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1. 实用新型

KR20210000646U KR20210000646U - Mob cleaner 审中-公开
公开(公告)号：KR20210000646U
公开(公告)日：2021-03-17
申请号：KR2020190003742U
申请日：2019-09-09
申请人： 주식회사 리빙웰코리아
发明人： 권화숙
IPC分类号： A47L13/58 , A47L13/502 , B08B1/00 , B08B1/04 , B08B3/02
CPC分类号： A47L13/58 , A47L13/502 , B08B1/002 , B08B1/007 , B08B1/04 , B08B3/02
摘要： 물걸레 청소기가 개시된다. 본 고안의 물걸레 청소기는, 공간부가 마련된 본체; 물걸레 결합판, 물걸레 결합판의 하부에 결합되는 물걸레 부재 및 물걸레 결합판의 결합판 연결대에 결합되는 물걸레대가 구비된 물걸레부; 및 공간부에 마련되는 베이스 블록, 베이스 블록에 회전 가능하게 결합되는 회전 결합부, 베이스 블록과 연통되게 마련되어 물걸레 부재로 세척수를 분사하는 세척수 분사부 및 본체에 결합되어 물걸레 부재를 긁어서 세척하는 브러쉬부가 구비된 물걸레 세척부를 포함하고, 물걸레 결합판을 회전 결합부에 결합시킨 후 물걸레대를 본체의 방향으로 하강시키면 물걸레부에 마련된 회전 구동부의 구동에 의해 물걸레 결합판 및 물걸레 부재가 회전되어 브러쉬부에 의해 긁혀지면서 세척수 분사부에서 분사된 세척수에 의해 세척됨과 아울러 회전력에 의해 탈수되는 것을 특징으로 한다.

2. 发明专利

JP6372100B2 ワイパー装置および液体吐出装置审中-公开
公开(公告)号：JP6372100B2
公开(公告)日：2018-08-15
申请号：JP2014045990
申请日：2014-03-10
申请人：セイコーエプソン株式会社
发明人：宮澤久
IPC分类号： B41J2/165
CPC分类号： B41J2/16535 , B05B15/52 , B08B1/006 , B08B1/007 , B08B1/008 , B41J2/16538 , B41J2/16541 , B41J2/16544

3. 发明专利

JP2016027358A クリーニング装置、画像形成装置审中-公开
标题翻译：清洁装置和图像形成装置
公开(公告)号：JP2016027358A
公开(公告)日：2016-02-18
申请号：JP2014230491
申请日：2014-11-13
申请人：株式会社リコー
发明人：寺地一 , 岡本倫哉 , 二宮弘道 , 小嶋恒司 , 岩崎琢磨 , 唐澤信哉 , 澤田大亮 , 野寺健太郎 , 茂呂将典 , 田口信幸 , 後藤良太
IPC分类号： G03G15/14 , G03G21/00
CPC分类号： G03G21/0029 , B08B1/005 , B08B1/007 , B08B1/04 , G03G21/0076 , G03G21/0035 , G03G2215/1661
摘要：【課題】本発明では、被清掃部材表面上のトナー等をより効率的に清掃することのできるクリーニング装置を提供することを目的としている。【解決手段】回収羽根101は、感光体ドラム32に平行な回転軸101dを中心に、矢印Z方向に回転可能(表面移動可能)に構成され、シート形状の羽根部101aが、保持部101bの両面に取り付けられている。保持部101bは、その両端部に回収羽根101の回転方向Zの上流側へ伸びる突起部101cを有しており、両端が90度折れ曲がったS字の形をしている。回収羽根101の回転方向Zの上流方向へ伸びる突起部101cが、羽根部101aに遅れて仕切部材103に当接し、仕切部材103を押圧する。これにより、仕切部材103上のトナーを再度、搬送コイル102の側へ送り出す事ができる。【選択図】図3
摘要翻译：要解决的问题：提供一种可以更有效地去除清洁对象构件表面上的调色剂的清洁装置。解决方案：回收刀片101可以在旋转轴101d上沿箭头Z方向（可以使表面移动）旋转平行于感光鼓32，片状片部分101a分别安装在保持部分101b的两个表面上。保持部101b具有分别在其两端延伸到回收叶片101的旋转方向Z的上游侧的突出部101c，并且具有在两端折叠成90度的形状。在叶片部101a按压分隔构件103之后，在回收叶片101的旋转方向Z上延伸到上游方向的突出部101c与分隔构件103接触。利用这种构造，分隔构件 103可以再次发送到传送线圈102的侧面。选择图：图3

