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1. 发明专利

JP2017528908A 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置审中-公开
公开(公告)号：JP2017528908A
公开(公告)日：2017-09-28
申请号：JP2017505210
申请日：2015-09-21
申请人：エムシー10 インコーポレイテッドMc10,Inc. , エムシー10 インコーポレイテッドMc10,Inc.
发明人：ジー．ガーロック、デービッド , ジー．ガーロック、デービッド , リー、シア , グプタ、サンジェイ , ダラル、ミトゥル
IPC分类号： H01L21/60
CPC分类号： H01L24/48 , G06K19/07779 , H01L24/45 , H01L24/78 , H01L24/85 , H01L2224/45118 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/4805 , H01L2224/4809 , H01L2224/48092 , H01L2224/4813 , H01L2224/48137 , H01L2224/48463 , H01L2224/48511 , H01L2224/7825 , H01L2224/78252 , H01L2224/78301 , H01L2224/78349 , H01L2224/78611 , H01L2224/85207 , H01L2224/85947 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/05599
摘要： 1対のボンド・パッドの間にボンディング・ワイヤを送り、曲げ、かつ取り付けるのに使用されるキャピラリ・ツールは、本体および加熱要素を含む。本体は、キャピラリ・ツールの第1の表面からキャピラリ・ツールの第2の表面まで延在する内部管を有する。いくつかの実装形態では、内部管は、本体の中心軸まわりの、完結した1回転の少なくとも一部分を含む、略螺旋の形状の部分を有する。加熱要素は本体に結合されており、ボンディング・ワイヤが内部管を通って送られるときボンディング・ワイヤを加熱する内部管の一部分に沿って熱影響域をもたらす。

2. 发明专利

JP2003037131A Bonding machine 审中-公开
标题翻译：粘接机
公开(公告)号：JP2003037131A
公开(公告)日：2003-02-07
申请号：JP2001225154
申请日：2001-07-25
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： SAKAI NORIHIRO , SEKI KOJI , TONO TOSHIHIKO
IPC分类号： H01L21/60 , B23K20/00 , H01L21/00
CPC分类号： H01L24/85 , B23K20/005 , B23K2201/40 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/451 , H01L2224/48247 , H01L2224/7825 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/15787 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a bonding machine that prevents spark failure between a cover forming an operation region and a torch electrode. SOLUTION: In the bonding machine, there existed a problem that the cover around an operation hole warps up during wire bonding process and spark failure occurred between the warped-up cover and the torch electrode. In the bonding machine 21 provided with a recognition unit, a part 231 of the cover 23 positioned around the operation hole 24 is insulated. Then, the inside of the operation region is maintained to high temperature of approximately 230 deg.C, for example, by a heater 30 in a substrate mounting table 22, and a part 471 of the cover 23 warps up because it is always under the high temperature. However, it is possible to realize the bonding machine that does not cause spark failure with the torch electrode 28 because the part 231 of the cover 23 is insulated.
摘要翻译：要解决的问题：提供一种防止形成操作区域的盖和焊炬电极之间的火花故障的接合机。解决方案：在焊接机中，存在在引线接合工艺期间操作孔周围的盖子翘曲并且翘曲盖和焊炬电极之间发生火花发生故障的问题。在设置有识别单元的接合机21中，位于操作孔24周围的盖23的部分231绝缘。然后，例如通过基板安装台22中的加热器30将操作区域的内部维持在约230℃的高温，并且盖23的部分471翘曲，因为它总是在高温。然而，由于盖23的部分231是绝缘的，所以可以实现与割炬电极28不引起火花发生故障的接合机。

