专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP6312343B2 ウェハを処理する方法有权
公开(公告)号：JP6312343B2
公开(公告)日：2018-04-18
申请号：JP2016163515
申请日：2016-08-24
申请人：株式会社ディスコ
发明人：カールハインツプリーヴァッサー
IPC分类号： H01L21/301 , H01L21/304
CPC分类号： H01L21/78 , B81C1/00825 , B81C1/00896 , B81C2201/053 , H01L21/304 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L24/94 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/94 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2224/03 , H01L2224/11

3. 发明专利

JP2010268412A Mems microphone semiconductor device and method of manufacturing the same 审中-公开
标题翻译： MEMS麦克风半导体器件及其制造方法
公开(公告)号：JP2010268412A
公开(公告)日：2010-11-25
申请号：JP2009120418
申请日：2009-05-18
申请人： Panasonic Corp , パナソニック株式会社
发明人： IITAKA MASAHIRO , UCHIUMI KATSUKI , FUJII KYOKO
IPC分类号： H04R19/04 , B81B3/00 , B81C3/00 , H04R19/01
CPC分类号： B81C1/00896 , B81B2201/0257 , B81B2207/012 , B81C2201/053 , H01L24/97 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/14 , H01L2924/1461 , H04R19/04 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a MEMS microphone semiconductor device in which reliability is improved by suppressing entry of cutting water or cutting dust during processing for dicing, and to provide a method of manufacturing the same. SOLUTION: The MEMS microphone semiconductor device includes: a substrate; one or more semiconductor elements mounted on a first principal surface of the substrate; a case fixed on the first principal surface of the substrate for covering the one or more semiconductor elements; a through-hole which is formed on the substrate or on the case and becomes a sound hole; and a plurality of connecting electrodes formed on a second principal surface, that is opposite to the first principal surface, of the substrate, wherein entry suppression shaping is applied to the through-hole so as to suppress the entry of cutting water during dicing. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种MEMS麦克风半导体器件，其通过在切割加工期间抑制切入水或切割灰尘来提高可靠性，并提供其制造方法。解决方案：MEMS麦克风半导体器件包括：衬底; 安装在所述基板的第一主表面上的一个或多个半导体元件; 固定在用于覆盖所述一个或多个半导体元件的所述基板的所述第一主表面上的壳体; 形成在基板上或壳体上并形成声孔的通孔; 以及形成在基板的与第一主表面相对的第二主表面上的多个连接电极，其中对通孔施加抑制成形以抑制切割期间切割水的进入。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2007216368A Electromechanical element and electronic circuit device, and method for manufacturing the same 审中-公开
标题翻译：电子元件和电子电路装置及其制造方法
公开(公告)号：JP2007216368A
公开(公告)日：2007-08-30
申请号：JP2006042987
申请日：2006-02-20
申请人： Sony Corp , ソニー株式会社
发明人： AKIBA AKIRA , MITARAI TAKASHI
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81C1/00896 , B81B2207/015 , B81C2201/056
摘要： PROBLEM TO BE SOLVED: To solve a problem such as deformation or breakage of a needle caused by a load or the like on the mover in a manufacturing process of an electromechanical element.
SOLUTION: A mover 5 is formed on a sacrifice layer 23, and a plurality of holes 5h for exposing the sacrifice layer 23 are formed in the mover 5. The first etching to leave a part of the sacrifice layer is performed from the holes formed in the mover and from the periphery of the mover, and the mover is mechanically supported by the remaining portion of the sacrifice layer. In this state, the loading work is performed, the second etching is performed subsequently to remove the remaining portion of the sacrifice layer. By performing the loading work on the needle in a reinforcing state by a part of the sacrifice layer, deformation, breakage or the like of the mover in the manufacturing process by the load or the like can be avoided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了解决在机电元件的制造过程中由于载荷等导致的针头的变形或破损的问题。解决方案：在牺牲层23上形成移动器5，并且在移动器5中形成用于暴露牺牲层23的多个孔5h。离开牺牲层的一部分的第一蚀刻是从形成在移动器和移动器的周边的孔，并且移动器由牺牲层的剩余部分机械地支撑。在这种状态下，进行加载工作，随后执行第二蚀刻以去除牺牲层的剩余部分。通过由牺牲层的一部分在加强状态下进行针的加载作业，可以避免在制造过程中通过负载等的动子的变形，破损等。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP4480728B2 Mems method of manufacturing a microphone 有权
公开(公告)号：JP4480728B2
公开(公告)日：2010-06-16
申请号：JP2007001227
申请日：2007-01-09
申请人：パナソニック株式会社
发明人：勝喜内海 , 芳宏松島 , 正美松浦 , 隆博隈川
IPC分类号： B81C99/00 , B81C1/00 , H01L21/301
CPC分类号： B81C1/00896 , B23K26/40 , B23K2201/40 , B23K2203/50 , B81B2201/0257

6. 发明专利

JP4464042B2 Mechanical micro structure and a manufacturing method thereof 有权
公开(公告)号：JP4464042B2
公开(公告)日：2010-05-19
申请号：JP2002380337
申请日：2002-12-27
申请人：コミサリヤ・ア・レネルジ・アトミク
发明人：ステフアン・カプレ
IPC分类号： G01P15/125 , B81B3/00 , B81B7/00 , B81C1/00 , G01P15/08 , H01L29/84
CPC分类号： B81C1/00896 , B81B7/0012 , G01P2015/0814

7. 发明专利

JP2010044061A Saw debris reduction in mems devices 审中-公开
标题翻译： MEMS器件中的SAW减少损耗
公开(公告)号：JP2010044061A
公开(公告)日：2010-02-25
申请号：JP2009168678
申请日：2009-07-17
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： RIDLEY JEFF A , GLENN MAX , NOHAVA JAMES C , HORNING ROBERT D , REKSTAD JANE
IPC分类号： G01C19/56 , G01P9/04
CPC分类号： B81C1/00896 , B81B2207/07 , B81C2203/0118 , B81C2203/019
摘要： PROBLEM TO BE SOLVED: To reduce debris and to improve yield and reliability in the production of MEMS devices. SOLUTION: In the improved MEMS device and the production method, channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounding the MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：减少碎片，提高MEMS器件生产中的产量和可靠性。解决方案：在改进的MEMS器件和制造方法中，在预先形成在第一衬底上的多个MEMS器件区域周围的第一衬底中形成沟道。然后，多个密封环被施加在多个MEMS器件区域周围并且在形成的通道的至少一部分上。第二衬底附接到第一衬底，则围绕MEMS器件区域的密封环彼此分离。通道包括第一和第二截面区域。第一横截面面积的大小用于保持锯屑颗粒进入MEMS器件区域。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP3846094B2 A method of manufacturing a semiconductor device 有权
公开(公告)号：JP3846094B2
公开(公告)日：2006-11-15
申请号：JP6694899
申请日：1999-03-12
申请人：株式会社デンソー
发明人：泰樹下山 , 晋二吉原 , 欣也渥美 , 純朋猪俣 , 哲夫藤井 , 峰一酒井
IPC分类号： H01L21/56 , H01L23/29 , B81B7/00 , B81C1/00 , B81C3/00 , G01L9/04 , G01P1/02 , G01P15/08 , H01L21/60 , H01L23/00 , H01L23/02 , H01L23/31
CPC分类号： B81B7/0058 , B81C1/00896 , G01P1/023 , G01P15/0802 , H01L23/3164 , H01L23/564 , H01L24/05 , H01L2224/04042 , H01L2224/05624 , H01L2224/32245 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01082 , H01L2924/10253 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式