4. 发明专利

JP2011235259A Device for removing adhered substance 审中-公开
标题翻译：用于去除附着物质的装置
公开(公告)号：JP2011235259A
公开(公告)日：2011-11-24
申请号：JP2010110954
申请日：2010-05-13
申请人： Sawa Corporation , 株式会社サワーコーポレーション
发明人： OKAMOTO YOSHIHIRO , TAKEDA MITSUHIRO , KAWAMOTO SUGURU
IPC分类号： B08B11/00 , B08B1/02 , B08B3/02 , B08B7/04
CPC分类号： B08B7/0028 , B08B1/007 , B08B3/12 , B23K1/0016 , B23K1/018 , B23K3/0607 , B23K3/08 , B23K2201/42 , H05K3/3478
摘要： PROBLEM TO BE SOLVED: To provide an adhered substance-removing device in which adhered substances are removed from a wiping sheet used for wiping off the adhered substances such as solder, which spread over a surface of a metal mask plate, and the wiping sheet is reused several times.SOLUTION: The adhered substance-removing device includes a suction removal unit 50 configured to suck and remove a liquid medium with which a wiping sheet S is impregnated and adhered substances which is separated from the wiping sheet by an oscillation unit 40 and re-adhered to the surface of the wiping sheet S. The suction removal unit 50 includes a cylindrical suction nozzle 51 having suction holes 51a on the surface wound around by the wiping sheet S, and a suction pump 52 for sucking air in the suction nozzle 51. The suction pump 52 is connected to the suction nozzle 51, and a lid member is detachably attached to an opening of the suction nozzle.
摘要翻译：要解决的问题：提供一种粘附物质除去装置，其中从用于擦拭在金属掩模板的表面上扩散的诸如焊料的附着物质的擦拭片除去附着物质，擦拭纸被重复使用几次。粘附物质除去装置包括吸引除去单元50，该抽吸去除单元50吸收和除去通过振动单元40从擦拭片中分离出的擦拭纸S浸渍的液体介质和附着物质，并且重新吸附除去单元50包括：在由擦拭片S卷绕的表面上具有吸孔51a的圆筒形吸嘴51和用于吸入吸嘴51中的空气的抽吸泵52 抽吸泵52连接到吸嘴51，并且盖构件可拆卸地附接到吸嘴的开口。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011224017A System and method for molding food start material 有权
标题翻译：用于模制食物起始材料的系统和方法
公开(公告)号：JP2011224017A
公开(公告)日：2011-11-10
申请号：JP2011170992
申请日：2011-08-04
申请人： Stork Titan Bv , ストルクタイタンベスローテンフェンノートシャップ
发明人： MESKENDAHL DIRK , VAN DER EERDEN HENDRIKUS FRANCISCUS JACOBUS MARIA
IPC分类号： A22C7/00 , A21C11/04 , A23L1/00 , A23L1/48 , A23P1/10
CPC分类号： A23P1/105 , A22C7/0038 , A22C7/0069 , A23P30/10 , B08B1/007 , B08B1/04 , B08B3/02 , B08B3/10 , B08B9/46
摘要： PROBLEM TO BE SOLVED: To provide a system which is considered suitable for molding meat for, such as a hamburger, and also capable of improving convenience for use of other food start materials, such as, fish meat, potato and dough.SOLUTION: The system for molding three-dimensional products from a mass of one or more food starting materials suitable for human consumption, includes a production device having a frame, a mold member provided with at least one mold cavity, and mass feed means for feeding the mass to the one or more mold cavities of the mold member. The production device further includes a mold member cleaning device for cleaning the mold member, which is arranged so as to be apart from the production device and configured to receive the mold member removed from the production device.
摘要翻译：要解决的问题：提供一种被认为适合于用于模制汉堡的肉的系统，并且还能够提高使用其他食物起始材料如鱼肉，马铃薯和面团的便利性。解决方案：用于从适合人类消费的一种或多种食物起始材料的大量模制三维产品的系统包括具有框架的生产装置，设置有至少一个模腔的模具构件和大量进料用于将物料馈送到模具构件的一个或多个模腔的装置。生产装置还包括用于清洁模具构件的模具构件清洁装置，该模具构件被布置为远离制造装置并且构造成接收从制造装置移除的模具构件。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP4257367B2 Cleaning device of liquid material discharge apparatus 有权
公开(公告)号：JP4257367B2
公开(公告)日：2009-04-22
申请号：JP2007120201
申请日：2007-04-27
申请人：シャープ株式会社
发明人：格無類井
IPC分类号： B05C11/10 , B05C5/00 , B41J2/165
CPC分类号： B41J2/16544 , B08B1/00 , B08B1/007 , B41J2/16541 , G02B27/0006
摘要： A cleaning device (1) provided in a liquid material discharge device (40) has a blade (21) coming into contact with a discharge surface to remove ink adhering to the discharge surface, a roller (3) coming into contact with the blade (21) to remove the liquid material, which was removed from the discharge surface, from the blade (21), and a motor (8) for moving the blade (21) from a position at which the blade (21) comes into contact with the discharge surface to a position at which the blade (21) comes into contact with the roller (3). While the blade (21) is in contact with the roller (3), the roller (3) is in uniform contact with the blade (21). The cleaning device can highly reliably clean the discharge surface of the liquid material discharge device, does not damage the discharge surface during cleaning, and can achieve stable discharge performance.