4. 发明专利

JP2005150166A Wire bonding method for micro-gage wire 审中-公开
标题翻译：用于微孔线的线接合方法
公开(公告)号：JP2005150166A
公开(公告)日：2005-06-09
申请号：JP2003381679
申请日：2003-11-11
申请人： Tanaka Electronics Ind Co Ltd , 田中電子工業株式会社
发明人： YASUHARA KAZUHIKO
IPC分类号： H01L21/60
CPC分类号： H01L2224/05624 , H01L2224/43 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/78 , H01L2224/7825 , H01L2224/78301 , H01L2224/85 , H01L2224/85009 , H01L2224/85045 , H01L2224/85181 , H01L2224/85205 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01204 , H01L2924/01205 , H01L2924/14 , H01L2924/20752 , H01L2924/01032 , H01L2924/01034 , H01L2924/01049 , H01L2924/01026 , H01L2924/01039 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding method enabling further miniaturizing and an increase in strength in a micro-gage wire, improving a yield when a semiconductor device is assembled and enabling further miniaturization and thinning in the semiconductor device.
SOLUTION: The wire bonding method includes a first bonding process in which the front end of the micro-gage wire is joined with an electrode pad on a semiconductor element, a process in which the micro-gage wire in a length required for connecting the electrode pad to a lead terminal is led out, and a second bonding process in which the led-out micro-gage wire 1' and the lead terminal 4 are connected by stitch-bonding. In the wire bonding method, the Au micro-gage wire 1' is used as the micro-gage wire. In the wire bonding method, the second bonding process is conducted by selectively heating (preferably by arc discharge 8) only a section in the vicinity of the surface layer of the Au micro-gage wire 1', reducing an oxide film in the vicinity of the surface layer, and stitch-bonding the surface layer with the lead terminal 4.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够进一步小型化和提高微量线材的强度的引线接合方法，提高半导体器件组装时的成品率，并能够使半导体器件进一步小型化和变薄化。导线接合方法包括：第一接合工艺，其中微量线的前端与半导体元件上的电极焊盘接合，其中微量线的长度为将电极焊盘连接到引线端子，并且通过缝合将引出的微量规线1'和引线端子4连接在一起的第二接合工艺。在引线接合方法中，使用Au微量规线1'作为微量规线。在引线接合方法中，通过选择性地加热（优选通过电弧放电8）仅在Au微量规线1'的表面层附近的部分进行第二接合工艺，还原氧化膜附近的氧化膜表面层，并用表面层与引线端子4进行缝合。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2010182911A Manufacturing method of semiconductor device and wire bonder 审中-公开
标题翻译：半导体器件和焊条的制造方法
公开(公告)号：JP2010182911A
公开(公告)日：2010-08-19
申请号：JP2009025686
申请日：2009-02-06
申请人： Renesas Electronics Corp , ルネサスエレクトロニクス株式会社
发明人： MISUMI KAZUYUKI , SHINKAWA HIDEYUKI , YAMAUCHI TOSHIHARU , AOKI MITSURU
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/97 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/7825 , H01L2224/78301 , H01L2224/7865 , H01L2224/78703 , H01L2224/85181 , H01L2224/85447 , H01L2224/97 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , Y10S228/904 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve the quality of wire bonding by reducing the vibration of a lead frame or a wiring board after wire bonding. SOLUTION: A cooling blow piece 6s for cooling a wire-bonded matrix frame 2 to gradually lower its temperature is placed over a heat block 6b in a wire bonding portion 6a of a wire bonder 6. By blowing cool air from the cooling blow piece 6s to the matrix frame 2 after wire bonding, the temperature of the matrix frame 2 is controlled to gradually lower the temperature of the wire-bonded matrix frame. Alternatively, the wire-bonded matrix frame 2 is fixed by means of a pressing jig tool such as a frame presser piece 6d, a guide member, a roller means or an elastic means until the wire-bonded matrix frame 2 is cooled completely. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过在引线接合之后减少引线框架或布线板的振动来提高引线接合的质量。解决方案：用于冷却引线键合框架2以逐渐降低其温度的冷却吹塑片6s放置在引线接合器6的引线接合部分6a中的加热块6b上。通过从冷却在引线接合之后将片6s吹到矩阵框架2，控制矩阵框架2的温度以逐渐降低引线键合矩阵框架的温度。或者，通过诸如框架按压片6d，引导构件，滚子装置或弹性装置之类的加压夹具工具固定引线键合框架2，直到引线键合框架2完全冷却。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP4097281B2 Connection structure of the wire-wound coils and ic chip for non-contact id identification device and connection method to configure this 有权
公开(公告)号：JP4097281B2
公开(公告)日：2008-06-11
申请号：JP2006105177
申请日：2006-04-06
申请人：スターエンジニアリング株式会社
发明人：勝治星
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
CPC分类号： H01L24/48 , H01L23/49855 , H01L24/05 , H01L24/45 , H01L24/80 , H01L24/85 , H01L2224/04042 , H01L2224/05082 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05184 , H01L2224/05639 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48458 , H01L2224/48471 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48839 , H01L2224/48844 , H01L2224/7825 , H01L2224/78313 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/85238 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/19042 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/20755 , H01L2924/20756 , H01L2924/2075 , H01L2924/20754 , H01L2924/069 , H01L2924/01049 , H01L2924/01006
摘要： The present invention aims to provide such a joint structure of a wound coil 1 and an IC chip 2 for a noncontact RFID device that is able to yield electrically and mechanically excellent connection, employing the wound coil 1, which is made by winding copper electric wire, with small variance of the electric resistance as an antenna coil for the noncontact RFID device, also by making use of such IC chips that their joint terminals 3 are covered with such metallization of the gold outermost layer 3a that is not liable to degradation during storage; and aims to provide such a method of joining the wound coil 1 and the IC chip 2 for the noncontact RFID device that is able to make said joint structure with ease and certainty, through selecting a direct joining process low in production cost as the joining method of the two, also through improving the process.

