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1. 发明专利

JP5838136B2 基板上に導電体を形成するためのシステムおよび方法有权
标题翻译：系统和方法，用于在基板上形成的导体
公开(公告)号：JP5838136B2
公开(公告)日：2015-12-24
申请号：JP2012187559
申请日：2012-08-28
申请人：ゼロックスコーポレイション , XEROX CORPORATION
发明人：イリアン・ウー
IPC分类号： H05K3/14 , H05K3/22 , H05K3/02
CPC分类号： H05K3/048 , G06K19/07773 , H01Q1/2225 , H01Q9/26 , H05K1/0386 , H05K2203/013 , H05K2203/0769 , H05K2203/0783 , Y10T29/49016 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155

3. 发明专利

JP2013151644A Nanowire-based transparent conductor 有权
标题翻译：基于纳米级的透明导体
公开(公告)号：JP2013151644A
公开(公告)日：2013-08-08
申请号：JP2012224256
申请日：2012-10-09
申请人： Cambrios Technologies Corp , カンブリオステクノロジーズコーポレイション
发明人： ALDEN JONATHAN S , DAI HAIXIA , KNAPP MICHAEL R , NA SHUO , PAKBAZ HASH , PSCHENITZKA FLORIAN , QUAN XINA , SPAIDD MICHAEL A , WINOTO ADRIAN , WOLK JEFFREY
IPC分类号： C09D11/00 , H01B1/00 , H01B1/22 , H01B13/00 , H01L51/50 , H05B33/14 , H05B33/28
CPC分类号： H01B1/22 , B22F2998/00 , B82Y20/00 , B82Y30/00 , C03C17/007 , C03C17/008 , C03C2217/445 , C03C2217/479 , C09D11/52 , C23F11/02 , C30B7/02 , C30B29/02 , C30B29/60 , C30B33/00 , G02F1/13439 , H01L27/14623 , H01L31/02164 , H01L31/022466 , H01L2224/45139 , H01L2224/49175 , H01L2924/00011 , H01L2924/12044 , H01L2924/3011 , H05K1/0269 , H05K1/097 , H05K3/048 , H05K2201/0145 , H05K2201/0154 , H05K2201/026 , H05K2201/10128 , H05K2203/1545 , Y10S977/762 , B22F1/0025 , H01L2924/00 , H01L2924/01004 , H01L2924/0102 , H01L2924/01039
摘要： PROBLEM TO BE SOLVED: To provide transparent conductors and methods of manufacturing the same, in particular, high-throughput coating methods.SOLUTION: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires 16 which may be embedded in a matrix 18. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates. There is provided transparent conductors having desirable electrical, optical and mechanical properties, in particular, transparent conductors that are adaptable to any substrates, and can be manufactured and patterned in a low-cost, high-throughput process.
摘要翻译：要解决的问题：提供透明导体及其制造方法，特别是高通量涂布方法。解释：描述了包括涂覆在基底上的导电层的透明导体。更具体地，导电层包括可以嵌入矩阵18的纳米线16的网络。导电层是光学透明的和柔性的。它可以涂覆或层压在各种基材上，包括柔性和刚性基材。提供了具有期望的电学，光学和机械特性的透明导体，特别是适用于任何基底的透明导体，并且可以以低成本，高通量的方法制造和图案化。

