヴォセヴィッチミラン
IPC分类号： A61J1/20
CPC分类号： A61J1/2096 , A61J1/201 , A61J1/2048 , A61J1/2055 , A61J1/2065 , A61J1/2072 , A61J1/2082 , A61M39/12 , A61M39/14 , A61M2039/1027 , A61M2039/1044 , A61M2039/1072 , Y10T29/49217
摘要：カニューレとバイアルの係合中、バイアルチャンバからバレルチャンバへのカニューレを介した物質の移送中、及びバイアルからのカニューレの係合解除中に、実質的に漏れのないシールと圧力等化を提供する、流体の閉鎖移送のためのシステムが開示されている。システムの漏れ防止シールは、システムの使用中に空気と液体の両方の漏れを実質的に防止する。本開示のシステムはまた、システムがバイアルに取付けられているとき、バイアルとシステムとの間の圧力の等化を可能にする。システムは、患者に薬剤を投与するためバイアル内に包含されている薬物にアクセスするための針及びシリンジアセンブリと互換性がある。
摘要翻译：在套管和小瓶中，通过从所述瓶腔到筒腔插管的物质的运输过程中的接合，和从小瓶插管脱离期间，以提供基本上无泄漏的密封件和压力均衡用于封闭流体输送系统被公开。防渗密封系统，基本上以防止在使用该系统的过程中空气和液体的泄漏。本公开的系统还当系统被附接到所述小瓶，使小瓶与系统之间的压力均衡。系统可以针和用于访问到小瓶中用来施用药物给患者的药物注射器组件相兼容。

6. 发明专利

JP2013033955A Method for burying conductive mesh in transparent electrode 有权
标题翻译：用于在透明电极中引导导电网的方法
公开(公告)号：JP2013033955A
公开(公告)日：2013-02-14
申请号：JP2012146841
申请日：2012-06-29
申请人： Korea Inst Of Machinery & Materials , コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズ
发明人： LEE TAIK-MIN , KIM IN-YOUNG , JO JEONG DAL , KIM DONG SOO
IPC分类号： H05K9/00 , B05D1/28 , B05D7/00
CPC分类号： G06F3/044 , G02F1/13439 , G06F3/045 , H01L31/022466 , H01R43/04 , H05K3/1275 , H05K2201/09681 , H05K2203/0113 , H05K2203/0534 , Y10T29/49217
摘要： PROBLEM TO BE SOLVED: To provide a method for burying a conductive mesh in a transparent electrode, which prevents the conductive mesh from protruding from the transparent electrode by burying the conductive mesh in the transparent electrode, and therefore improves the contact performance of the transparent electrode and prevents the conductive mesh from being separated from the transparent electrode.SOLUTION: A method for burying a conductive mesh in a transparent electrode includes the steps of: attaching a conductive mesh M to a transfer unit 120 made of PDMS material; pressing and tightly adhering the transfer unit 120 to a transparent electrode E on a substrate S; and separating the transfer unit 120 from the transparent electrode E to separate the conductive mesh M from the transfer unit 120 and bury the conductive mesh M in the transparent electrode E to prevent the conductive mesh M from protruding from the transparent electrode E.
摘要翻译：要解决的问题：为了提供一种在透明电极中埋入导电网的方法，通过将导电网掩埋在透明电极中，防止导电网从透明电极突出，从而提高了导电网的接触性能透明电极，防止导电性网与透明电极分离。解决方案：在透明电极中埋入导电网的方法包括以下步骤：将导电网M附接到由PDMS材料制成的转移单元120; 将转印单元120按压并紧密地粘附到基板S上的透明电极E; 并且将转印单元120与透明电极E分离，以将导电网M与转印单元120分开，并将导电网M埋在透明电极E中，以防止导电网M从透明电极E伸出。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP4092361B2 Semiconductor package assembly 有权
公开(公告)号：JP4092361B2
公开(公告)日：2008-05-28
申请号：JP2006355406
申请日：2006-12-28
申请人：フォームファクター, インコーポレイテッド
发明人：アイゴアー・ワイ・カンドロス , ゲタン・エル・マシュー
IPC分类号： H01L21/60 , H01L23/12 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K2201/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

8. 发明专利

JP4041619B2 Production method of the interconnector 有权
公开(公告)号：JP4041619B2
公开(公告)日：2008-01-30
申请号：JP14924699
申请日：1999-05-28
申请人：東京エレクトロン株式会社
发明人：順一萩原
IPC分类号： H01R11/01 , H01R13/24 , H01R43/00
CPC分类号： H01R43/007 , H01L2924/00013 , H01R12/52 , H01R13/2414 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/49204 , Y10T29/49208 , Y10T29/49217 , Y10T29/4922 , Y10T29/49222 , Y10T29/53209 , Y10T29/53217 , Y10T29/53243 , Y10T29/53265 , Y10T156/1059 , Y10T156/1089 , Y10T156/109 , H01L2224/29099
摘要： A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the electrodes of the terminal plates, including arranging positioning plates in a container and inserting conductive wires into through holes of the positioning plates. Then forming a stacked body by alternately forming stacked insulating sheet layers and synthetic resin layers, in the container and thereafter cutting the stacked body at a middle portion of each synthetic resin layer before separating the synthetic resin layers from the insulating sheet layers, thereby forming interconnectors.

9. 发明专利

JP3996172B2 Method of testing a semiconductor device 有权
公开(公告)号：JP3996172B2
公开(公告)日：2007-10-24
申请号：JP2005162980
申请日：2005-06-02
申请人：フォームファクター, インコーポレイテッド
发明人：アイゴアー・ワイ・カンドロス , ゲタン・エル・マシュー
IPC分类号： H01L21/66 , H01L23/12 , C23C18/16 , C25D7/12 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/07 , H01L25/16 , H01L25/18 , H01R4/02 , H01R9/00 , H01R12/52 , H01R33/76 , H05K1/14 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10
CPC分类号： H05K7/1069 , B23K2201/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

10. 发明专利

JP2017035618A 医療デバイス構成要素のための接続システム审中-公开
标题翻译：用于医疗装置的组件连接系统
公开(公告)号：JP2017035618A
公开(公告)日：2017-02-16
申请号：JP2016227671
申请日：2016-11-24
申请人：ベクトンディキンソンアンドカンパニーリミテッド
发明人：ポールパイアマリーチ , ミランイヴォセヴィッチ
IPC分类号： A61J1/20
CPC分类号： A61J1/2096 , A61M39/12 , A61M39/14 , A61J1/201 , A61J1/2055 , A61J1/2065 , A61J1/2072 , A61M2039/1027 , A61M2039/1044 , A61M2039/1072 , Y10T29/49217
摘要：【課題】第1の医療デバイス構成要素を第2の医療デバイス構成要素に接続する接続システムが開示される。【解決手段】本開示の接続システムは、接続経路および切断経路の使用によって、2つの対向する医療デバイス構成要素の迅速かつ直感的な結合および分離を提供し、接続経路は、切断経路とは異なる。さらに、本開示の接続システムは、弾性変形可能な接続要素の使用によって、可聴および触覚接続フィードバックを提供する。【選択図】図1
摘要翻译：的连接系统公开了一种用于第一医疗设备部件连接到第二医疗设备组件。本发明的连接系统中，使用所述连接路径和所述切割路径的，并且提供的两个相对的医疗装置部件的快速且直观的结合和分离，所述连接路径是从所述切割路径不同。此外，本发明的连接系统，通过使用可弹性变形的连接元件，提供听觉和触觉反馈连接。点域1

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