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    • 5. 发明专利
    • Packing of polysilicon
    • 多晶硅包装
    • JP2014108829A
    • 2014-06-12
    • JP2013223951
    • 2013-10-29
    • Wacker Chemie Agワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG
    • HANS WOCHNER
    • B65D30/02B65B51/10B65D65/02B65D77/00
    • B65D33/00B29C65/222B29C65/38B29C65/7433B29C66/1122B29C66/43121B29C66/71B29C66/723B29C66/8122B29C66/9241B29C66/929B65B3/04B65D75/38B65D75/52B65D81/00B29K2827/18B29K2023/0633B29K2023/0625B29K2023/065B29K2023/06
    • PROBLEM TO BE SOLVED: To solve the problem in which: a sharp-edged silicon mass causes damage, for example, in the form of a penetrated and break-opened welding seam, since a bag filled with the polysilicon mass and manufactured from a commercial PE film having an unspecified characteristic is damaged in a transport process.SOLUTION: The present invention provides a bag including polysilicon, being welded, including at least one welding seam and formed of a PE film, that is, the bag in which the PE film has a thickness of 150-900 μm, has flexural rigidity of Fof 300-2000 mN and Fof 100-1300 mN, has destructive force F of 200-1500 N, fracture energy Ws of 2-30 J and penetration energy Wof 2.2-30 J determined by a kinetic penetration test, has film tensile stress of 9-50 MPa in the 15% longitudinal direction and a lateral directional elongation, has Elmendorf longitudinal directional film tearing-off resistance of 10-60cN and Elmendorf lateral directional film tearing-off resistance of 18-60cN, has a longitudinal directional film breakage point elongation of 300-2000%, has a lateral directional film breakage point elongation of 450-3000% and has welding seam strength of 25-150 N/15 mm. Also provided is a method for packing the polysilicon in a plastic bag by filling the polysilicon in and welding the bag to the plastic bag, that is, the method including bringing about a welding seam having welding seam strength of 25-150 N/15 mm, by executing welding by pulse sealing under contact point pressure of exceeding 0.01 N/mmby using a welding jaw.
    • 要解决的问题:为了解决这样一个问题,即:尖锐的硅质量会导致损伤,例如以穿透和断开的焊缝的形式,因为填充有多晶硅块并且由商业制造的袋 具有未指定特性的PE膜在运输过程中被破坏。解决方案:本发明提供一种包括多晶硅的袋,其被焊接,包括至少一个焊缝并由PE膜形成,即其中PE膜 具有150-900μm的厚度,抗弯刚度F为300-2000mN,F为100-1300mN,破坏力F为200-1500N,断裂能Ws为2-30J,穿透能量为2.2-30 J通过动力学穿透试验测定,在15%纵向和横向伸长率下具有9-50MPa的拉伸应力,具有10-60cN的Elmendorf纵向薄膜撕裂阻力和Elmendorf横向膜撕裂 抵抗力 18-60cN,纵向断膜点断裂伸长率在300〜2000%之间,侧向断面伸长率为450-3000%,焊缝强度为25-150 N / 15 mm。 还提供了一种通过将多晶硅填充并将袋焊接到塑料袋中来将多晶硅包装在塑料袋中的方法,即包括使焊缝强度为25-150N / 15mm的焊缝 通过使用焊接钳口在接触点压力超过0.01N / mm下通过脉冲密封进行焊接。