4. 发明专利

JP2013065838A System and method for formation of electrical conductor on substrate 有权
标题翻译：在基板上形成电导体的系统和方法
公开(公告)号：JP2013065838A
公开(公告)日：2013-04-11
申请号：JP2012187559
申请日：2012-08-28
申请人： Xerox Corp , ゼロックスコーポレイションXerox Corporation
发明人： WU YILIANG
IPC分类号： H05K3/10 , H05K3/02 , H05K3/14 , H05K3/22
CPC分类号： H05K3/048 , G06K19/07773 , H01Q1/2225 , H01Q9/26 , H05K1/0386 , H05K2203/013 , H05K2203/0769 , H05K2203/0783 , Y10T29/49016 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To simplify a conventional electrical conductor pattern formation method comprising an etching process, and to remove restrictions on a method of directly printing an electrical conductor on a substrate.SOLUTION: A reverse image of an electrical conductor pattern is printed on a substrate with an electrically non-conductive material to form a second pattern that exposes a portion of the surface area of the substrate. The entire surface area of the substrate is then covered with an electrically conductive material. The non-conductive material of the reverse image electrically isolates the electrically conductive material for covering the reverse image from the electrically conductive material for covering the second pattern.
摘要翻译：要解决的问题：为了简化包括蚀刻工艺的常规电导体图案形成方法，并且消除对在基板上直接印刷电导体的方法的限制。解决方案：电导体图案的反向图像用非导电材料印刷在基板上，以形成暴露基板表面积的一部分的第二图案。然后用导电材料覆盖基板的整个表面积。反向图像的非导电材料将用于覆盖反向图像的导电材料与用于覆盖第二图案的导电材料电隔离。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2011506139A Hot composite material tape and a method of manufacturing the same 审中-公开
公开(公告)号：JP2011506139A
公开(公告)日：2011-03-03
申请号：JP2010538038
申请日：2008-11-26
申请人：スリーエムイノベイティブプロパティズカンパニー
发明人：ウ，シュアン , クンション，ハイ
IPC分类号： B32B27/00 , B32B27/10 , B32B27/36 , B32B27/40 , C09J167/00 , C09J175/04 , C09J183/04 , C09J201/00 , D21H27/00 , D21H27/32
CPC分类号： H05K3/3452 , B32B7/12 , B32B27/08 , B32B27/10 , B32B27/281 , B32B27/308 , B32B27/36 , B32B27/40 , B32B29/00 , B32B29/08 , B32B2250/05 , B32B2307/306 , B32B2307/308 , B32B2307/734 , B32B2307/748 , B32B2457/10 , C09J7/21 , C09J7/29 , C09J2203/326 , C09J2400/283 , C09J2467/006 , C09J2475/006 , C09J2483/00 , H05K3/048 , H05K2203/0191 , Y10T29/49117 , Y10T156/10 , Y10T428/2839
摘要：プリント基板の生産に用いられる複合材料テープの製造方法を提供する。方法は、紙基材層の第１表面上に離型層を提供する工程と；紙基材層の第２表面上に複合材料接着剤層を提供する工程であって、前記複合材料接着剤層がポリウレタン接着剤、ポリエステル接着剤、又はこれらの混合物により形成される工程と；複合材料接着剤層の第２表面上にプラスチック層を提供する工程と、前記プラスチック層の第２表面上に接着層を提供する工程と、を含む。本発明による複合材料テープは、所定の時間最高２８０℃の高温に耐えられるだけでなく、テープは剥離しない又は反らない。

7. 发明专利

JP2009175430A Method for manufacturing of opto-electric hybrid board and opto-electric hybrid board obtained thereby 有权
标题翻译：制造光电混合板的方法和获得的OPTO-ELECTRIC HYBRID BOARD
公开(公告)号：JP2009175430A
公开(公告)日：2009-08-06
申请号：JP2008013874
申请日：2008-01-24
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HIKITA TAKAMI , SO KAZUNORI , NAITO TOSHIKI , OYABU KYOYA
IPC分类号： G02B6/122
CPC分类号： G02B6/122 , G02B6/10 , G02B6/1221 , G02B6/13 , G02B6/132 , G02B6/136 , G02B6/43 , H05K1/0274 , H05K1/056 , H05K3/0023 , H05K3/048 , H05K3/107 , H05K3/281 , H05K2203/0723
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and also to provide an opto-electric hybrid board obtained thereby. SOLUTION: A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 3. Next, a thin metal film 5 is formed on the under cladding layer 2 so as to cover the resist layer and the cores 3. Thereafter, the resist layer is removed together with portions of the thin metal film 5 lying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal film 5 to fill grooves 6 defined between adjacent cores 3 and the cores 3 with electroplated layers 7a obtained by the electroplating. The electroplated layers 7a serve as electrical interconnect lines 7. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够减少制造光电混合基板的步骤数量并且实现光电混合基板的厚度减小的光电混合基板的制造方法，电动混合板，并且还提供由此获得的光电混合板。解决方案：在芯成型树脂层上形成抗蚀剂层，然后形成预定图案。芯部形成树脂层的有效部分用作芯（光学互连线）3.接下来，在下敷层2上形成薄膜5，以覆盖抗蚀剂层和芯3.然后，将抗蚀剂层与位于抗蚀剂层的表面上的薄金属膜5的一部分一起被去除。对薄金属膜5的剩余部分进行电镀，以通过电镀获得的电镀层7a填充在相邻芯3和芯3之间限定的槽6。电镀层7a用作电互连线7.版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009505358A Transparent conductors based on nanowires 有权
公开(公告)号：JP2009505358A
公开(公告)日：2009-02-05
申请号：JP2008526300
申请日：2006-08-14
申请人：カンブリオステクノロジーズコーポレイション
发明人：エイドリアンウィノト， , ジェフリーウォルク， , ジョナサンエス．オールデン， , シナクアン， , マイケルアール．クナップ， , マイケルエー．スペイド， , ハイシャダイ， , シュオナ， , ハッシュパクバズ， , フロリアンプシェニツカ，
IPC分类号： H01B5/14 , H01B13/00
CPC分类号： H01B1/22 , B22F2998/00 , B82Y20/00 , B82Y30/00 , C03C17/007 , C03C17/008 , C03C2217/445 , C03C2217/479 , C09D11/52 , C23F11/02 , C30B7/02 , C30B29/02 , C30B29/60 , C30B33/00 , G02F1/13439 , H01L27/14623 , H01L31/02164 , H01L31/022466 , H01L2224/45139 , H01L2224/49175 , H01L2924/00011 , H01L2924/12044 , H01L2924/3011 , H05K1/0269 , H05K1/097 , H05K3/048 , H05K2201/0145 , H05K2201/0154 , H05K2201/026 , H05K2201/10128 , H05K2203/1545 , Y10S977/762 , B22F1/0025 , H01L2924/00 , H01L2924/01004 , H01L2924/0102 , H01L2924/01039
摘要： A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

