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1. 发明专利

JPH09163243A SOLID-STATE IMAGE PICKUP UNIT 失效
公开(公告)号：JPH09163243A
公开(公告)日：1997-06-20
申请号：JP32169995
申请日：1995-12-11
申请人： TOSHIBA CORP
发明人： KOMATSU TETSUO , ANDO TETSUO , ATSUMI KOICHIRO
IPC分类号： H01L27/14 , H04N5/335 , H04N5/372
摘要： PROBLEM TO BE SOLVED: To miniaturize the whole unit without deteriorating an optical characteristic by providing a light transmitting part keeping airtight on the solid-state image pickup element side of a case and a means keeping airtight on the light receiving surface of a solid-state image pickup element which is arranged at the opposite side to the light receiving surface of the solid-state image pickup element. SOLUTION: The periphery of a filter constituting the light transmitting part 40 or the periphery of optical glass 43 is sealed by an adhesive B to the inner wall surface of the case 21. A substrate 50 is arranged in the lower part of the filter 43 and its periphery is sealed by the adhesive B on the inner wall surface of the case 21. A square-shaped CCD (solid-state image pickup element) chip 60 is arranged on the substrate 50. The CCD chip 60 is airtightly sealed by the filter 43 and the substrate 50 which are sealed by the adhesive B and the inner wall surface of the case 21. An external edge part as the sealing margin of the substrate 50 is not required so that the diameter of the substrate 50 is made small.

2. 发明专利

JPH0770674A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0770674A
公开(公告)日：1995-03-14
申请号：JP14582694
申请日：1994-06-06
申请人： TOSHIBA CORP
发明人： YAMANE SHIGEMI , ATSUMI KOICHIRO , ANDO TETSUO , YAGI NORIAKI
IPC分类号： C22C9/00 , H01B1/02 , H01L21/60
摘要： PURPOSE:To obtain a high reliability semiconductor device by using a Cu-based bonding wire having a specified compsn. when a semiconductor chip is electrically connected to a lead finger. CONSTITUTION:The compsn. of a bonding wire is composed of 0.001 to =0.03wt.%.

3. 发明专利

JPH06310563A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06310563A
公开(公告)日：1994-11-04
申请号：JP32840393
申请日：1993-12-24
申请人： TOSHIBA CORP
发明人： ATSUMI KOICHIRO
IPC分类号： H01L21/60 , H01L21/68
摘要： PURPOSE:To provide a highly reliable semiconductor device which can be used in flip-flop bonding, can be packaged, and the manufacturing method of the semiconductor device. CONSTITUTION:An IC chip 12, on which a chip electrode 15 is formed, a package 17 covering the IC chip 12, and metal posts 16 bonded to the chip electrode 15 with its parts exposed from the package 17, are provided. Flip-chip binding is performed to a substrate 20, and the package electrode 15 is bonded to a substrate electrode 21.

4. 发明专利

JPH06216197A FLIP-CHIP BONDING APPARATUS 失效
公开(公告)号：JPH06216197A
公开(公告)日：1994-08-05
申请号：JP749793
申请日：1993-01-20
申请人： TOSHIBA CORP
发明人： ATSUMI KOICHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To enable the electric test of a semiconductor chip to be conducted prior to mounting it on a circuit board and to enable this semiconductor chip to be mounted on the circuit board in high density by providing a bonding mechanism for flip-chip bonding of the semiconductor chip to the circuit board. CONSTITUTION:Inner leads of a film carrier to which a semiconductor chip 1 is connected by inner lead bonding are cut at portions in the vicinity of the semiconductor chip 1. With cut-pieces 15a of the inner leads attached to the semiconductor chip 1, the semiconductor chip is held by a second bonding tool 28, a printed board 5 is pressurized and heated. And the cut pieces 15a of the inner leads and a wiring pattern 6 of the printed board 5 are bonded.

5. 发明专利

JPH05347334A 失效
公开(公告)号：JPH05347334A
公开(公告)日：1993-12-27
申请号：JP15519592
申请日：1992-06-15
申请人： TOSHIBA CORP
发明人： IKETANI YUKIHIRO , KASHIMA NORIYASU , ATSUMI KOICHIRO
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To see that the vibration property of ultrasonic horn hardly changes by mounting condition and that the adjustment work is needless. CONSTITUTION:This device is equipped with a bar-shaped ultrasonic horn 20 which can hold a capillary at the top and also has an ultrasonic vibrator 9 at the other end and the other end of which is accommodated in the body 8 of a bonding head, and a flange 21 is provided halfway in the longitudinal direction of this ultrasonic horn 20, and a tubular holder 22 is fixed around this flange 21. This holder 22 is made of the material different in quality from the ultrasonic horn 20, and besides higher in reflectance of ultrasonics than the ultrasonic horn 20. The ultrasonic horn 20 is attached to the body 8 of the bonding head through this holder 22.

6. 发明专利

JPH04286132A METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04286132A
公开(公告)日：1992-10-12
申请号：JP4966491
申请日：1991-03-14
申请人： TOSHIBA CORP
发明人： KASHIMA NORIYASU , ATSUMI KOICHIRO , SUEMATSU MUTSUMI , USHIJIMA AKIRA , OKANO KEITARO , HIROTA MITSUO , MURAKAMI YUICHI
IPC分类号： H01L21/52
摘要： PURPOSE:To provide a manufacturing method for a semiconductor device and a manufacturing apparatus thereof in which productivity of the device is improved and operability is improved. CONSTITUTION:A manufacturing method for a semiconductor device having a step of supplying boards Pa, Pb in which many circuit patterns (a) are continuously formed, a step of obtaining a circuit board (b) by punching the pattern part from the board, and a step of mounting the circuit board on a lead frame R by aligning the position. A manufacturing apparatus for the device having means 4 for supplying many boards formed continuously with circuit patterns, means 13 for punching a part formed with the pattern from the board, means 14, 35 for conveying, positioning and holding the frame R, means 39 for coating a predetermined position of the frame with adhesive, and means 18 for holding the circuit board, aligning it with the predetermined position in the frame and mounting it.

