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    • 6. 发明专利
    • Screen printing device and screen printing method
    • 屏幕打印设备和画面打印方法
    • JP2012086429A
    • 2012-05-10
    • JP2010234321
    • 2010-10-19
    • Panasonic Corpパナソニック株式会社
    • ABE SHIGETAKAYAZAWA TAKASHI
    • B41F15/26B41F15/08B41M1/12H05K3/34
    • B41F15/08B41F15/0881B41F33/0081B41M1/12B41P2215/112B41P2215/114H05K3/0008H05K3/1216H05K3/3484Y10S101/36
    • PROBLEM TO BE SOLVED: To provide a screen printing device which can improve substrate alignment precision by properly correcting relative position errors of imaging optical axes or position errors caused by the movement of an imaging part in a configuration which horizontally moves the imaging part having two imaging optical axes aimed at a substrate and a mask plate as imaging objects, and to provide a screen printing method.SOLUTION: Prior to a mark imaging step carried out for the purpose of the position detection of recognition marks for aligning the substrate and mask, an optical axis calibration processing step of detecting a horizontal direction relative position between the imaging optical axes, and a surface correction data preparation processing step of detecting local position misregistration in the imaging optical axes caused by the movement of the imaging part are carried out. Before the start of manufacturing, a pre-manufacturing precision evaluation step is carried out for evaluating the substrate alignment precision using the validation substrate and the mask. After the start of the manufacturing, a post-manufacturing precision evaluation step of evaluating the substrate alignment precision after the start of the manufacturing is carried out using actual manufacturing substrate and the mask.
    • 要解决的问题:提供一种丝网印刷装置,其可以通过适当地校正成像光轴的相对位置误差或由成像部件在水平移动成像部件的构造中的移动而引起的位置误差来提高基板对准精度 具有瞄准基板的两个成像光轴和作为成像对象的掩模板,并提供丝网印刷方法。 解决方案:在针对用于对准衬底和掩模的识别标记的位置检测的目的进行标记成像步骤之前,在检测成像光轴之间的水平方向相对位置的光轴校准处理步骤和 执行由成像部件的运动引起的成像光轴的局部位置重合失调的表面校正数据准备处理步骤。 在开始制造之前,使用验证基板和掩模来进行用于评价基板对准精度的预制造精度评价步骤。 在制造开始之后,使用实际的制造基板和掩模进行制造开始后的基板对准精度的评价的后制造精度评价工序。 版权所有(C)2012,JPO&INPIT
    • 10. 发明专利
    • Solder supply device, printing apparatus, and printing method
    • 焊接设备,打印设备和打印方法
    • JP2010179628A
    • 2010-08-19
    • JP2009027310
    • 2009-02-09
    • Yamaha Motor Co Ltdヤマハ発動機株式会社
    • SUMIOKA KOICHI
    • B41F15/40B41F15/08B41F33/14H05K3/34
    • H05K3/1233B41F15/0881B41F15/26B41F15/36B41F15/423B41F15/46B41F33/02B41P2215/112B41P2215/114B41P2215/50H05K3/3484H05K2203/1492H05K2203/163
    • PROBLEM TO BE SOLVED: To rationalize the solder residual quantity of a solder pool used for solder printing without generating the limitation of a substrate size and a tact loss. SOLUTION: In switching to backward printing from forward printing, while a squeegee 702 is positioned in the movement direction of just before the switching to a solder pool SP, that is, the downstream side in the backward direction, and the squeegee 702 is positioned at the opposite side (front side) of the orifice of a mask 51, the solder pool SP is detected. Therefore, even if the solder adhered to the squeegee 702 drips off during measuring the amount of solder, since the adhering position of solder is at an anti-orifice DM 2 of the mask 51, the constraint that the registration of the mask 51 and a substrate 1 or the like becomes unnecessary. Moreover, without moving the solder pool SP by the anti-orifice DM 2, the detection of the solder pool SP is performed only by switching the position of the squeegee 702 to the solder pool SP. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了使用于焊料印刷的焊料池的焊料剩余量合理化,而不会产生基板尺寸和触头损耗的限制。 解决方案:在从正向打印切换到向后打印时,当刮板702位于恰好在切换到焊池SP之前的移动方向上时,即向后方的下游侧,以及刮板702 位于掩模51的孔口的相对侧(前侧),检测焊料池SP。 因此,即使在测量焊料量期间粘附到刮板702上的焊料脱落,由于焊料的粘合位置处于掩模51的防孔DM2,因此限制掩模51和掩模 基板1等不需要。 此外,通过防止孔口DM2移动焊池SP,仅通过将刮板702的位置切换到焊料池SP来执行焊池SP的检测。 版权所有(C)2010,JPO&INPIT