7. 发明专利

JP2009516267A Card cleaning mechanism 审中-公开
公开(公告)号：JP2009516267A
公开(公告)日：2009-04-16
申请号：JP2008540350
申请日：2006-11-09
申请人：データカード・コーポレイシヨン
发明人：ビースクワイアーズ，マイロ , ジェイフリッチュ，ティモシー
IPC分类号： G06K17/00 , B65H5/00
CPC分类号： B08B7/0028 , B08B1/007
摘要：プラスチックカード基材の一方又は双方の側面に施す処理操作の前に、その側面をクリーニングするクリーニング機構。クリーニング機構は、第１クリーニングステーション上にあるクリーニングローラ及び第２クリーニングステーション上にあるクリーニングローラの２つのクリーニングローラが１つのクリーニングテープアセンブリによって同時にクリーニングされるように設計されている。

8. 发明专利

JP4248040B2 Rotary printing press of the printing mechanism 失效
公开(公告)号：JP4248040B2
公开(公告)日：2009-04-02
申请号：JP465898
申请日：1998-01-13
申请人：ハイデルベルガードルツクマシーネンアクチエンゲゼルシヤフトHeidelberger Druckmaschinen AG
发明人：ゼーフリートカール−ハインツ
IPC分类号： B41F35/06 , B08B1/00 , B08B1/04 , B41F35/00 , B41F35/02
CPC分类号： B08B1/04 , B08B1/007 , B41F35/00 , B41F35/006 , B41F35/02 , B41F35/06 , B41P2235/23

9. 发明专利

JP2006080138A Polishing device and polishing method of semiconductor wafer 审中-公开
标题翻译：抛光装置和抛光方法的SEMICONDUCTOR WAFER
公开(公告)号：JP2006080138A
公开(公告)日：2006-03-23
申请号：JP2004259692
申请日：2004-09-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ITOU FUMITAKA
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B08B1/007 , B08B3/02
摘要： PROBLEM TO BE SOLVED: To improve wafer yield by removing almost thoroughly the adhesive foreign matter in the wafer holder of a polishing head in CMP. SOLUTION: A polishing device is provided with a wafer holding fixture 4 for attaching a wafer, a polishing unit for polishing the wafer by supplying polishing slurry to the wafer, a wafer put-in/out unit for attaching/detaching the wafer to/from the wafer holding fixture 4, and a washing unit 7 for washing the wafer holding fixture 4. The wafer holding fixture 4 comprises a wafer contact surface 5 coming into contact with the rear face of the wafer, and a supporter 8 which prevents the wafer from running out. The washing unit 7 has a nozzle 9 for supplying washings to the wafer contact surface 5 and the supporter 8. The nozzle 9 consists of two or more discharge ports which supply at least two or more different fluids. Consequently, the adhesive foreign matter in the wafer holding fixture 4 is removed almost thoroughly so that it is always kept clean. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过在CMP中抛光头的晶片保持器中几乎完全去除粘合剂异物来提高晶片产量。解决方案：抛光装置设置有用于附接晶片的晶片保持固定装置4，用于通过向晶片供给抛光浆料来抛光晶片的抛光单元，用于附接/分离晶片的晶片放入/取出单元与晶片保持固定装置4连接的晶片保持固定装置4以及用于清洗晶片保持固定装置4的清洗单元7.晶片保持固定装置4包括与晶片的背面接触的晶片接触表面5和防止晶圆从跑出来。洗涤单元7具有用于向晶片接触表面5和支撑件8供应洗涤物的喷嘴9.喷嘴9由两个或更多个供应至少两种或更多种不同流体的排出口组成。因此，晶片保持固定装置4中的粘合剂异物几乎彻底地被去除，从而始终保持清洁。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006013185A Method of reproducing cleaning member for semiconductor device 审中-公开
标题翻译：再生半导体器件清洁元件的方法
公开(公告)号：JP2006013185A
公开(公告)日：2006-01-12
申请号：JP2004189255
申请日：2004-06-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ISHIZAKA HITOSHI , FUJII HIROFUMI , NAMIKAWA AKIRA , TERADA YOSHIO , MARUOKA NOBUAKI , UENDA DAISUKE
IPC分类号： H01L21/677 , B08B7/00 , H01L21/02 , H01L21/304
CPC分类号： B08B7/0028 , B08B1/007
摘要： PROBLEM TO BE SOLVED: To provide a method for reproducing a cleaning member for a semiconductor device with which particles stuck on the top layer of the used cleaning member are removed, and the surface state of the cleaning member similar to a new article is reproduced.
SOLUTION: In a method of reproducing a cleaning member for a semiconductor device, a cleaning layer 2 comprised of a heat resistant resin resulting from heat-curing polyamic acid is provided on at least one side of a wafer 1, and particles stuck on the top layer of the cleaning layer are removed using a dry etching system.
COPYRIGHT: (C)2006,JPO&NCIPI

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