7. 发明专利

JPH04144142A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04144142A
公开(公告)日：1992-05-18
申请号：JP26747190
申请日：1990-10-04
申请人： TOSHIBA CORP
发明人： ATSUMI KOICHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To ensure multi-pin connection at the low cost by molding with protective resin a circuit pattern connection part of a lead frame, a semiconductor chip, and a circuit pattern, and protruding one end of the lead frame. CONSTITUTION:There are provided two types of lead wires 4a..., 4b... where an inner lead part is protruded inwardly from the peripheral edges of device holes 2a, 2b. The one lead wires 4a... include test pads 5 at the other end as an outer lead. The other lead wires 4b... are provided over their device holes 2a, 2b. In the device holes 2a, 2b first and second semiconductor chips 6a and 6b each having optimum areas are fitted. Further, a bump and an inner lead part on electrode (not shown here) are integrally joined and connected with each other. Since there is provided a film carrier tape F using such a TAB technique as above, a multi-chip type where the semiconductor chips 6a, 6b, can be constructed in which the semiconductor chips 6a, 6b are connected to one circuit pattern 3.

8. 发明专利

JPH03215953A METHOD AND DEVICE FOR INNER LEAD BONDING 失效
公开(公告)号：JPH03215953A
公开(公告)日：1991-09-20
申请号：JP1124090
申请日：1990-01-20
申请人： TOSHIBA CORP
发明人： ATSUMI KOICHIRO , KASHIMA NORIYASU , IKETANI YUKIHIRO , OKANO KEITARO
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a defective unit from occurring, to decrease a bonding operation in manhours, and to improve a semiconductor device in productivity by a method wherein a control means possessed of functions which are able to select a prescribed bonding tool out of bonding tools and to set bonding conditions for each of the selected bonding tools is provided. CONSTITUTION:Bonding tools 25a and 25b are provided, and a control means 11A possessed of a function which is able to select a prescribed bonding tool out of the bonding tools 25a and 25b and to set bonding conditions for each of the selected bonding tools is provided. Therefore, works of several types can be mounting on a tape 12 in continuous form corresponding to the bonding conditions of the type of the work without rewinding or replacing the tape 12. By this setup, a defective unit can be prevented from occurring, a bonding operation can be lessened in manhour, and a product can be improved in productivity.

9. 发明专利

JPH03123042A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH03123042A
公开(公告)日：1991-05-24
申请号：JP25876389
申请日：1989-10-05
申请人： TOSHIBA CORP
发明人： ATSUMI KOICHIRO , MAEHARA YOICHIRO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To eliminate the need to be nervous about a difference between thermal expansion coefficients at the time of resin mold, to adhere inner lead parts diretly en block to electrode pads, to provide the electrode pads at fine pitches and to make possible the reliable connection between a lead frame and a semiconductor chip by a method wherein the wall thickness only of the inner lead parts of the lead frame is made very thinner than the wall thickness of the outer lead parts of the lead frame and the wall thickness of the parts, which are located in the vicinities of the iiner lead parts, of the outer lead parts. CONSTITUTION:Electrode pads 12 which are a multitude of connecting terminals are provided on the four sides of a semiconductor chip 11 at very fine pitches, each pad 12 is provided with a metal bump 13 and the pitches between the bumps 13 is set at a very fine pitch. On the other hand, the wall thickness M1 only of inner lead parts 14a, which are connecting parts of a lead frame 14 to the chip 11, is formed in a very thin wall thickness and the wall thickness of outer lead parts 14b other than these lead parts 14a and the wall thickness of the parts, which are located in the vicinities of the lead parts 14a, of the lead parts 14b are formed in a normal wall thickness M0. The bumps 13 are pressed by a heating tool through the lead parts 14a of the lead frame 14 and the pads 12 and the lead parts 14a are bonded together en block.

10. 发明专利

JPH03120842A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH03120842A
公开(公告)日：1991-05-23
申请号：JP25778789
申请日：1989-10-04
申请人： TOSHIBA CORP
发明人： KASHIMA NORIYASU , ATSUMI KOICHIRO , IKETANI YUKIHIRO
IPC分类号： H01L21/50
摘要： PURPOSE:To obtain a device which is excellent in workability and able to reduce the generation of defects, by linking an inner lead bonding equipment and a potting equipment, and making a carrier tape continuously run from the inner lead bonding equipment to the potting equipment. CONSTITUTION:In a manufacturing equipment 21 of a semiconductor device wherein a film carrier 3 for mounting semiconductor elements is made to run, at least an inner lead bonding equipment 1 mounting a semiconductor element 7 on the film carrier 3 and a potting equipment 11 coating the semiconductor element 7 mounted on the film carrier 3 with sealing resin are linked, and a carrier tape is made to continuously run from the inner lead bonding equipment 1 to the potting equipment 11. Further, for example, after the semiconductor element 7 coated with resin is conveyed in a curing furnace 15 as it remains horizontal for a while, and the resin is cured until it turns to a gel state, the element is brought into contact with a guide roller 16, and the resin is further cured while the film carrier 3 is intermittently sent.

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