7. 发明专利

JP2009177215A Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2009177215A
公开(公告)日：2009-08-06
申请号：JP2009116402
申请日：2009-05-13
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： SEKI KOJI , SAKAI NORIHIRO , TONO TOSHIHIKO
IPC分类号： H01L21/60
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/78 , H01L2224/7825 , H01L2224/85 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/10162 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To solve a problem that in a wire bonding process, an antioxidant film of a lead frame may be separated and adhesion with resin may be deteriorated. SOLUTION: In a semiconductor device manufacturing method, a lead frame is prepared on which a plurality of loading parts disposed in a row direction and a column direction are collectively formed as a collective block and an antioxidant film is formed, a rear face of the lead frame which corresponds to the collective block is mounted on a mounting board of a bonding device, semiconductor elements formed on positions corresponding to the loading parts of the lead frame are bounded to the lead frame by using the bonding device, and wire-bonding is collectively performed in the collective block. When collectively performing wire bonding while pressing the peripheral end of the collective block in the lead frame, nitrogen gas is sprayed to the collective block to suppress the separation of the antioxidant film formed on the lead frame. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题为了解决在引线接合工艺中引线框架的抗氧化膜可能被分离并且与树脂的粘合性可能劣化的问题。解决方案：在半导体器件制造方法中，制备引线框架，其上沿着行方向和列方向布置的多个装载部分共同形成为集合块，形成抗氧化膜，后表面对应于集体块的引线框架安装在接合装置的安装板上，形成在与引线框架的装载部分相对应的位置上的半导体元件通过使用接合装置被限定在引线框架上，在集体块中集体执行粘合。当在引线框架中按压集合块的外周端共同进行引线接合时，向集合块喷射氮气，以抑制在引线框架上形成的抗氧化膜的分离。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007280015A Contact structure between winding type coil for noncontact ic card and ic chip and connection method for making it 有权
标题翻译：用于非接线IC卡的卷绕型线圈和IC芯片之间的接触结构以及制造它的连接方法
公开(公告)号：JP2007280015A
公开(公告)日：2007-10-25
申请号：JP2006105177
申请日：2006-04-06
申请人： Star Engineering Co Ltd , スターエンジニアリング株式会社
发明人： HOSHI KATSUJI
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
CPC分类号： H01L24/48 , H01L23/49855 , H01L24/05 , H01L24/45 , H01L24/80 , H01L24/85 , H01L2224/04042 , H01L2224/05082 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05184 , H01L2224/05639 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48458 , H01L2224/48471 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48839 , H01L2224/48844 , H01L2224/7825 , H01L2224/78313 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/85238 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/19042 , H01L2924/00014 , H01L2924/00 , H01L2224/48744 , H01L2924/20755 , H01L2924/20756 , H01L2924/2075 , H01L2924/20754 , H01L2924/069 , H01L2924/01049 , H01L2924/01006