9. 发明专利

JP2008251814A Forming method of buried wiring, substrate for display device and display device having the substrate 有权
标题翻译：布线布线的形成方法，用于显示装置的基板和具有基板的显示装置
公开(公告)号：JP2008251814A
公开(公告)日：2008-10-16
申请号：JP2007090928
申请日：2007-03-30
申请人： Nec Lcd Technologies Ltd , Nec液晶テクノロジー株式会社
发明人： YASUDA YUKIYASU
IPC分类号： H01L21/3205 , G02F1/1368 , H01L21/336 , H01L29/786
CPC分类号： H05K3/1258 , B82Y20/00 , G02F1/136286 , G02F2001/136295 , G02F2202/36 , H05K3/002 , H05K3/048 , H05K3/107 , H05K2201/0257 , H05K2201/09036 , H05K2203/0571 , H05K2203/1131 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide the forming method of buried wiring wherein the material of an insulating substrate, in which the buried wiring is formed, is not limited so as to be high in thermal resistance and the corrosion resistance of terminal unit of the buried wiring can be improved while being capable of surely effecting the patterning thereof through reduced processes with excellent accuracy of film thickness. SOLUTION: The buried wiring is formed by a method wherein the surface of the insulating substrate 1 is removed selectively employing a mask 17 formed on the surface of the insulating substrate 1 to form a groove 18 having a planar configuration corresponding to a wiring pattern. Then, metallic nanoparticle ink is applied on the whole of the surface of the insulating substrate 1 without removing the mask 17 to form a metallic nanoparticle ink film 20 by curing temporarily through heating. Thereafter, parts on the mask of the film 20 are removed selectively by the peeling of the mask 17 to remain the film 20 in the groove 18. Then, the film 20 in the groove 18 is cured actually by heating whereby the desired gate wiring 2 is obtained. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供掩埋布线的形成方法，其中形成有掩埋布线的绝缘基板的材料不受限于耐热性和端子单元的耐腐蚀性可以通过降低膜的厚度精度的降低而能够有效地进行图案化，从而可以提高埋入布线的能力。解决方案：埋入布线通过以下方法形成：其中绝缘基板1的表面被选择性地使用形成在绝缘基板1的表面上的掩模17去除以形成具有对应于布线的平面构造的槽18 模式。然后，通过加热临时固化，将金属纳米颗粒油墨施加到绝缘基板1的整个表面上，而不用去除掩模17形成金属纳米颗粒墨膜20。此后，通过剥离掩模17来选择性地除去膜20的掩模上的部分，以将膜20保留在槽18中。然后，通过加热使槽18中的膜20固化，由此所需的栅极布线2 获得。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2007202144A Method of manufacturing thin film antenna 审中-公开
标题翻译：制造薄膜天线的方法
公开(公告)号：JP2007202144A
公开(公告)日：2007-08-09
申请号：JP2007007424
申请日：2007-01-16
申请人： Air Wave Co Ltd , 晟輝科技股▲分▼有限公司
发明人： LU KUN-TA , LU HSIN-CHUN , LIN HAN-LUN
IPC分类号： H01Q1/38 , H05K3/02
CPC分类号： H05K3/048 , H01Q1/38 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a thin film antenna manufacturing method which is easy to implement, reduces costs and also protects environments as a result.
SOLUTION: The disclosed method includes the steps of: providing a substrate; coating the substrate with an organic material layer through patterning; baking the substrate and the organic material layer; forming a metal thin film over the substrate and the organic material layer; and removing the organic material layer and the metal thin film over the organic material layer and forming a thin film antenna from the substrate and the metal thin film over the substrate.
COPYRIGHT: (C)2007,JPO&INPIT

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