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    • 6. 发明专利
    • Supercritical drying method of semiconductor substrate
    • 半导体基板的超临界干燥方法
    • JP2013055230A
    • 2013-03-21
    • JP2011192594
    • 2011-09-05
    • Toshiba Corp株式会社東芝
    • SATO YOHEIOGUCHI HISASHITOMITA HIROSHIHAYASHI HIDEKAZUJI LINAN
    • H01L21/304F26B5/04F26B5/16
    • H01L21/02101F26B3/00F26B3/02F26B5/005F26B5/04F26B7/00H01L21/02057H01L21/67034
    • PROBLEM TO BE SOLVED: To provide a supercritical drying method of a semiconductor substrate which inhibits a metal material and polysilicon on the semiconductor substrate from being etched and prevents the deterioration of electric characteristics of a semiconductor device.SOLUTION: A supercritical drying method of a semiconductor substrate includes the steps of: introducing the semiconductor substrate having a surface wetted with a water soluble organic solvent into a chamber after the semiconductor substrate is cleaned and rinsed; sealing the chamber and putting the water soluble organic solvent in the supercritical state; lowering the pressure in the chamber and changing the water soluble organic solvent in the supercritical state into a gas to discharge the water soluble organic solvent from the chamber; supplying an inactive gas into the chamber as the pressure in the chamber is lowered to the atmospheric pressure; and cooling the semiconductor substrate.
    • 解决的问题:提供抑制半导体衬底上的金属材料和多晶硅被腐蚀的半导体衬底的超临界干燥方法,并防止半导体器件的电特性劣化。 解决方案:半导体衬底的超临界干燥方法包括以下步骤:在半导体衬底被清洁和冲洗之后,将具有被水溶性有机溶剂润湿的表面的半导体衬底引入腔室; 密封室并将水溶性有机溶剂置于超临界状态; 降低室中的压力并将超临界状态的水溶性有机溶剂变成气体,以从室中排出水溶性有机溶剂; 当室中的压力降低到大气压力时,将惰性气体供应到室中; 并冷却半导体衬底。 版权所有(C)2013,JPO&INPIT