摘要： PROBLEM TO BE SOLVED: To stably secure electrical and mechanical connections between a coil and the connecting terminal of an IC chip at low cost. SOLUTION: The corresponding portion of a winding type coil 1 made of copper wire is placed on top of an Au film 3a located on the outermost layer of the connecting terminal 3 of the IC chip 2, and an electrode 4 is made to abut on the top of the corresponding portion of the coil 1. As a current is passed through the electrode 4 for heating, pressure is applied. In this case, the winding type coil 1 to be joined has a wire diameter of υ 70 μm±3 μm, and comprises a copper conductor 1b covered with an insulating film 1a of polyurethane. The IC chip 2 is in the form of a rectangle with a side length of 1,000 μm. The metallization of the connecting terminal 3 thereof is Ti-W-Au. The Au film 3a on the outermost layer is 10 μm thick. The electrode 4 serving as a heating/pressing means is made of W (tungsten) and the indirectly-heated type. The requirements for welding using it are: a welding voltage of 1.8 V; a resistance welding time of 0.5 seconds; and a pressure of 80 g. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：以低成本稳定地确保线圈与IC芯片的连接端子之间的电气和机械连接。解决方案：由铜线制成的绕线式线圈1的相应部分放置在位于IC芯片2的连接端子3的最外层上的Au膜3a的顶部，并且将电极4制成邻接线圈1的相应部分的顶部。当电流通过电极4进行加热时，施加压力。在这种情况下，待接合的绕线型线圈1的线直径为υ70μm±3μm，并且包括覆盖有聚氨酯绝缘膜1a的铜导体1b。 IC芯片2为边长1000μm的矩形。其连接端子3的金属化是Ti-W-Au。最外层的Au膜3a为10μm厚。作为加热/加压装置的电极4由W（钨）和间接加热型制成。使用焊接要求是：焊接电压为1.8 V; 电阻焊接时间为0.5秒; 压力为80g。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JPS6154638A Wire-bonding method 失效
标题翻译：线接法
公开(公告)号：JPS6154638A
公开(公告)日：1986-03-18
申请号：JP17658384
申请日：1984-08-27
申请人： Toshiba Corp
发明人： ATSUMI KOICHIRO
IPC分类号： H01L21/603 , H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45147 , H01L2224/78 , H01L2224/7825 , H01L2224/78301 , H01L2224/78313 , H01L2224/85 , H01L2224/85045 , H01L2224/85075 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01007 , H01L2924/01029 , H01L2924/3025 , H01L2224/48 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE: To prevent a base metal wire from being oxidized and to perform a firm junction by a method wherein a heat shielding plate, which is cooled, is provided on the way of the base metal wire travelling path between the clamper and the capillary.
CONSTITUTION: A copper wire 2 passes through the hole 14 of a heat shielding plate 13 in between a clamper 5 and a capillary 6. The air or inactive gas is sprayed on the heat shielding plate 13 from the holes 21 of a nozzle 15 arranged in parallel to the heat shielding plate 13 and the heat shielding plate 13 is cooled. After the wire 2 is led out and is set, a heater 12 is conducted, N
2 is made to flow in the nozzle 15 and a junction work is performed. A ball 8 is formed on the point of the wire using a torch bar 7. The ball is pressed by the capillary 6 and a thermocompression bonding, which is applied in combination with ultrasonic waves, is performed under a coation with the heat of the heater 12. Since the cooling plate 13 prevents a clamper 4 and the clamper 5 from being heated and prevents an oxidation of the wire, a favorable pole can be formed on the point of the wire and a firm juctions can be performed.
COPYRIGHT: (C)1986,JPO&Japio
摘要翻译：目的：为了防止贱金属丝被氧化，并通过冷却的热屏蔽板在夹持器和毛细管之间的基底金属丝行进路径上设置的方法进行牢固的连接。构成：铜线2穿过夹持器5和毛细管6之间的隔热板13的孔14.空气或惰性气体从布置在其中的喷嘴15的孔21喷射到热屏蔽板13上平行于隔热板13和隔热板13被冷却。在导线2被引出并被固定之后，传导加热器12，使N 2在喷嘴15中流动并进行连接作业。使用炬杆7在线的点上形成球8.球被毛细管6挤压，并且与超声波结合使用的热压接在与加热器的热量的配合下进行由于冷却板13防止夹持器4和夹持器5被加热并且防止线的氧化，所以可以在线的点上形成良好的极点，并且可以执行牢固的击打。

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